• 한국재료학회지
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• 제28권10호
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• pp.601-609
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• 2018

To study the effects of graphite shape and the composite fabricating method on the mechanical properties of graphite/copper (Gr/Cu) composites, a copper composite using graphite flakes or graphite granules as reinforcing phases is fabricated using mechanical mixing or electroless plating method. The mechanical properties of the Gr/Cu composites are evaluated by compression tests, and the compressive strength and elongation of the Gr/Cu composites using graphite granules as a reinforcing phase are compared with those of Cu composites with graphite flakes as a reinforcing phase. The compressive yield strength or maximum strength of the Gr/Cu composites with graphite granules as a reinforcing phase is higher than that of the composites using graphite flakes as a reinforcing phase regardless of the alignment of graphite. The strength of the composite produced by the electroless plating method is higher than that of the composite material produced by the conventional mechanical mixing method regardless of the shape of the graphite. Using graphite granules as a reinforcing phase instead of graphite flakes improves the strength and elongation of the Gr/Cu composites in all directions, and reduces the difference in strength or elongation according to the direction.

• Transactions on Electrical and Electronic Materials
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• 제11권4호
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• pp.174-177
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• 2010

We have developed an environment-friendly etching process, an alternative to the dichromic acid etching process, as a pretreatment of acrylonitrile-butadiene-styrene (ABS) plastic for electroless plating. In order to plate ABS plastic in an electroless way, there should be fine holes on the surface of the ABS plastic to enhance mechanically the adhesion strength between the plastic surface and the plate. To make these holes, the surface was coated uniformly with dispersed chemical foaming agents in a mixture of environmentally friendly dispersant and solvent by the methods of dipping or direct application. The solvent seeps into just below the surface and distributes the chemical foaming agents uniformly beneath the surface. After drying off the surface, the surface was heated at a temperature well below the glass transition temperature of ABS plastic. By pyrolysis, the chemical foaming agents made fine holes on the surface. In order to discover optimum conditions for the formation of fine holes, the mixing ratio of the solvent, the dispersant and the chemical foaming agent were controlled. After the etching process, the surface was plated with nickel. We tested the adhesion strength between the ABS plastic and nickel plate by the cross-cutting method. The surface morphologies of the ABS plastic before and after the etching process were observed by means of a scanning electron microscope.

• 반도체디스플레이기술학회지
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• 제13권3호
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• pp.51-55
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• 2014

Ni-CNT(Carbon Nanotubes) composite coating is often used for the surface treatment of mechanical/electronic devices to improve the properties of the Ni coating. For the Ni-CNT coating, the dispersion of CNT fibers is a critical process. In this study, ultrasonic treatment instead of the conventional ball milling was attempted as a dispersion method for the electroless Ni-CNT coating. SEM-EDX analysis was performed and contact angle, sheet resistance, and micro-hardness were measured. Results showed that the ultrasonic treatment was comparable to the ball milling, as a dispersion method, but the difference was negligible. However, combined ball milling and ultrasonic treatment(double treatment) showed much improved micro-hardness value, above 350Hv(close to the value obtained by the Ni-CNT electroplating). In addition, electroless Ni-CNT(double-treated) coatings formed on the thin Ni film deposited by the electroless plating(double coating) showed better mechanical properties. Thus, double treatment and double coating are suggested as an improved electroless Ni-CNT coating method.

• 대한치과교정학회지
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• 제36권2호
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• pp.145-152
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• 2006

본 연구는 교정용 선재의 직경을 증가시키기 위한 방법으로 무전해도금법의 이용 가능성 여부를 전기도금법과의 비교를 통해 알아보고자 시행되었다. 0.016 인치 스테인레스 스틸 교정용 선재에 도금을 위한 전처리를 시행한 후, 시중에 판매되는 무전해니켈도금액($Hessonic-Gr^{(R)}$, 신풍금속, 한국)을 사용하여 $90^{\circ}C$ 온도에서 0.018 인치 직경이 될 때까지 도금을 시행하였다. 무전해도금 과정 중 시간에 따른 직경증가율을 구하는 한편, 도금 후 세 지점의 직경을 계측하여 균일성을 평가하였다. 도금 금속의 정성분석을 위하여 X-선 회절분석을 시행하는 한편, 물성검사를 시행한 후 전기도금한 경우와 각각 비교 분석하였다. 연구결과 무전해도금한 군이 전기도금을 시행한 군보다 강성, 항복강도, 극한강도 모두 높은 경향을 보였으며 강성과 극한강도에서 통계적으로 유의한 차이를 나타내었다 (p<0.05). 또한 무전해도금한 군의 직경증가율은 $0.00461{\pm}0.00003mm/5min$ (0.00092 mm/min)로, 전기도금한 군의 직경증가율 $0.00821{\pm}0.00015mm/min$와 차이를 보였다. 도금 후 세 지점의 직경을 계측하여 균으성을 평가한 결과, 두 가지 도금법 모두에서 균일한 양상을 보였다. 이상의 결과로 무전해도금법을 통해 직경이 증가된 선재가 전기도금 법에 의해 직경이 증가된 선재보다 기존의 선재와 가까운 물성을 보임을 알 수 있었으며, 이의 임상적 적응을 위해서는 도금시간의 감소가 필요함을 알 수 있었다.

