• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.228-228
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• 2008

본 논문에서는 epoxy bonding film의 phenoxy resin의 함량변화에 따른 특성 변화에 대하여 연구하였다. epoxy bonding film은 미세패턴 구현을 위해서 사용되는 기판재료로써 epoxy, hardener, silica, phenoxy resin 등이 첨가되어진다. phenoxy resin 함량을 변화를 주면서 tape casting 방법을 통해서 flim 형성을 한 후, 제작된 film의 phenoxy resin 함량변화에 따른 조도 특성의 연구를 위해서 sweller, desmear 공정을 후 RA(Roughness Average)를 측정하고, SEM으로 표면을 관찰하였다. 또한 제작된 bonding film을 가열 가압 후 구리 도금공정을 거쳐 peel strength를 측정하였다. phenoxy resin 함량이 증가 할수록 RA가 증가되어지는 것이 관찰되어졌고, 또 한 peel strength 증가하였다.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2009.11a
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• pp.55-59
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• 2009

The epoxy resin without hardener can harden by a ring-opening reaction in the presence of the alkalies produced by the hydration of cement in epoxy-modified mortars and concretes. This paper investigates the effect of curing conditions on the strength improvement of polymer-modified mortars using bisphenol A-type epoxy resin without hardener. The polymer-modified mortars using epoxy resin are prepared with various polymer-cement ratios, and subjected to ideal, water, dry and heat cures. In the heat cure, the epoxy-modified mortars are sealed or unsealed with a PVDC (polyvinylidene chloride) film. The epoxy-modified mortars are tested for flexural and compressive strengths at desired curing methods. The microstructures of the epoxy-modified mortars are also observed by scanning electron microscope. The effects of curing conditions on the strength development of the epoxy-modified mortars are examined. From the test results, the marked effectiveness of the heat cure under the PVDC film sealing against the development of the strength of the epoxy-modified mortar without the hardener is recognized. The flexural and compressive strengths of 7-day-90℃ heat-cured, PVDC film-sealed epoxy-modified mortars without hardener reach 7 to 17MPa and 24 to 44MPa respectively, and are two to three times of Unmodified mortar. Such high strength development of the epoxy-modified mortars may be achieved by the dense microstructure formation by cement hydrates and the hardening of the epoxy resin in the mortars.

• Korean Journal of Materials Research
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• v.9 no.1
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• pp.65-72
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• 1999

In order to minimize flexible printed circuit(FPC), which is used in computer, communication, medical facility, aviation space industry, it is required to improve the interfacial adhesion of polymide/epoxy or polyimide/polyimide consists of FPC. In this study, it was considered to improve the adhesion strength of polyimide/epoxy joint by introducing functional group on polyimide film and improving mechanical property of epoxy. Functional group on polyimide film was introduced by changing polyimide film surface to polyamic acid in KOH aqueous solution. The optimum conditions for surface modification were the concentration of 1M KOH and treatment time of 5min. Also, the optimum adhesion strength of polyimide/epoxy joint was obtained using rubber modified epoxy and polyamic acid as a base resin and curing agent of epoxy adhesive, respectively. The degree of surface modification of polyimide film examined with contact angle measurement of FTIR, thus modification of polyimide to polyamic acid was identified. Fracture surface of plymide/epoxy joint was analyzed by scanning electron microscopy, and modified polyamic acid reimidezed to polymide as increasing curing temperature.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2014.11a
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• pp.61-62
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• 2014

To evaluate anti-corrosion performance of high-frequency arc metal spray film in accordance with metal type and epoxy sealing coat application status, electrochemical impedance spectroscopy(EIS) method was conducted in this study. As a result, in case of applying Al-Mg alloy metal spray film, it showed the best polarization resistance. In case of applying epoxy sealing coat, it showed increased polarization resistance of arc metal spray film. Through this experiment, it is judged that Al-Mg alloy arc metal spray film with epoxy sealing coat can increase the biggest anti-corrosion performance of high-frequency arc metal spray film on steel.

