• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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• pp.109-110
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• 2005

We have suggested sputtered W-C-N thin film for preventing thermal budget between semiconductor and metal. These results show that the W-C-N thin film has good thermal stability and low resistivity. In this study we newly suggested sputtered W-B-C-N thin diffusion barrier. In order to improve the characteristics, we examined the impurity behaviors as a function of nitrogen gas flow ratio. This thin film is able to prevent the interdiffusion during high temperature (700 to $1000^{\circ}C$) annealing process and has low resistivity ($\sim$200$\mu{\Omega}-cm$). Through the analysis of X-Ray diffraction, resistivity and XPS, we studied structure behavior of W-B-C-N diffusion barrier.

• 한국전기전자재료학회논문지
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• 제22권12호
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• pp.1028-1032
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• 2009

In this study, the influences of silicon-based gas barrier films fabricated by using a facing target sputtering(FTS) system on the gas permeability for flexible displays have been investigated. Under these optimum conditions on the $SiO_x$ film with oxygen concentration($O_2/Ar+O_2$) of 3.3% and the $SiO_xN_y$ film with nitrogen concentration($N_2/Ar+O_2+N_2$) of 30% deposited by the FTS system, it was found that the films were grown about 4 times higher deposition rate than that of the conventional sputtering system and showed high transmittance about 85% in the visible light range. Particularly, the polyethylene naphthalate(PEN) substrates with the $SiO_x$ and/or $SiO_xN_y$ films showed the enhanced properties of decreased water vapor transmission rate (WVTR) over $10^{-1}\;g/m^2{\cdot}day$ compared with the PEN substrate without any gas barrier films, which was due to high packing density in the Si-based films with high plasma density by FTS process and/or the denser chemical structure of Si-N bond in the $SiO_xN_y$ film.

• 한국전기전자재료학회논문지
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• 제30권3호
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• pp.170-174
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• 2017

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

• 월간포장계
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• 통권84호
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• pp.158-161
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• 2000

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.1151-1154
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• 2003

Ultraviolet rays, OH H O radical and $O_3$ produced by the streamer discharge in water are widely used to deactivate microorganisms and remove organic contaminants in water and the dominant factor of these decomposition is the oxidized reaction of hydrogen peroxide and dissolved $O_3$ in water. In this paper, the barrier discharge was used to create plasma in a gas, liquid and solid medium and the electrode with the reactor combined barrier with packed type(BPR) was made as noncontact way against water so that the effect of water characteristic change by the erosion of electrodes exposing in water should be minimized. The active radical and $O_3$ gas generated in plasma region were reacted into the water as electrode so that at the same time a dissolved $O_3$ and hydrogen peroxide were formed in water and The change of pH and conductivity were measured.

• 한국정밀공학회지
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• 제30권8호
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• pp.802-808
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• 2013

Thermal barrier coating (TBC) is used to protect substrates and extend the operating life of gas turbines in power plant and aeronautical applications. The major causes of failure of such coatings is spallation, which results from thermal stress due to a thermal expansion coefficient mismatch between the top coating and the bond coating layers. In this paper, the effects of the material properties and the thickness of the top coating layer on thermal stresses were evaluated using the finite element method and the equation for the thermal expansion coefficient mismatch stress. In addition, we investigated a design technique for the top coating whereby thermal resistance is exploited.

• 한국전기전자재료학회논문지
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• 제22권5호
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• pp.425-430
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• 2009

$ZrO_2$ film was deposited by facing target sputtering (FTS) system on polyethylene naphthalate (PEN) substrate as a gas barrier layer for flexible organic light emitting devices (FOLEDs), In order to control the heat of the FTS system caused by the ion bombardment in the cathode compared with the conventional sputtering system, the process characteristics of the FTS apparatus are investigated under various sputtering conditions such as the distance between two targets ($d_{TT}$), the distance between the target and the substrate ($d_{TS}$), and the deposition time. The $ZrO_2$ film by the FTS system can reduce the damage on the films because the ion bombardment with high-energy particles like gamma-electrons, Moreover, the $ZrO_2$ film with optimized condition ($d_{TT}$=140 mm) as a function of the distance from center to edge showed a very uniform thickness below 5 % for a deposition time of 3 hours, which can improve the interface property between the anode and the plastics substrate for flexible displays, It is concluded that the $ZrO_2$ film prepared by the FTS system can be applied as a gas barrier layer or an interlayer between the anode and the plastic substrate with good properties of an uniform thickness and a low deposition-temperature.

• Elastomers and Composites
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• 제46권1호
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• pp.22-28
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• 2011

전기의 흐름을 막는 절연재료는 다양한 전기/전력기구에서 도체에 흐르는 전기를 차단하면서 도체와 외부를 분리/지지하는데 사용한다. 절연재료에는 유리, 절연유, 가스, 종이, 고분자가 있으며 현재는 주로 고분자 절연재료가 전선에 사용된다. 최근 환경규제 및 친환경 소재로의 변화에 따라 고분자 절연재료에 사용되는 물질들도 친환경 화하고 있다.

• Geomechanics and Engineering
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• 제27권6호
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• pp.583-594
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• 2021

The gas permeability behavior of unsaturated bentonite-based materials is of major importance for ensuring effective sealing of high-level radwaste repositories. This study investigated this by taking a sample of Granular Bentonite Material (GBM) at the end of the Engineered Barrier Emplacement (EB) experiment in the Opalinus Clay, placing it under different humidity conditions until it achieved equilibration, and testing the change in the gas permeability under loading and unloading. Environmental humidity is shown to have a significant effect on the water content, saturation, porosity and dry density of GBM and to affect its gas permeability. Higher sensitivity to confining pressure is exhibited by samples equilibrated at higher relative humidity (RH). It should be noted that for the sample at RH=98%, when the confining pressure is raised from 1 MPa to 6 MPa, gas permeability can be reduced from 10^-16 m² to 10^-19 m², which is close to the requirements of gas tightness. Due to higher water content and easier compressibility, samples equilibrated under higher RH show greater irreversibility during the loading and unloading process. The effective gas permeability of highly saturated samples can be increased by 2-3 orders of magnitude after 105℃ drying. In addition, cracks possibly occurred during the dehydration and drying process will become the main channel for gas migration, which will greatly affect the sealing performance of GBM.