• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.50-50
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• 2007

We report the effect of the film thickness on electrical properties of Ti(N) film resistors. The applications of titanium nitride thin film resistor in $\Pi$-type attenuators are also characterized. As film thickness decreases from 100 to 30 nm, temperature coefficient of resistance significantly decreases from -60 to -148 ppm/K, while sheet resistance increases from 37 to $270\;{\Omega}/{\square}$. The characterizations of 20dB-attenuators using thin film resistors are improved in comparison with those using thick film resistors. The $\Pi$-type attenuators using Ti(N) thin film resistors exhibit a attenuation of -19.94 dB and voltage standing wave ratio of 1.16 at a frequency of 2.7 GHz.

• Corrosion Science and Technology
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• v.10 no.4
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• pp.125-130
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• 2011

This study was performed to improve the corrosion resistance and the stability of passive film on copper tube by potentiostatic polarization method in synthetic tap water. Formation of passive film was carried out by anodic potentiostatic polarization at various passivation potentials and passivation times in 0.1 M NaOH solution. Stability of passive film and corrosion resistance was evaluated by self-activation time, ${\tau}_0$ from passive state to active state on open-circuit state in 0.1 M NaOH solution. Addition of polyphosphate in NaOH solution prolonged the self-activation time and improved the corrosion resistance, and the addition of 5 ppm polyphosphate was most effective. It was also observed that better corrosion resistance was obtained by potentiostatic polarization at 1.0 V (vs. SCE) than at any other passivation potentials. Passivated copper tube showed perfect corrosion resistance for the immersion test in synthetic tap water showing that the anodic potentiostatic polarization treatment in 0.1 M NaOH with 5 ppm polyphosphate solution would be effective in improving the corrosion resistance and preventing the blue water problem.

• Journal of Surface Science and Engineering
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• v.57 no.3
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• pp.201-207
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• 2024

This study compared the chemical resistance properties according to various sealing treatment methods for the anode film formed during the anodization process of Al6061 alloy. Al6061 aluminum was used in four different sealing treatment methods: boiling water sealing, lithium sealing, nickel sealing, and pressurized sealing, and each sample was evaluated for corrosion resistance through a 5% HCl bubble test and the microstructure was observed through a scanning electron microscope(SEM). According to the results, corrosion resistance increased as time and temperature increased in all sealing treatment methods. Relatively, corrosion resistance was high in the order of boiling water sealing, lithium sealing, nickel sealing, and pressure sealing, and the best corrosion resistance was found in pressure sealing. These research results can be helpful in selecting a process necessary to improve the efficiency and performance of anodizing process in the industrial field using aluminum alloys.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.5
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• pp.218-227
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• 2021

A thick film NTC thermistor for low temperature co-firing was manufactured by printing and sintering a paste prepared using NTC powder of Mn_1.5Ni_0.4Co_0.9Cu_0.4O₄ composition, lead free frit, and RuO₂ on a 96 % alumina substrate. The effect of frit and RuO₂ on the electrical properties of thick film NTC thermistor was studied. The resistance of the thick film NTC thermistor was higher than that of the bulk phase sintered at the same temperature, but it was found that the negative resistance temperature characteristic appeared more clearly and linearly in the resistance - temperature characteristic. On the other hand, the area resistance decreased as the sintering temperature increased, and the area resistance increased as the amount of frit added increased. The B constant of the thick film NTC thermistor was 3000 K or higher. Among them, it was found that the B constant of the thick film NTC thermistor made of paste with 5 wt% of frit added and sintered at 900℃ showed the highest B constant. Also, it can be seen that the area resistance decreased with the addition of RuO₂, and the change in the area resistance decrease of the thick film NTC thermistor obtained by sintering the paste containing 5 wt% of RuO₂ at 900℃ is the most obvious.

