• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.597-601
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• 1996

Nowadays, the STL format, industrial standard data, which approximates three dimensional CAD model to triangular facets, is used for RP(Rapid Prototyping) system. Because most RP machine is accpted to only two dimensional line segments, but some STL translators are sometimes poorly implemented. The error verifying process is as follows. 1) Remove facets with two or more vertices equal to each other. 2) Fix overlapping error such as more than three facets adjacent to an edge. 3) Fill holes in the mesh by using Delaunay triangulation method. 4) Repair wrong direction and value of normal vectors. This paper is concerned with searching the mentioned errors in advance and modifying them.

• Korean Journal of Optics and Photonics
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• v.2 no.2
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• pp.96-102
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• 1991

Monitoring the surface profile real time on the manufacturing line of planar products has been accomplished by employing the scattering of a laser light. The laser beam was focused onto the surface and the direction of the reflected beam was utilized to obtain the slope of the surface facet. By taking data fast enough, it was possible to obtain the microscopic surface structure. The mean roughness thus obtained agreed well with the ones found with the mechanical stylus instrument. There was discrepancy between the two results as to the number of peaks per com. A simple model based on the deconvolution of the raw data was found adequate to improve the agreement to an acceptable level.

• Journal of the Korean Geographical Society
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• v.43 no.6
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• pp.775-790
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• 2008

This study shows possibility of active fault, throughout analyzing distributional features of tectonic and fluvial geomorphology and mineral composition of fault fracture clay, at Jinbu fault-line system in Pyeongchang-gun, Gangwon Province. Fault-line valley was formed remarkably in the upper reaches of Odae River and upper reaches of Yeongok River according along Jinbu fault-line. Landforms show rectilineal distribution at right shore slopes of Odae River in Ganpyeong-ri, southern zone of Jinbu fault-line system, related to the tectonic processes, such as triangular facet, kernbut, kerncol and alluvial fan. Fault fracture clay zones were developed at 5 outcrops($jbf1{\sim}5$), located in kerncol. Particularly, jbf1 fault outcrop, developed at granite saprolite, has obvious fault plane and fault clay composed of illite and laumontite. The Jinbu Fault-line along jbf4-2-3-5 may be formed by regional compressive stress, and jbf1 fault may be suggested a tributary fault of the Jinbu fault-line formed before the late Pleistocene. The vertical displacement of the east and west blocks of the Jinbu Fault-line is estimated in $0.024{\sim}0.027m/ka$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.339-339
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• 2010

Photo-assisted wet chemical etching of GaN thin film was studied using KOH based solutions. A $2{\mu}m-2{\mu}m$ titanium line-and-space pattern was used as a etching mask. It is found that the etching characteristics of the GaN thin film is strongly dependent on the pattern direction by unisotropic property of KOH based solution. When the pattern was aligned to the [$11\bar{2}0$] directions, ($10\bar{1}n$)-facet is revealed constructing V-shaped sidewalls.

• Journal of the Korean Society for Precision Engineering
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• v.12 no.11
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• pp.140-147
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• 1995

This paper deals with conversion from the STL file to the Slice to the Slice cross-sectional information for Stereolithography. The STL file is widely used for Stereolithography, but it is very difficult to convert STL file into Slice file directly. Because it consists of an ordered list of triangular net without any topological information other than the orientation of each facet. So, The system is accomplished by data flow through several intermediate stages such as Reference. SL1. .SL2L. .SL3. and .SLC file. The data processing is performed in 5 steps: 1) Create a Reference file including common information. 2) Modify STL file within the effective range of SL machine. 3) Calculate a point of intersection between plane equation and line equation. 4) Sort z values in ascending order using quick sort algorithm. 5) Search the adjacent points and formulate a closed loop usingsingly linked linear list. The system is developed by using Borland C++ 3.1 compiler in the environment of Pentium PC, and verified to be satisfactory by making some prototypes of electric household appliances.

• Journal of Korea Multimedia Society
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• v.13 no.5
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• pp.651-662
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• 2010

This paper describes a method to identify objects for autonomous navigation of an outdoor mobile robot. To identify objects, the robot recognizes the object from an image taken by moving robot on outdoor environment. As a beginning, this paper presents the candidates for a segment of region to building of artificial object, sky and trees of natural objects. Then we define their characteristics individually. In the process, we segment the regions of the objects included by preprocessing using multiple features. Multiple features are HSI, line segments, context information, hue co-occurrence matrix, principal components and vanishing point. An analysis of building identifies the geometrical properties of building facet such as wall region, windows and entrance. The building as intersection in vertical and horizontal line segment of vanishing point extracts the mesh. The wall region of building detect by merging the mesh of the neighbor parallelograms that have similar colors. The property estimates the number of story and rooms in the same floors by merging skewed parallelograms of the same color. We accomplish the result of image segmentation using multiple features and the geometrical properties analysis of object through experiments.

