• Title/Summary/Keyword: full integration

검색결과 276건 처리시간 0.031초

Successful ERP Operations: Process Integration Perspectives and an Agent-Based Support System

  • Park, Kwangho
    • 한국산학기술학회:학술대회논문집
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    • 한국산학기술학회 2003년도 Proceeding
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    • pp.19-27
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    • 2003
  • Any ERP system pushes a company toward full process integration and solves the fragmentation of information. However, the tight process integration can propagate and magnify mistakes made in one department into the other departments in real time. Thus, it can be posited that a central support system for the coordination can help ERP users and administrators dig out problems, take care of tedious validation and verification, and maintain process integration of ERP with great consistency. This paper ,proposes an agent-based ERP operations support system (EOSS) that aims at achieving and maintaining process integration of ERP at the highest level possible. With EOSS, the process integrity is monitored, with anomalies prevented as early as possible and repaired as precisely as possible.

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Missing Pattern Analysis of the GOCI-I Optical Satellite Image Data

  • Jeon, Ho-Kun;Cho, Hong Yeon
    • Ocean and Polar Research
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    • 제44권2호
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    • pp.179-190
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    • 2022
  • Data missing in optical satellite images caused by natural variations have been a crucial barrier in observing the status of marine surfaces. Although there have been many attempts to fill the gaps of non-observation, there is little research to analyze the ratio of missing grids to overall sea grids and their seasonal patterns. This report introduces the method of quantifying the distribution of missing points and then shows how the missing points have spatial correlation and seasonal trends. Both temporal and spatial integration methods are compared to assess the effectiveness of reducing missing data. The temporal integration shows more outstanding performance than the spatial integration. Moran's I and K-function with statistical hypothesis testing show that missing grids are clustered and there is a non-random distribution from daily integration. The result of the seasonality test for Moran's I through a periodogram shows dependency on full-year, half-year, and quarter-year periods respectively. These analysis results can be used to deduce appropriate integration periods with permissible estimation errors.

비행 전구간 유도제어 HILS 기법을 적용한 구동제어 알고리즘 성능 평가 연구 (Performance Evaluation for Several Control Algorithms of the Actuating System Using G/C HILS Technique)

  • 전완수;조현진;이만형
    • 한국정밀공학회지
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    • 제13권9호
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    • pp.114-129
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    • 1996
  • This paper describes the whole development phase for the underwater vehicle actuating system with high hydroload torque disturbance. This includes requirement analysis, system modeling, control algorithm design, real time implementation, test and performance evaluations. As for driving control algorithms, fuzzy logic, variable structure and PD(Proportional-Differential) algorithm were designed and implemented on board controller using a single chip microprocessor. Intel 8797. And test and performance evaluation is carried out both single test and wystem integration test. We could confirm the basic performance of actuating system through the single test and gereral developing work of any actuating systems was finished with a single performance test of actuating system without system integration test. But, we suggested that system integration test be needed. System integration test is carried out using G/C HILS(Guidance and Control Hardware-In-the -Loop Simulation) which is constituted flight motion simulator, load simulator, real time host computer and the related subsystems such as inertial navigation system, power supply system and Guidance and Control Computer etc.. The most important practical contribution of this paper is that full system characteristics such as minimal control effort, enhancement of guidance and autopilot performance by the actuating system using G/C HILS technique are investigated. Through full running G/C HILS, in spite of the passing to single tests, some control algorithm resulted in failure as to stability of full system and system time frame.

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A Full Inorganic Electroluminescent Microdisplay

  • Smirnov, A.;Labunov, V.;Lazarouk, S.
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.1075-1080
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    • 2003
  • Design and fabrication process of a full inorganic electroluminescent microdislay based on aluminum / nanostructured porous silicon reverse biased light emitting Schottky diodes are discussing. Being of a solid state construction. this micro-display is cost-effective, thin and light in weight due to very simple device architecture. Its benefits include also super high resolution, wide viewing angles, fast response time and wide operating temperature range. The advantages of full integration of a LED-array and driving circuitry onto a Si-chip will be also discussed.

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Full HD TV를 위한 효율적인 VDP SoC 구조 (Effective SoC Architecture of a VDP for full HD TVs)

  • 김지훈;김영철
    • 스마트미디어저널
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    • 제1권1호
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    • pp.1-9
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    • 2012
  • 본 논문에서는 Full HD TV를 위한 화질 개선 VDP( Video Display Processor)의 SoC( System on a Chip) 구현을 위한 효율적인 하드웨어 구조를 제안한다. 제안한 구조는 SoC 설계의 한 방법으로써 효율적인 버스 구조와 유연성 있는 인터페이스를 지원하여 실시간 비디오 처리를 가능하게 한다. VDP를 구성 하고 있는 비디오 IP 들은 고화질 영상 제공 및 화질 개선을 위한 목적으로 설계 되었고, 각각의 IP는 실시간성 보장 및 SoC의 하드웨어 통합을 위해서 Avalon 인터페이스가 사용되었다. 이는 설계시간을 단축하고, IP 검증과 특히 SoC를 구성하는데 있어서 IP 추가 삭제 및 변경 등이 용이함으로써 사용자의 편리성을 높여준다. 또한 SoC의 임베디드 소프트웨어는 실시간으로 비디오 세부 항목 설정 및 데이터 전송 방식 설정 등을 제어할 수 있음으로써 유연성 있는 실시간 처리 시스템을 구현할 수 있다. VDP의 SoC 구현은 CyclonIII SoPC(System on a Programmable Chip) 플랫폼 상에서 구현되었으며, 실험 결과 SD 해상도의 입력 영상을 Full HD 해상도로 변환시킴으로써 고화질 영상을 획득 할 수 있다.

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다중(multiple) TSV-to-TSV의 임피던스 해석 (The Impedance Analysis of Multiple TSV-to-TSV)

  • 이시현
    • 전자공학회논문지
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    • 제53권7호
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    • pp.131-137
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    • 2016
  • 본 논문에서는 기존의 2D IC의 성능을 개선하고 3D IC의 집적도와 전기적인 특성을 개선하기 위한 목적으로 연구되고 있는 TSV (Through Silicon Via)의 임피던스를 해석하였다. 향후 Full-chip 3D IC 시스템 설계에서 TSV는 매우 중요한 기술이며, 높은 집적도와 광대역폭 시스템 설계를 위해서 TSV에 대한 전기적인 특성에 관한 연구가 매우 중요하다. 따라서 본 연구에서는 Full-chip 3D IC를 설계하기 위한 목적으로 다중 TSV-to-TSV에서 거리와 주파수에 따른 TSV의 임피던스 영향을 해석하였다. 또한 이 연구 결과는 Full-chip 3D IC를 제조하기 위한 반도체 공정과 설계 툴에 적용할 수 있다.