• Journal of Information Processing Systems
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• 제8권1호
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• pp.101-118
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• 2012

Embedded products are becoming richer in features. Simulation tools facilitate low-costs and the efficient development of embedded systems. SID is an open source simulation software that includes a library of components for modeling hardware and software components. SID components were originally written using C/C++ and Tcl/Tk. Tcl/Tk has mainly been used for GUI simulation in the SID system. However, Tcl/Tk components are hampered by low performance, and GUI development using Tcl/Tk also has poor flexibility. Therefore, it would be desirable to use a more advanced programming language, such as Java, to provide simulations of cutting-edge products with rich graphics. Here, we describe the development of the Java Bridge Module as a middleware that will enable the use of Java Components in SID. We also extended the low-level SID API to Java. In addition, we have added classes that contain default implementations of the API. These classes are intended to ensure the compatibility and simplicity of SID components in Java.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2002년도 ICCAS
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• pp.68.4-68
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• 2002

$\textbullet$ This report presents an implementation a set of reusable software components which use of fault-tolerance embedded controller for railway signalling systems. These components can be used in real-time applications without application reprogramming. $\textbullet$ This library runs under VxWorks operating system and is oriented on real-time embedded systems. The library includes fault detection, fault containment, checkpointing and recovery components. $\textbullet$ The library enables to support high-speed response to fault occurrence in application software. Garbage collector together with VxWorks Watchdog provides both dead tasks detection and useless resources removing to avoid an overflow. Control flow...

• ETRI Journal
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• 제31권6호
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• pp.732-740
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• 2009

This paper describes the implementation of a digital audio effect system-on-a-chip (SoC), which integrates an embedded digital signal processor (DSP) core, audio codec intellectual property, a number of peripheral blocks, and various audio effect algorithms. The audio effect SoC is developed using a software and hardware co-design method. In the design of the SoC, the embedded DSP and some dedicated hardware blocks are developed as a hardware design, while the audio effect algorithms are realized using a software centric method. Most of the audio effect algorithms are implemented using a C code with primitive functions that run on the embedded DSP, while the equalization effect, which requires a large amount of computation, is implemented using a dedicated hardware block with high flexibility. For the optimized implementation of audio effects, we exploit the primitive functions of the embedded DSP compiler, which is a very efficient way to reduce the code size and computation. The audio effect SoC was fabricated using a 0.18 ${\mu}m$ CMOS process and evaluated successfully on a real-time test board.

• Journal of Welding and Joining
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• 제31권5호
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.764-767
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• 2003

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.599-602
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• 2004

Nowadays, the study on the ceramic components and modules using LTCC is being peformed and on the passives included in modules is being done also. Especillay frequency dependent components like capacitor and inductor are studied by many groups, but the behavior of embedded resistor in MCM-C module are not studied vigorously. The characteristics of embedded resistor in modules is different from that of resistor alone. In our research, behavior of embedded resistor is examined in the variation of position and geometrical parameters.

• International Journal of Reliability and Applications
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• 제16권1호
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• pp.35-53
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• 2015

This investigation deals with reliability and sensitivity analysis of a repairable embedded system with standby wherein repairman takes multiple vacations. The hardware system consists of 'M' operating and 'S' standby components. The repairman can leave for multiple vacations of random length during its idle time. Whenever any operating unit fails, it is immediately replaced by a standby unit if available. Moreover, governing equations of an embedded system are constructed using appropriate birth-death rates. The vacation and repair time of repairman are exponentially distributed. The matrix method is used to find the steady-state probabilities of the number of failed components in the embedded system as well as other performance measures. Reliability indexes are presented. Further, numerical experiments are carried out for various system characteristics to examine the effects of different parameter. Using a special class of neuro-fuzzy systems i.e. Adaptive Network-based Fuzzy Interference Systems (ANFIS), we also approximate various performance measures. Finally, the conclusions and future research directions are provided.

• 한국정보과학회논문지:소프트웨어및응용
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• 제36권8호
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• pp.607-615
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• 2009

최근 IT 산업은 국방, 항공, 자동차, 의료와 같은 전통 산업분야와 서로 융합하는 추세이다. 그러므로 시스템의 하드웨어를 주로 담당하는 임베디드 소프트웨어는 높은 신뢰성, 가용성, 유지보수성이 보장되어야 한다. 이를 위해 최근 COTS (Commercial Off The Shelf) 하드웨어 컴포넌트 기반 임베디드 소프트웨어를 개발하는 추세이다. 그러나 이러한 개발방법에는 일반적 소프트웨어 결함 외에 하드웨어와의 상호작용에 기인하는 결함이 추가적으로 발생할 수 있다. 이를 연동결함(Linkage Fault)라고 정의한다. 이는 발생 빈도가 낮음에도 불구하고 전체 시스템의 중단을 야기할 정도로 위험하다. 본 논문에서는 COTS 하드웨어 컴포넌트 기반 임베디드 소프트웨어 개발 시 이러한 연동결함의 발생을 고려한 신뢰성 모델을 제안한다. 또한 제안된 모델의 타당성을 분석하기 위해 베이지안 분석과 마코프 체인 몬테카를로 방법으로 계산한 베이즈 요인을 이용한다. 끝으로 IT 융합 분야의 실제 데이터를 활용하여 제안된 모델의 이론적 결과를 뒷받침한다.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.13-18
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• 2000

금속기판 위에 결합된 저온 소성 세라믹(low temperature co-fired ceramics on metal, LTCC- M)은 소성 후에 x-, y- 방향으로의 수축을 1% 이하로 억제할 수 있어 수동 소자를 내장하는데 매우 유리하며, 금속 기판 전체를 접지로 사용함으로써 노이즈를 감소시킬 수 있다. 본 고에서는 내부 실장 수동 소자별 특성차에 대하여 소개하고, 이러한 내부 실장 소자를 이용하여 실제로 제작된 PAM(power amplifier module)을 소개하였다. 내장된 수동 소자는 테스트 패턴 상에서 10~20%의 변화값을 보였으며 실제 모듈에 적용하여도 목표치에 부합하는 소자 구성이 가능하였다. 수동 소자가 내부에 실장됨으로써 신호 처리 시간을 감소시킬 수 있고, 납점의 감소로 공정을 단순화시킬 수 있을 뿐만 아니라 신뢰성 또한 증가시킬 수 있으므로 향후 RF모듈 외에 파워 및 고기능 소자 등 다양한 분야에 응용이 가능할 것이다.

• 대한임베디드공학회논문지
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• 제7권5호
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• pp.227-239
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• 2012

Recent advances in electronics have enabled various conventional products to incorporate with numerous powerful microcontroller. Generally, an embedded system is a computer system designed for specific control functions within a larger system, often with real-time computing constraints. The growing performance and reliability of hardware components and the possibilities brought by various design method enabled implementing complex functions that improve the comport of the system's occupant as well as their safety. A cyber physical system (CPS) is a system featuring a tight combination of, and coordination between, the system's computational and physical elements. The concept of cyber physical system, including physical elements, cyber elements, and shared networks, has been introduced due to two general reasons: design flexibility and reliability. This paper presents a cyber physical system where system components are connected to a shared network, and control functions are divided into small tasks that are distributed over a number of embedded controllers with limited computing capacity. In order to demonstrate the effectiveness of cyber physical system, an unmanned forklift with autonomous obstacle avoidance ability is implemented and its performance is experimentally evaluated.