• 한국결정성장학회지
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• 제10권6호
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• pp.373-377
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• 2000

승화 성장법으로 성장된 6H-SiC 단결정에 대하여 etching을 행하여 형성된 etch pit의 형상과 결함과의 관계에 대하여 고찰하였다. (0001) 기저면에서는 육각형의 전형적인 etch pit이 형성되었다. micropipe에 의해서도 유사한 형태의 pit이 형성되었으며, 면결함에 형성된 etch pits을 통하여 SiC 결정의 내부에 형성된 planar defects도 성장 결정과 동일한 구조를 가지면서 형성됨을 알 수 있었다.

• 한국결정성장학회지
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• 제22권6호
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• pp.261-264
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• 2012

본 연구에서는 HVPE법으로 사파이어 기판(0001) 위에 성장시킨 GaN epilayer의 etching에 따른 표면변화 특성을 조사하였다. 주사전자 현미경(SEM) 관찰 결과, 3가지 형태를 갖는 육각형 모양의 etch pit(edge, screw, mixed) 들이 GaN epilayer의 두께 변화에 따라서 형성되었다. 이러한 관통전위들은(TDs) epilayer의 두께가 얇고, etch pit density가 높을수록 screw and mixed type TDs이 많이 관찰되었고, 두께가 증가할수록 etch pit density가 낮아지면서 edge and mixed type TDs들이 주로 존재하는 것을 관찰 할 수 있었다.

• Corrosion Science and Technology
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• 제10권1호
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• pp.37-42
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• 2011

Aluminum was electrochemically etched in acid solution and the surface area was magnified by the formation of etch pits. Etched aluminum was covered with a compact and dense dielectric oxide film by anodization and applied to the aluminum electrolytic capacitor electrode. Capacitance of aluminum electrolytic capacitor is closely related with surface area, which depends on size and number of etch pits. Size of etch pits need to be controlled because inside of the pits can be buried by the formation of dielectric oxide film. In this work, the effect of ultrasound pretreatment on the aluminum etch pit formation and capacitance were investigated. Additionally, the relationship between the second etching effect on pit size and capacitance was studied.

• 한국표면공학회지
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• 제30권1호
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• pp.44-56
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• 1997

Influence of electrochemical etching conditions on capacitance gain of aluminium electrolytic on capacitor foil has been investigated by etching cubic textured high purity aluminum foil in dilute hydrochloric acid. Uniformly distributed etch pit tunnels on aluminum surface have been obtained by pretreatment aluminium foil in 10% NaOH solution for 5 minutes followed by electrochemical etching. Electrostatic capacitance of etched aluminium foil anodized to high voltage increased with the increase of current density, total charge, temperature and concentration of electrolyte up to maximum CV-value and then deceased. Election optical observation of the etched foil revealed that the density of etch of etch pits increased with the increase of current density and concentration of electrolyte. this increase of etch pit density enlarged of the increase of capacitance. However, abnormal high current density and high electrolyte concentration induced the local dissolution of the foil surface which resulted the decrease of foil capacitance.

• 한국재료학회지
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• 제10권5호
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• pp.369-374
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• 2000

전해콘텐서용 알루미늄박의 직류에칭에서 1M 염산욕에 부식억제제로 1M 황산을 첨가했을 때의 영향을 조사하기 위하여 에치 피트의 밀도, 에치 터널의 길이와 직경, 정전 용량 등의 변화를 분석하였다. 황산이온은 부식억제제로서 염소이온보다 시료의 표면에서 에치 피트의 밀도를 증가시키며 에치 터널의 직경은 감소하나 길이를 증가시킴으로써 전체적으로 표면적이 커지고 또한 정전 용량 값이 증가하였다. 황산이온을 첨가하였을 경우 전류 밀도가 $0.9A/\textrm{cm}^2$ 보다 낮은 경우에는 정전 용량 값이 작지만 그 이상에서는 정전용량이 현저하게 증가하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.407-408
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• 2005

High surface area electrodes for aluminum electrolytic capacitors are produced by AC electrochemical processes. Optimization of crystallographic etch pit growth on aluminium during AC etching of cathode film for aluminium as electrolytic capacitor has been established. In this work, we present the observations of pit distributions by galvanostatic measurements. The effects of electrolyte concentration, current density, frequency, various pre-treatments and etching time have been studied. The specimen was pretreated in 0.5M NaOH and 1M HCl at $40\sim60^{\circ}C$, and transferred into a cell containing 1M HCl, then various mol $H_2SO_4$ etchant was added. Pit size distributions were determined with scanning electron microscopy (SEM).

