Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지
DOI QR코드

DOI QR Code

Synthesis of Poly(epoxy-imide)-Nano Silica Hybrid Film via CS Sol-gel Process and Their Dielectric Properties

CS졸을 이용한 Poly(epoxy-imide)-나노 Silica 하이브리드 필름의 합성과 유전특성

  • 한세원 (한국전기연구원 재료응용연구단) ;
  • 한동희 (한국전기연구원 재료응용연구단) ;
  • 강동필 (한국전기연구원 재료응용연구단) ;
  • 강영택 (한국전기연구원 재료응용연구단)
  • Published : 2007.01.01
Download PDF
⟨ Previous Next ⟩

Abstract

The new PEI(poly(epoxy-imide))-nano Silica film has been synthesized via in situ CS sol process, and the chemical bonding and microstructure of nano silica dispersed in resin were examined by FT-IR, TAG and SEM. The dielectric properties of these hybrid films over a given temperature and frequency ranges have been studied in a point of view of stable chemical bonding of nano Silica filler. The results from IR spectra and SEM photograph indicated that PEI-Silica hybrid film prepared with nano CS sol process has been synthesized in uniform and chemical bonding. The decrease property of dielectric constant with CS content, tangent loss consistent of given frequency and temperature has been explained in terms of the chain movement of polymer through chemical bonging and size effect of nano silica. The new PEI-CS sol hybrid film with such stable chemical and dielectric properties was expected to be used as a high functional coating application in ET, IT and electric power products.

Keywords

References

  1. T. Tanaka, 'Polymer nanocomposites as dielectrics and electrical insulation perspectives for processing technologies, material characterization and future applications', IEEE Transaction on Dielectrics and Electrical Insulation, Vol. 11, No.5, p. 763, 2004 https://doi.org/10.1109/TDEI.2004.1349782
  2. K. Suzuki, K. Murouchi, and Y. Magari, 'New heat resistance magnet wire Polyimiede-Silica Hybrid enameled wire', Hitachi Cable Rewiew, Vol. 20, p. 91, 2001
  3. G. Abraham, S. Packirisamy, K Adhinarayanan, A. G. Reby, and R. Ramaswamy, 'Epoxyimide resins from N-(4- and 3-carboxyphenyl) trimellitimides', Journal of Applied Polymer Science, Vol. 78, p. 1792, 2000
  4. S. H. Kim, D. W. Lee, K. H. Chung, J. K. Park, andJ. Y. Jaung, 'Improvement in the adhesion of Polyimide/Epoxy joints using various curing agents', Applied Polymer Sceince, Vol. 86, p. 812, 2002 https://doi.org/10.1002/app.10771
  5. D. P. Kang, H. Y. Park, M. S. Ahn, I. H. Myung, J. H. Choi, and H. J. Kim, 'Properties of sol-gel materials synthesized from colloidal silica and alkoxysilane containing epoxysilane', J. Koreaa Ind. Eng. Chem., Vol. 16, No.6, p. 822, 2005
  6. D. Fragiadakes, 'Polyimide/silica nano composites with low values of dielectric permittivity', Journal of Physics, Conference Series, Vol. 10, p. 139, 2005 https://doi.org/10.1088/1742-6596/10/1/034
  7. J. Zhang, 'Characterization and dielectric property of polyimide-silica' composite films prepared via sol-gel and thermal imidization process', Journal of Materials Science, Letter, Vol. 40, p. 2623, 2005 https://doi.org/10.1007/s10853-005-2090-9
  8. G. M. Odegard, 'Modeling of the mechanical properties of nanopartide/polymer composites', Polymer, Vol. 46, p. 553, 2005 https://doi.org/10.1016/j.polymer.2004.11.022
  9. M. Roy, 'Polymer nanocomposite dielectrics The role of the interface', IEEE Transaction on Dielectrics and Electrical Insulation, Vol. 12, No.4, p. 629, 2005 https://doi.org/10.1109/TDEI.2005.1511089
  10. B. W. Kim, 'Characteristics of polyimide silica hybrid materials prepared from alkoxide precussor using sol gel process', Journal of the Korean Ceramic Society, Vol. 39, No. 11, p. 1063, 2002 https://doi.org/10.4191/KCERS.2002.39.11.1063