• Journal of Information Display
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• v.10 no.4
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• pp.202-205
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• 2009

An automated circuit repair system was developed for enhancing the yield of nondefective liquid crystal panels, focusing on the resist patterns on the circuit material layer of thin-film transistor (TFT) substrates prior to etching. The developed system has an advantage over the parallel conventional system: In the former, the repair conditions depend on the type of resist whereas in the latter, the repair parameters must be fine-tuned for each circuit material. The developed system consists of a resist pattern defect inspection system and a pattern repair system for short and open defects. The repair system performs fine corrections of abnormal areas of the resist pattern. The open-repair system is equipped with a syringe to dispense resist. To maintain a stable resist diameter, a thermal insulator was installed in the syringe system. As a result, the diameter of the dispensed resist became much more stable than when no thermal insulator was used. The resist diameter was kept within the target of $400{\pm}100{\mu}m$. Furthermore, a prototype system was constructed, and using a dummy pattern, it was confirmed that the system worked automatically and correctly.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.5
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• pp.97-103
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• 2007

A novel selective metallization process to fabricate the fine conductive line based on inkjet printing has been investigated. Recently, Inkjet printing has been widely used in flat panel display, electronic circuits, biochips and bioMEMS because direct inkjet printing is an alternative and cost-effective technology for patterning and fabricating objects directly from design without masks. The photosensitive etching resist used in this process is an organic polymer which becomes solidified when exposed to ultraviolet lights and has high viscosity at ambient temperature. A piezoelectric-driven inkjet printhead is used to dispense 20-30 ${\mu}m$ diameter droplets onto the copper substrate to prevent subsequent etching. Repeatability of circuitry fabrication is closely related to the formation of steady droplets, adhesion between etching resist and copper substrate. Therefore, the ability to form small and stable droplets and surface topography of the copper surface and chemical attack must be taken into consideration for fine and precise patterns. In this study, factors affecting the pattern formation such as adhesion strength, etching mechanism, UV curing have been investigated. As a result, microscale copper patterns with tens of urn high have been fabricated.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.296-296
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• 2012

LCD panel 검사를 위한 Probe unit은 대형 TV 및 모바일용 스마트폰을 중심으로 각광을 받고 있는 소모성 부품으로 최근 pitch의 미세패턴화가 급속히 진행되고 있다. 본 연구에서는 Slit Wafer 제작 공정을 최적화하기 위해 25 um pitch의 마스크를 설계, 제작하였다. 단공과 장공을 staggered 형태로 배열하여 25 um/25 um line/space pitch로 설계하였다. 또한 단위실험을 위해 직접 25 um pitch로 설계하여, 동일한 실험조건을 적용하여 최적 조건을 찾고자 하였다. 반응변수는 Etch rate 및 profile angle로 결정하였으며, 약 200~400 um 에칭된 slit의 상단과 하단의 폭, 그리고 식각깊이를 SEM 측정사진을 통해 정한 후 etch rate 및 profile angle을 결정하였다. 인자는 식각속도 및 wall의 각도를 결정하는 식각 및 passivation 가스의 유량, chamber 압력(etching/passivation), 식각시간 등으로 정하였으며, 이들의 최대값과 최소값 2 수준으로 실험계획을 설계하였다. 식각 조건에 따라 8회의 실험을 수행하였다. 가스의 유량은 SF6 400 sccm, C4F8 400 sccm, 식각 싸이클 시간은 5.2~10.4 sec, passivation 싸이클시간 4 sec로 하였으며, 압력은 식각시 7.5 Pa, passivation 시 10 Pa로 할 경우가 가장 sharp하게 나타났다. Coil power 와 platen power는 각각 2.6 KW, 0.14 KW로 하였으며, 최적화를 위한 인자의 값들은 이 범위에서 조절하였다. 이러한 인자의 조건 조절을 통해 etch rate는 5.6 um/min~6.4 um/min, $88.9{\sim}89.1^{\circ}$의 profile angle을 얻을 수 있었다.

• Transactions of the Korean Society of Automotive Engineers
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• v.5 no.6
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• pp.64-76
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• 1997

This paper deals with development of brackets by using aluminum alloy sheets which is indispensable for weight reduction of autobody. The press formability of aluminum alloy sheet is estimated by means of tensile test, V bending test, sample manufacturing test and photograph of microstructure. The results show that the elongation, strength, work hardening exponent, plastic anisotropy coefficient of Al 6***series are better than those of Al 5***series, but for general press formability, Al 5***series are better than Al 6***series due to lower yield strength. Since most of mechanical properties of aluminum sheet are generally inferior to those of cold-rolled steel sheet, shape fixability and press formability of aluminum sheet are very poor. For making components of autobody by use of die for steel sheet application, it is essential that die should be nodified for least bending and stretching. With the modified die for aluminum, it could be possible to make brackets, the component of autobody. Microstructure of Al 5***series has fine grain and small the 2nd phase and that of Al 6***series has relatively coarse grain. Therefore, it seems that fine grain and small the 2nd phase of Al 5***series is one of the factor of lower yield strength, resistance to stamping work, formation of Luder's line.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.19 no.4
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• pp.553-561
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• 2010

