• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.708-711
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• 1999

The Cu/Ni/Au lamellar structure is extensively used as an under bump metallization on silicon file, and on printed circuit board(PCB) pads. Ni is plated Cu by either electroless Ni plating, or electrolytic Ni plating. Unlike the electrolytic Ni plating, the electroless Ni plating does not deposit pure Ni, but a mixture of Ni and phosphorous, because hypophosphite Is used in the chemical reaction for reducing Ni ions. The fracture crack extended at the interface between solder balls of plastic ball grid (PBGA) package and conducting pads of PCB. The fracture is duets to segregation at the interface between Ni$_3$Sn$_4$intermetallic and Ni-P layer. The XPS diffraction results of Cu/Ni/Au results of CU/Ni/AU finishs showed that the Ni was amorphous with supersaturated P. The XPS and EDXA results of the fracture surface indicated that both of the fracture occurred on the transition lesion where Sn, P and Ni concentrations changed.

• Corrosion Science and Technology
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• 제18권4호
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• pp.148-153
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• 2019

Pure nickel with a thickness of 1 mm was plated on type 304 stainless steels and low alloy steels (JIS G3131 SPHC) by electrolytic plating method in a circulating plating bath. Plating performance, mechanical properties, and surface characteristics were evaluated in terms of pretreatment process, anode material, pH, current density, and flow rate of the plating solution. Addition of hydrochloric acid during pre-treatment process improved the adhesion performance of plating. To improve plating efficiency, it is desirable to use S-nickel rather than electrolytic nickel. The use of S-nickel was also confirmed to be desirable for maintaining the pH and concentration of the plated solution. The defect of the plating using S-nickel anode produced pit on the surface. However, it is believed that proper control can be obtained by increasing the flow rate. Internal stress and hardness values of electrolytic nickel plating according to current density need to be carried out with further studies.

• 폴리머
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• 제24권5호
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• pp.721-727
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• 2000

탄소섬유/에폭시 수지 복합재료의 기계적 계면 결합력을 증가시키기 위해 탄소섬유를 전해 니켈도금 표면처리하였다. 탄소섬유의 표면특성과 복합재료의 최종 기계적 물성은 각각 X-ray photoelectron spectroscopy (XPS)와 Interlaminar shear strength (ILSS) 측정을 통하여 알아보았다. 본 실험결과, 전해 니켈도금은 복합재료의 계면, 즉 강화재인 탄소섬유와 매트릭스간의 계면 결합력에 크게 영향을 미침을 알 수 있었으며, 특히 니켈도금 처리된 탄소섬유 표면에서 $O_{1s}$/$C_{1s}$ 비의 증가와 NiO 그룹 및 금속 니켈의 형성은 기계적 특성인 ILSS 증가의 요인으로 작용함을 알 수 있었다 또한, $O_{1s}$/$C_{1s}$비는 복합재료의 ILSS와 밀접한 관계가 있음을 고찰하였다.을 고찰하였다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 추계학술발표대회 논문집
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• pp.350-355
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• 2009

The crysralline silicon solar cell where the solar cell market grows rapidly is occupying of about 85% or more high efficiency and low cost endeavors many crystalline solar cells. The fabricaion process of high efficiency crystalline silicon solar cells necessitate complicated fabrication processes and Ti/Pd/AG contact, This metal contacts have only been used in limited areas in spite of their good srability and low contact resistance because of expensive materials and process. Commercial solar cells with screen-printed solar cells formed by using Ag paste suffer from loe fill factor and high contact resistance and low aspect ratio. Ni and Cu metal contacts have been formed by using electroless plating and light-induced electro plating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on 0.2~0.6${\Omega}$ cm, $20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.444-445
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• 2009

The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposit the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 16.446 % on $0.2\sim0.6\;{\Omega}{\cdot}cm$, $20\;\times\;20\;mm^2$, CZ(Czochralski) wafer.

• 한국융합학회논문지
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• 제8권11호
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• pp.307-312
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• 2017

산업계에서는 희생양극의 원리를 이용한 아연도금이 사용되고 있다. 순수아연도금보다 내식성을 증가시키기 위한 방안의 하나로 Zn-Ni 합금도금이 개발되었다. 합금 도금층은 순 아연 도금층에 비하여 4-5배의 내식성을 가지고 있어서 도금 단가가 높음에도 불구하고 고내식성을 요구하는 자동차 부품 등에 적용이 증가되고 있다. Zn-Ni 합금도금액은 황산욕, 염화욕, 알칼리욕과 암모니아욕 등이 사용되고 있다. 여기에서는 염화욕에서 합금도금의 조성에 미치는 전해조건의 영향을 조사하였다. 그 결과는 음극 과전압 및 확산계수에 의해 설명하였다. 일반적으로 음극의 과전압이 증가함에 따라 활성화분극보다 농도분극이 중요하게 된다. 농도분극은 확산 층 내의 원소 확산에 의해 결정된다. 즉 음극의 과전압이 증가함에 따라 확산계수가 큰 Zn 함량이 증가한다.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2009년도 춘계학술발표대회 논문집
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• pp.214-219
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• 2009