• Journal of the Korean Ceramic Society
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• v.28 no.6
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• pp.437-442
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• 1991

Temperature and atmosphere dependence of electrical conduction of the metal Cu, Ag, Au films, vaccum evaporated on glass, was investigated. The structural changes of the metal films were examined by SEM and high temperature XRD. The electrical resistance slightly increased with initial temperature increase up to the inflection point and decreased to minimum value, after this rapidly increased with further temperature increased below minimum. These phenomena were caused by the thermally induced film failure as a result of the mass transport. The temperature for the film failure increased in the order of O2, Air, Vacuum, N2, Ar in Cu, Ag films and Air, Vacuum, N2, Ar in Au film. The increase of resistance at the lower temperature range was attributed to the lattice distortion by disordered crystal structure, while the decreasing resistance was attributed to the removal of structural defects and film densification.

• Journal of the Korean Vacuum Society
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• v.4 no.S2
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• pp.30-33
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• 1995

By using X-ray double crystal diffraction technique the multilayer structure composed of glass membrane, platinum film and $\alpha Al_2O_3$ substrate has been studied. It is found the stress is produced in the film by thermal mismatch within multilayer materials. The measuring results of thin film platinum resistors show that the stress were induce resistance change of device and different stress status will produce add resistance in different direction. Selecting proper glass material can make opposite stress in Pt film and opposite add resistance due to thermal mismatch. The reliability of Pt resistor has been improved with method of this stress compensation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.4
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• pp.328-335
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• 2001

In this work, we made the precision thin film resistors of NiCr alloy (74wt%Ni-f18wt%Cr-4wt%Al-4wt%Cu) using DC/RF magnetron sputtering method and studied the sheet resistance and TCR(Temperature Coefficient of Resistance) etc... of the Ni-Cr-Al-Cu alloy thin film according to the change by annealing treatment to 400$\^{C}$ in air and nitrogen atmosphere and the change(power, pressure, substrate temperature) of sputtering process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.605-608
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• 1999

We report investigations on a Pentacene thin film as a component for active layer of Organic thin film transistors. Pentacene film was deposited by Organic Molecular Beam Deposition(OMBD) and Al electrode was deposoted by vacuum evaporation. Electrical characterization of Pentacene films were measured by the three-terminal contact resistance methods, as the results contact resistance between pentacene films and the Aluminium electrode is 5.064G$\Omega$. The Al contact with the pentacene shows the bottom contact resistance. From the current-voltage characteristics, electrical conductivity of the Pentacene film is found as ~ 10$^{-4}$ /cm. physical characterization of pentacene films were measured by UV-spectrum and Cyclic-Voltammetry method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.4
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• pp.352-356
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• 2007

The Ni/Cr/Al/Cu (51/41/4/4 wt%) thin films were deposited by using DC magnetron sputtering method for the application of the resistors having low TCR (temperature coefficients of resistance) and high resistivity from the former printed-results[3]. The TCR values measured on the as-deposited thin film resistors were less than ${\pm}10\;ppm/^{\circ}C$ and $-6{\sim}+1\;ppm/^{\circ}C$ after annealing and packaging process. The TCR values were $-3{\sim}1\;ppm/^{\circ}C$ (ratio of variation : about 0.02 %) and $-30{\sim}20\;ppm/^{\circ}C$ (ratio of variation : about $0.5{\sim}1\;%$) for the thermal cycling and PCT (pressure cooker test), respectively. It was confirmed that the reliability properties of the thin film resistor were good for electronic components.

• Journal of the Korean Ceramic Society
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• v.51 no.4
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• pp.344-349
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• 2014

$RuO_2$-based high frequency thick-film resistor paste was printed at the speed of 10, 100, 300 mm/sec on the AlN substrate, and then sintered at between 750 and $900^{\circ}C$. The sintered thick films were characterized in terms of printing and sintering conditions. With increasing printing speed, the thickness and roughness of sintered film increased. The resistance of the thick film resistor was reduced by increasing the printing speed from 10 to 100 mm/sec, but did not significantly change at 300 mm/sec speed. With increasing sintering temperature, the surface roughness and thickness of sintered resistor film decreased. The reduction rate was large in case of fast printed resistor. The resistance of the resistor increased up to $800^{\circ}C$ with sintering temperature, but again decreased at the higher sintering temperature.