In flat panel display or semiconductor industries, they install the equipments with fine line width and high throughput for fabrication and inspection. The equipments are required to have the linear stage which can position the work-piece with high speed, fine resolution on wide range of motion. In this paper, a precision planar linear XY stage is proposed. The stage has a symmetric planar window configuration and is guided by air-bearings on granite plate. The symmetric planar window configuration makes the stage has robustness against dynamic and thermal disturbances. The air-bearings let the stage move smooth on straight guide bar and flat granite surface. The stage is actuated by linear motor with Halbach magnet array (HMA). HMA generates more confined magnetic flux than conventional array. The linear motors are optimized by using sequential quadratic programming (SQP) with the several constraints that are thermal dissipation, required power, force ripple and so on. The planar linear XY stage with the symmetric planar configuration and the linear motors is implemented and then the performance such as force ripple, resolution and stroke are evaluated.

• Journal of ILASS-Korea
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• v.9 no.4
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• pp.17-23
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• 2004

Spray characteristics of a twin-hole air shrouded nonle designed for gasoline injectors was investigated by using laser diffraction particle analyzer (LDPA) and tomography reconstruction- A confined spray chamber which is optically accessible through a pair of glass windows was made to simulate the fuel injection condition in intake manifold of gasoline engine. The measurement was applied to the twin hole injector with and without an air shroud. It demonstrates that for the case with an air shroud, fine atomization is achieved and there exists a large number of fine droplets between the region of the main spray streams, which conforms with the spray visualization. The drop size distribution was investigated as a function of elapse time after fuel injection. The distribution was greatly affected by the measurement position from the injector exit. Also, the spatially resolved spray volume fraction and Sauter Mean Diameter (SMD) from line-of-sight data of the LDPA are tomographically reconstructed by Convolution Fourier transformation under the steady injection condition.

• Journal of the Korean Physical Society
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• v.73 no.9
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• pp.1279-1282
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• 2018

This paper reports the deposition of a metal line using a multilayer stack and laser-induced forward transfer (LIFT) using a low cost continuous wave blue laser with a wavelength of 450 nm. The donor structure was composed of a light-to-heat (LTH) layer, a release layer, and a transfer layer in series. Amorphous silicon as the LTH layer absorbs photon energy and converts it to heat. A release layer was melted so that a silver transfer layer would be transferred to the receiver substrate. The transferred silver layer showed reasonable physical and electrical characteristics. A low cost fine linewidth metal layer could be achieved using this modified LIFT technique and blue laser.

• Journal of the Korean Society of Industry Convergence
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• v.24 no.5
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• pp.525-530
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• 2021

The purpose of this study was to investigate the effect of spherodizing heat treatment holding time on the microstructure and mechanical properties of the accelerated cooling-treated API X70 steel, which is mainly used as a structural material for line pipe steel for natural gas pipes. The accelerated cooling-treated API X70 steel was spherodizing treated at 700℃ for 12~48 h. The microstructure was observed using an OM and a FEG-SEM, and mechanical properties were obtained by tensile test. The microstructure of the API X70 steel was banded in the hot rolling direction, and the polygonal ferrite(PF) adjacent to pearlite(P) has mainly a fine size, and coarse PF and fine acicular ferrite were formed in the middle of P and P. As the spherodizing treatment time increased, the number of carbide particles decreased and its distribution interval increased, and the ferrite grain size was coarsened. The tensile strength decreased and the ductility increased with spherodizing treatment time, and the yield point elongation was disappeared in a stress-strain curve after the spherodizing treatment.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.

• Journal of Fashion Business
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• v.16 no.5
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• pp.57-73
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• 2012

The main objective of this research was to understand the characteristics of pleats design through the analysis of modern female fashion as they appear in the 'Collections' from '09 A/W to '12 S/S. Data collection of 1027 was done through the review of 'pr$\hat{e}$t-$\grave{a}$-porter Collections' of three cities; Milan, New York, Paris. Along with the qualitative interpretation of pleats design, statistical analysis of frequency and ${\chi}^2$-test were completed for data analysis. The main findings were as follows; 1. The five types of pleats design were founded in the order of accordion, knife, box, inverted, and sunburst pleats. The frequency and ratio of pleats design occurency showed significant difference between collections. 2. There were significant difference between the types of pleats and their line characteristics of thickness, continuity, length, direction. = Thin fabrics with delicate fine folds were mainly appeared in accordion and sunburst pleats. On the other hand, midium thickness fabrics were used for knife, box & inverted pleats, however, the different images were projected according to the width and the number of folds, characteristics of fabrics and textures. = In all the type of pleats but sunburst, continuity line was appeared the most. The discontinuous lines were appeared the most in the layered types and, sometimes, at some construction lines to add some decorative details or design variations. = The long line were the most frequently appeared in long one-pieces or long skirts of knife, accordion, sunburst pleats. While, the shorter lines showed the most frequently in box and inverted pleats, which mainly used for skirts or the lower part of one-piece. = For the line directions, the vertical lines were the most frequently appeared, and followed by mixed and diagonal line. In mixed or diagonal lines, same type of pleat was repeated in one design. For diagonal lines, one direction was mainly used, however, the symmetrical arrangements or repeated diagonal pleats in various directions also used. In mixed lines, the type of one or two diagonal and one vertical line was the most frequently appeared.