• 제목/요약/키워드: embedded inductor

검색결과 44건 처리시간 0.026초

LTCC 내장형 미세 라인 인덕터 구현을 위한 감광성 Ag Paste 조성에 관한 연구 (Study on the Compositions of Photosensitive Ag Paste for Patterning Embedded Fine-Line Inductor in LTCC)

  • 이상명;박성대;유명재;이우성;강남기;남산
    • 한국세라믹학회지
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    • 제44권3호
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    • pp.157-161
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    • 2007
  • Line width under $100\;{\mu}m$ with good resolution is difficult to achieve using conventional thick-film process utilizing screen printing method. However combined with lithography technology finer line and space for miniaturization and highly integrated package is achievable. In this study, photosensitive Ag paste of optimum formulation used for thick film lithography technology was fabricated by various Ag powder, glass powder and additives. As the result, line width of $30\;{\mu}m$ with good definition and reduced mismatch during co-firing with LTCC substrate was acquired. Formulated Ag paste was used to pattern embedded fine line inductor with over 90% yield.

A New Planar Spiral Inductor with Multi-layered Bragg Reflector for Si-Based RFIC's

  • Mai Linh;Lee Jae-Young;Le Minh-Tuan;Pham Van-Su;Yoon Gi-Wan
    • Journal of information and communication convergence engineering
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    • 제4권2호
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    • pp.88-91
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    • 2006
  • In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

A New Planar Spiral Inductor with Multi-layered Bragg Reflector for Si-Based RF IC's

  • Linh Mai;Lee Jae-Young;Tuan Le Minh;Su Pham Van;Yoon Gi-Wan
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2006년도 춘계종합학술대회
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    • pp.255-258
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    • 2006
  • In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the $S_{11}-parameter$ of the inductor.

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An Embedded Wide-Band Spiral Inductor for 10 Gb/s Optical Transceiver Applications

  • Kwon, Young-Mi;Kim, Dong-Churl;Shim, Jong-In
    • Journal of the Optical Society of Korea
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    • 제12권1호
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    • pp.49-51
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    • 2008
  • The wide-band spiral inductor to be monolithically integrated on the AlN substrate as a choking inductor for a compact 10 Gb/s optical transmitter applications is investigated. In order to reduce the parasitic capacitance limiting the choking bandwidth, the AlN substrate is partially etched away, which is analyzed by using an equivalent circuit model. The measured $S_{21}$ transmission response of the fabricated inductor is suppressed as low as -10 dB in the frequency range of 5 to 16 GHz.

고집적화를 위한 PCB에 내장된 인덕터의 제작 (The fabrication of the embedded inductor in the PCB for high integration)

  • 윤석출;송일종;남광우;심동하;송인상;이연승;김학선
    • 한국전자파학회:학술대회논문집
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    • 한국전자파학회 2003년도 종합학술발표회 논문집 Vol.13 No.1
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    • pp.178-182
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    • 2003
  • This paper presents the embedded inductors in PCB (Printed Circuit Board) for PAM(Power Amplifier Module) of mobile terminations. The inductors are designed, simulated, and compared to conventional chip inductors. The Quality factor(Q) and self-resonance frequency(SRF) of the inductors are evaluated. The quality factors of the inductors are two times higher than those of the chip inductors, and the self-resonance frequency is 1.3 times higher than those of chip inductors at the inductance of 2.7 nH and 3.3 nH respectively.

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MCM-C 모듈내에서의 내층형 저항의 거동 해석 (The analysis of the behavior of embedded resistor in MCM-C modules)

  • 유찬세;이우성;박종철;김진완
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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    • pp.764-767
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    • 2003
  • Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

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MCM-C 모듈내에서의 내층형 저항의 거동 해석 (The analysis of the behavior of embedded resistor in MCM-C modules)

  • 유찬세;이우성;박종철;김진완
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.599-602
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    • 2004
  • Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

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유기 패키지 기판내에 내장된 LC 다이플렉서 회로 (Fully Embedded LC Diplexer Passive Circuit into an Organic Package Substrate)

  • 이환희;박재영;이한성;윤상근
    • 한국공작기계학회논문집
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    • 제16권6호
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    • pp.201-204
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    • 2007
  • In this paper, fully embedded and miniaturized diplexer device has been developed and characterized for dual-band/mode CDMA handset applications. The size of the embedded diplexer is significantly reduced by embedding high Q circular spiral inductors and high DK MIM capacitors into a low cost organic package substrate. The fabricated diplexer has insertion losses and isolations of -0.5 and -23 dB at 824-894 MHz and -0.7 and -22 dB at 1850-1990 MHz, respectively. Its size is $3.9mm{\times}3.9mm{\times}0.77mm$. The fabricated diplexer is the smallest one which is fully embedded into a low cost organic package substrate.

구조 변화에 따른 LTCC 매립형 인덕터 등가모델 연구 (Study of the equivalent circuit model on LTCC embedded inductors)

  • 오창훈;신동욱;이규복;김종규;윤일구
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집 Vol.3 No.2
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    • pp.678-681
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    • 2002
  • In this paper, Characterization for several 3-D embedded passive elements with different structures was performed. The equivalent circuit optimization for embedded inductor was performed by HSPICE simulation software. After extracting each parameter values, the difference of parameter from each structure was examined. From this work, effective characterization of passive devices with similar structure will be possible.

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