In high-efficiency crystalline silicon solar cells, If high-efficiency solar cells are to be commercialized. It is need to develop superior contact formation method and material that can be inexpensive and simple without degradation of the solar cells ability. For reason of plated metallic contact is not only high metallic purity but also inexpensive manufacture. It is available to apply mass production. Especially, Nickel, Copper and Silver are applied widely in various electronic manufactures as easily formation is available by plating. The metallic contact system of silicon solar cell must have several properties, such as low contact resistance, easy application and good adhesion. Ni is shown to be a suitable barrier to Cu diffusion as well as desirable contact metal to silicon. Nickel monosilicide(NiSi) has been suggested as a suitable silicide due to its lower resistivity, lower sintering temperature and lower layer stress than $TiSi_2$. Copper and Silver can be plated by electro & light-induced plating method. Light-induced plating makes use the photovoltaic effect of solar cell to deposite the metal on the front contact. The cell is immersed into the electrolytic plating bath and irradiated at the front side by light source, which leads to a current density in the front side grid. Electroless plated Ni/ Electro&light-induced plated Cu/ Light-induced plated Ag contact solar cells result in an energy conversion efficiency of 14.68 % on $0.2{\sim}0.6{\Omega}{\cdot}cm,\;20{\times}20mm^2$, CZ(Czochralski) wafer.

• 한국의류학회지
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• 제23권5호
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• pp.694-702
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• 1999

By using commercial available electromagnetic interference (EMI) shielding fabrics, EMI shielding effectiveness(SE) and the physical properties were investigated. Thirteen specimens were chosen six fabrics were non-electrolytic plated with Cu, six plated with Cu+Ni and one plated with Ni, SE was measured by RF Impedance Analyzer HP4291A(Hewlett Co, Ltd)at the frequency of 100MHz-1.8GHz. The results showed that the commercial EMI shielding fabrics provided SE values over 30dB at the frequency of 100MHz-1.8GHz. Fabrics plated with Cu showed more effective shielding than those plated with Ni. The thickness of coating and fabric count were also influential factors on SE. Tensile properties were acceptable for lining fabrics but water vapor transport properties indicated that the better treatment condition were suggested to improve comfort properties.

• 폴리머
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• 제27권1호
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• pp.52-60
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• 2003

본 연구에서는 탄소섬유 강화 에폭시 수지 복합재료의 충격 특성 향상을 위해 탄소섬유표면에 전해 및 무전해 니켈도금처리를 하였으며, 이때 각각의 니켈도금법에 따른 충격 특성을 비교 고찰하였다. 도금된 탄소섬유의 표면 특성은 XRD, SEM, 그리고 접촉각 측정을 통해 관찰하였고, 탄소섬유 강화 복합재료의 충격 특성은 Izod형의 충격시험기를 이용하여 분석하였다. 실험결과, 무전해 니켈도금층에는 전해도금층과는 달리 Ni-P 합금이 포함된 것이 XRD를 통하여 확인되었으며, 전해 니켈도금된 탄소섬유가 무전해 니켈도금된 것보다 표면자유에너지가 큰 것이 접촉각 측정을 통해 관찰되었다. 한편, 무전해 니켈도금된 탄소섬유 강화 에폭시 수지 복합재료는 충격강도가 크게 증가하였으나, 전해 니켈도금된 복합재료의 경우는 충격강도가 증가하지 않았다. 이러한 결과는 각각의 도금법에 따른 젖음성의 차이가 탄소섬유 강화 복합재료의 연성을 변화시켜 충격강도 증가에 주요하게 작용되었기 때문으로 사료된다.

• Corrosion Science and Technology
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• 제7권1호
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• pp.61-67
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• 2008

In this paper, electrochemical and microstructural characteristics of nickel-plated Alloy 600 were investigated in order to identify the performance of electroless Ni-plating on Alloy 600 in high-temperature aqueous condition with the comparison of electrolytic nickel-plating. For high temperature corrosion test of nickel-plated Alloy 600, specimens were exposed for 770 hours to typical PWR primary water condition. During the test, open circuit potentials (OCP's) of all specimens were measured using a reference electrode. Also, resistance to flow accelerated corrosion (FAC) test was examined in order to check the durability of plated layers in high-velocity flow environment at high temperature. After exposures to high flow rate aqueous condition, the integrity of surfaces was confirmed by using both scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). For the field application, a remote process for electroless nickel-plating was demonstrated using a plate specimen with narrow gap on a laboratory scale. Finally, a practical seal design was suggested for more convenient application.