• Clinics in Shoulder and Elbow
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• v.10 no.2
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• pp.199-203
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• 2007

Purpose: It is very important to evaluate and fix coronoid process fractures because they are a critical element for a stable, effective elbow function. The lateral view of the elbow joint is used for a radiographic evaluation of the coronoid but an understanding of the fracture pattern is often difficult because of overlap of the radial head and obliquity of the fracture line. We developed the coronoid view, which is a new radiograph for an evaluation of the coronoid process fracture, and discuss its advantages for a postoperative follow-up. Materials and Methods: The coronoid view was designed for an evaluation of the anteromedial fragment of the coronoid process. After the patient sat on his side, the shoulder was abducted $45^{\circ}$ and the elbow was flexed $90^{\circ}$. The X-ray beam was shot perpendicular to the table. Since shoulder was abducted $45^{\circ}$ the fracture line of the coronoid process can be parallel to the X-ray beam, and the radial head can be cleared. Conclusion: The coronoid view can be a good alternative radiograph for an evaluation of a coronoid process fracture because the beam is parallel to the fracture line. The coronoid view can be particularly useful in postoperative patient follow-up where computed tomography is impractical due to metal implants and cost.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.173-173
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• 2010

Recently, a patterned sapphire substrate (PSS) has been intensively used as one of the effective ways to reduce the dislocation density for the III-nitride epitaxial layers aiming for the application of high-performance, especially high-brightness, light-emitting diodes (LEDs). In this paper, we analyze the growth kinetics of the atoms and crystalline quality for the undopped-GaN depending on the facets of the pattern fabricated on a sapphire substrate. The effects of the PSS on the device characteristics of InGaN/GaN LEDs were also investigated. Several GaN samples were grown on the PSS under the different growth conditions. And the undoped-GaN layer was grown on a planar sapphire substrate as a reference. For the (002) plane of the undoped-GaN layer, as an example, the line-width broadening of the x-ray diffraction (XRD) spectrum on a planar sapphire substrate is 216.0 arcsec which is significantly narrower than that of 277.2 arcsec for the PSS. However, the line-width broadening for the (102) plane on the planar sapphire substrate (363.6 arcsec) is larger than that for the PSS (309.6 arcsec). Even though the growth parameters such as growth temperature, growth time, and pressure were systematically changed, this kind of trend in the line-width broadening of XRD spectrum was similar. The emission wavelength of the undoped-GaN layer on the PSS was red-shifted by 5.7 nm from that of the conventional LEDs (364.1 nm) under the same growth conditions. In addition, the intensity for the GaN layer on the PSS was three times larger than that of the planar case. The spatial variation in the emission wavelength of the undoped-GaN layer on the PSS was statistically ${\pm}0.5\;nm$ obtained from the photoluminescence mapping results throughout the whole wafer. These results will be discussed in terms of the mixed dislocation depending on the facets and the period of the patterns.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• ETRI Journal
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• v.38 no.5
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• pp.981-987
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• 2016

We present a cost-effective dual polarization quadrature phase-shift coherent receiver module using a silica planar lightwave circuit (PLC) hybrid assembly. Two polarization beam splitters and two $90^{\circ}$ optical hybrids are monolithically integrated in one silica PLC chip with an index contrast of $2%-{\Delta}$. Two four-channel spot-size converter integrated waveguide-photodetector (PD) arrays are bonded on PD carriers for transverse-electric/transverse-magnetic polarization, and butt-coupled to a polished facet of the PLC using a simple chip-to-chip bonding method. Instead of a ceramic sub-mount, a low-cost printed circuit board is applied in the module. A stepped CuW block is used to dissipate the heat generated from trans-impedance amplifiers and to vertically align RF transmission lines. The fabricated coherent receiver shows a 3-dB bandwidth of 26 GHz and a common mode rejection ratio of 16 dB at 22 GHz for a local oscillator optical input. A bit error rate of $8.3{\times}10^{-11}$ is achieved at a 112-Gbps back-to-back transmission with off-line digital signal processing.