• Bulletin of the Korean Chemical Society
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• v.23 no.4
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• pp.587-592
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• 2002

Photocrosslinkable chalcone-epoxy compound comprising 1,3-bis-(4-hydroxy-phenyl)-propenone was synthe-sized for fabricating the photo-alignment layer of liquid crystals. Chalcone group was introduced into the main chain unit of the epoxy oligomer. We observed a photodimerization behavior and an optical anisotropy of this material by irradiation of a linearly polarized UV(LP-UV) light. With a trace amount of cationic photoinitiator (TRS-HFA), polymerization of epoxy groups was also conducted at the similar wavelength range used for photodimerization. Linearly polarized UV irradiation on the chalcone-epoxy films with cationic photoinitiator induced optical anisotropy of the film and the resultant film can be used for alignment layers for low molecular weight nematic liquid crystals.

• International Journal of Ocean System Engineering
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• v.3 no.2
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• pp.102-110
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• 2013

The purpose of this study was to improve the properties of epoxy resin using titanium oxide nanoparticles. The effects of particle weight fraction, dispersion agent, and curing agents with different molecular weights on the thermal and mechanical properties of titanium-oxide-reinforced epoxy resin were investigated. In addition, the effect of the particle dispersion condition on the mechanical properties of nanocomposites was studied. As a result, it was found that the glass transition temperature of film-shaped nanocomposites decreased with an in-crease in the nanoparticle content. Because nanoparticles interrupted the cross linkage between the epoxy resin and the amine curing agent, the cross-link density of the epoxy became lower and led to a decrease in $T_g$ in the nanocompo-sites. The tensile strength and modulus in film-shaped nanocomposites also increased with the particles content. But in the case of dog-bone-shaped nanocomposites, the values were not similar to the trend for the film-shaped nanocompo-sites. This was probably a result of the different nanoparticles dispersions in the epoxy resins resulting from the respective-thicknesses of the film and dog-bone-shaped samples.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.254-258
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• 2007

A novel cure sensor based on the side-polished single mode fiber has been proposed and demonstrated. Two different UV curable epoxies were used to verify the feasibility of the side-polished single mode fiber as a high sensitivity cure sensor. The volume change of the epoxy by UV curing results in a corresponding change of the refractive index. The sensor can be used to monitor the curing process, the refractive index variation and the volume change of epoxy in real time during the UV curing process. In addition, small birefringence of the epoxy film can be detected using the sensor.

• Journal of the Semiconductor & Display Technology
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• v.14 no.1
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• pp.1-5
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• 2015

This paper deals with the residual stresses developed in an epoxy film deposited on Si wafer. First, chemically induced residual stresses due to the volumetric shrinkage in cross-linking resins during polymerization are treated. The curvature measurement method is employed to investigate the residual stresses. Then, thermally induced stresses are investigated along the interface between the epoxy film and Si wafer. The boundary element method is employed to investigate the whole stresses in the film. The singular stress is observed near the interface corner. Such residual stresses are large enough to initiate interface delamination to relieve the residual stresses.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.20 no.1
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• pp.35-40
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• 2007

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.4
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• pp.388-394
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• 2008

For purpose of anti-static film remaining unchanged in the condition of $160^{\circ}C$, organic solvent, acid and base solution $0.01\sim0.03{\mu}m$ particles of Sb doped tin oxide(ATO) were grafted by 3-Glycidyloxypropyltrimethoxysilane(GPTS) for improving interfere bonding force between ATO and epoxy resin. The particles were dispersed in 2-methoxyethanol with YD-I28(Bisphenol A type epoxy resin, Kukdo chemical) and 1-imidazole as hardener. The anti-static solutions were coated on PI film as thickness of $0.1{\mu}m$. Surface resistivity of anti-static film containing conductive polymer became $10^{12}\Omega/\Box$ after 32 hours in $160^{\circ}C$. The surface resistivity of ATO grafted by GPTS / Epoxy coating layer remained as $10^{7.6}\Omega/\Box$ in $160^{\circ}C$ for 7 days. ATO grafted by GPTS / Epoxy coating layer coated on PI film was dipped in acetone for 7 days. The surface resistivity remained unchanged as $10^{7.6}\Omega/\Box$. The anti-static layer dipped in water solutions containing each KOH 10 wt % and $H_2SO_4$ 2 wt% was ultra-sonicated for 10 minutes per once until 30th. The surface resistance of anti-static layer containing ATO grafted by GPTS remained unchanged.