• 한국표면공학회지
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• 제42권1호
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• pp.47-52
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• 2009

Cu-Ag powder having Core-Shell structure was prepared from by electroless plating method using agents such as $AgNO_3$, $NH_{4}OH$, Hydroquinone. Ag coated copper powders were analyzed using scanning electron microscopy(SEM) and energy dispersive X-ray spectrometer(EDX). The silver coating layer of copper powder was affected from various reaction conditions such as molar ratio of $NH_{4}OH$, $AgNO_3$, and pulp density. Free silver was generated below 0.1M or 0.3M and above of $NH_{4}OH$ mole ratio. Silver coating layer thickened as addition of $AgNO_3$. When the pulp density reached 12% with 0.2M $NH_{4}OH$, and 0.15M $AgNO_3$ at $4^{\circ}C$, silver was homogeneously distributed around the copper particles and free silver particles were not generated.

• 한국수소및신에너지학회논문집
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• 제3권2호
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• pp.9-15
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• 1992

Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

• 한국표면공학회지
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• 제18권4호
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• pp.153-163
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• 1985

In the electroless nickel plating bath which contained nickel sulfate, sodium hypophosphite, boric acid and triethanolamine, effect of their concentration on the rate of deposition was tested by gravimetric method and polarization method. The polarization method that polarize small range of voltage anodicaly and cathodicaly at the mixed potential in the electroless plating bath can calculate mixed current (depositing rate) from $i_{mp}=\frac {i}{\eta}\;\frac{RT}{nF}\;or\;i_{mp}=\frac{i}{\eta}\;\frac{1}{2.3}(\frac{b_a\;\;b_c}{b_c+b_a})$ Where $i_{mp}$ is the depositing current, i is the polarized current, ${\eta}$ is the polarized voltage, $b_a\;and\;b_c$ are the Tafel slop of anodic and cathodic polarization curves respectively. The calculated mixed current ($i_{mp}$) is proportional to the depositing rate obtained by gravimetric method and corresponded mostly to the real depositing rate by multifying supplementary constant. The polarization method can be used for founding inclination of reaction on various concentration of each composition. Decreasing or increasing concentration of triethanolaminc as a complexing agent , the depositing rate is decreased and when the bath contained 25-50mL/L of triethanoloamine, the depositing rate is increased. The depositing rate is increased with increasing the concentration of boric acid, and when the bath contained 0.5M of boric acid, the depositing rate is increased abruptly. The optimum composition of the electroless nickel bath was estimated 0.1M of nickel sulfate, 0.25M of sodium hypophosphite, 0.5M of boric acid, and 25-50mL/L of triethanalamine.

• 마이크로전자및패키징학회지
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• 제14권3호
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• pp.21-27
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• 2007

이방성 전도필름(ACF) 접합에 사용되는 니켈 범프를 무전해 및 전해 도금법으로 제작한 다음, 이 범프들의 기계적 특성과 충격안전성을 압축시험, 범프전단시험, 낙하충격시험을 통하여 연구하였다. Nano indenter를 이용한 압축시험에서 얻은 하중-변형량 데이터를 변환시켜 니켈범프의 응력-변형량 곡선을 구하였다. 전해 니켈 범프는 무전해 니켈 범프에 비해 매우 작은 탄성한계응력과 탄성계수를 나타냈었다. 무전해 니켈 범프의 탄성한계응력과 탄성계수가 각각 600-800MPa, $9.7{\times}10^{-3}MPa/nm$인 반면 전해 니켈 범프의 경우에는 각각 70MPa, $7.8{\times}10^4MPa/nm$이었다. 범프전단 시험에서 무전해 니켈 범프는 소성변형이 거의 일어나지 않고 낮은 전단하중에서 범프가 패드 층에서 튕기듯이 떨어져 나간 반면 전해 니켈 범프는 큰 소성변형을 일으키며 범프가 잘려나갔으며 높은 전단하중을 보여주었다. 낙하충격시험 결과 ACF 플립칩 방법으로 본딩한 무전해 및 전해 범프 모두 높은 충격 신뢰성을 보였다.

• 한국의류학회지
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• 제27권7호
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• pp.843-850
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• 2003

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar＞HCl＞O$_2$＞NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$＜Ar＜HCl＜NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

• 기술사
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• 제25권2호
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• pp.49-53
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• 1992