• Resources Recycling
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• v.10 no.6
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• pp.3-8
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• 2001

This study was examed about leaching behavior in order to separate plasticizer selectively before dechlorination from flexible PVC material in alkali solutions at $80~120^{\circ}C$. The dechlorination of that was not almost occurred below $100^{\circ}C$. But the yield of elution of plasticizer was 100% above 5M NaOH. Therefore, by controlling alkali concentration and reaction temperature, it is possible to extract the plasticizer selectively without taking dechlorination.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.12
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• pp.771-775
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• 2015

In this paper, we designed and fabricated low cost imprinting process for micro patterning on FCCL (flexible copper clad laminate). Compared to conventional imprinting process, developed fabrication method processing imprint and UV photolithography step simultaneously and it does not require resin etch process and it can also reduce the fabrication cost and processing time. Based on proposed method, patterns with $10{\mu}m$ linewidth are fabricated on $180mm{\times}180mm$ FCCL. Compared to conventional methods using LDI (laser direct imaging) equipment that showed minimum line with $10{\sim}20{\mu}m$, proposed method shows comparable pattern resolution with very competitive price and shorter processing time. In terms of mass production, it can be applied to fabrication of large-area low cost applications including FPCB.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.444-445
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• 2006

We prepared ZnO:Al thin films under various sputtering conditions by using facing targets sputtering (FTS) method. ZnO:Al thin films were deposited on polyethersulfon (PES) substrate which is the thickness of 200um at room temperature. the electrical, optical and crystallographic properties of ZnO:Al were investigated. From the results, prepared alll ZnO:Al thin films showed (002) diffraction peaks. ZnO:Al thin film with a resistivity of $8.4{\times}10^{-4}{\Omega}cm$ and a transmittance of over 80% in visible range was obtained.

• Advances in Computational Design
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• v.7 no.4
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• pp.371-393
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• 2022

This paper presents a three-dimensional flexible pavement simulated in ANSYS subjected to moving vehicular load on the surface of the pavement typical for the road section in Nepal. The adopted finite element (FE) model of pavement is validated with the classical theoretical formulations for half-space pavement. The validated model is further utilized to understand the damping and dynamic response of the pavement. Transient analysis of the developed FE model is done to understand the time varying response of the pavement under a moving vehicle. The material properties of pavement considered in the analysis is taken from typical road section used in Nepal. The response quantities of pavement with nonlinear viscoelastic asphalt layer are found significantly higher compared to the elastic pavement counterpart. The structural responses of the pavement decrease with increase in the vehicle speed due to less contact time between the tires of the vehicle and the road pavement.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.32-39
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• 2015

With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP) has been recently considered as a competitive bonding material. The ESP material is composed of solder powder and epoxy formulation which can remove oxide layers on the surface of solder powder and pad finish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electrical short between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding. ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With the mentioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly of flexible electronics and electronic modules in automotive vehicles.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.25-28
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• 2000

In this paper, three types of organic electroluminescent devices(OELD) were fabricated on mechanically flexible plastic substrate by using vacuum deposition method. The devices consist of a hole transporting material such as TPD, a light-emitting material such as Alq$\sub$3/ and an electron transporting material, blocking material such as PBD. Electrical and optical properties of these OELDs were measured. This paper shows that organic small molecules based on OELD can be successfully deposited on a flexible plastic substrate. This points open the potential for low cost mass production of flexib]e displays, including roll to roll processing.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.234-235
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• 2005

True electronic paper displays are being enabled by the development of two core technologies - plastic electronics for display backplanes and electrophoretic ink for use as the imaging layer. Electrophoretic ink developed by E Ink Corporation continues to advance performance along with parallel technology breakthroughs in flexible TFT backplanes. An overview of these advances in the ink imaging material will be discussed with special emphasis of the expected impact on the emerging flexible display applications.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.237.2-237.2
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• 2005

• Polymer Science and Technology
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• v.21 no.3
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• pp.247-250
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• 2010

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.413-413
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• 2009

Silicon nanowires (Si NWs)-based top-gate field-effect transistors (FETs) are constructed by using Si NWs transferred onto flexible plastic substrates. Si NWs are obtained from the silicon wafers using photolithography and anisotropic etching process, and transferred onto flexible plastic substrates. To evaluate the electrical performance of the silicon nanowires, we examined the output and transfer characteristics of a top-gate field-effect transistor with a channel composed of a silicon nanowire selected from the nanowires on the plastic substrate. From these FETs, a field-effect mobility and transconductance are evaluated to be $47\;cm^2/Vs$ and 272 nS, respectively.