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.223.1-223.1
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• 2013

Since sapphire single crystal is one of the materials that have excellent mechanical and optical properties, the single crystal is widely used in various fields, and the demand for the use of substrate of LED devices is increasing rapidly. However, crystal defects such as dislocations and stacking faults worsen the properties of the single crystal intensely. When sapphire wafer of single crystal is used as LED substrate, especially, crystal defects have a strong influence on the characteristics of a film deposited on the wafer. In such a case quantitative assessment of the defects is essential, and the evaluation technique is now becoming one of the most important factors in commercialization of sapphire wafer. Wet etching is comparatively easy and accurate method to estimate dislocation density of single crystal because etching reaction primarily takes place where dislocations reached crystal surface which are chemically weak points, and produces etch pit. In the present study, the formation behavior of etch pits and etching time dependence were studied systematically. Etch pit density(EPD) analysis using optical microscope was also conducted and measurement uncertainty of EPD was studied to confirm the reliability of the results. EPDs and measurement uncertainties for 4 inch sapphire wafers were analyzed in terms of 5 and 21 points EPD readings. EPDs and measurement uncertainties in terms of 5 points readings for 4 inch wafers were compared by 2 organizations. We found that the average EPD value in terms of 5 points readings for a 4 inch sapphire wafer may represent the EPD value of the wafer.

• 한국결정성장학회지
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• 제7권4호
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• pp.560-566
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• 1997

Seeded vapor transport법에 의해 성장된 ZnSe 결정내에서 전위거동을 살펴보았다. (111)과 (100) ZnSe wafer의 etch pit 형상을 관찰하였고 성장된 결정이 높은 전위밀도를 가지면 전위들이 lineage와 cellular 두 가지 형태로 배열됨을 알았다. Seed로부터 측방성장된 부위에서 전위밀도의 변화는 없었으나 수직 성장방향으로는 전위밀도가 감소하였고, 같은 wafer내에서 전위밀도는 wafer center 지역의 전위밀도가 edge부위의 전위밀도 보다 낮았다. 성장된 결정의 평균 전위밀도는 $4{\times}10^4 /\textrm{cm}^2$이었다.

• 한국전기전자재료학회논문지
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• 제24권10호
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• pp.779-783
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• 2011

The morphology of etch pits in commercial 4H-SiC epi-wafer were investigated by molten-KOH etching. The etching process was optimized in $525{\sim}570^{\circ}C$ at 2~10 min and the novel type of etch pits was revealed. This type of etch pits have been considered as TED (threading edge dislocation) II, its origin and nature, however, are not reported yet. In this work, the morphology and evolution of etch pits during epitaxial growth were analyzed and the different behavior between TED and TEDII was discussed.

• 한국결정성장학회지
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• 제8권3호
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• pp.454-462
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• 1998

AUC 침전과정중 AUC 입차를 둥글게 제조하는 조건과 기구를 조사하였다. 둥근 AUC 제조는 교반기를 이용한 내부순환 시는 불가능했으나 펌프를 사용한 외부순환 시는 가능했다. 둥근 AUC 제조속도($dn_p$/dt)는 침전조건인 슬러리 밀도($M_t:U/l)$, 슬러리 회전율($T_o$:turn-over ratio), 임펠러 속도(U:Impelle tip velocity)에 비례하여 관계식을 $ dn_p/dt{\propto}M_t{\cdot}T_o{\cdot}U^2$로 표기할 수 있었으며, 이 속도식은 실험결과와 정성적으로 일치하였다. 그리고 두 개의 둥근 AUC 제조 기구가 제시되었는데, 하나는 균일형성기구이고 다른 하나는 etch-pit 형성기구이다. 전자는 AUC 침전과정에서 초기에 발생되고 후자는 침전과정 말기에 발생되는 것으로 확인되었다.