Journal of the Korean Society of Clothing and Textiles (한국의류학회지)

The Korean Society of Clothing and Textiles (한국의류학회)
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Effect of Plasma Etching and $PdCl_2/SnCl_2$ Catalyzation on the Performance of Electroless Plated Copper Layer

플라즈마 에칭 및 $PdCl_2/SnCl_2$ 촉매조건이 무전해 동도금 피막의 성능에 미치는 영향

  • 오경화 (중앙대학교 가정교육학과) ;
  • 김동준 (한양대학교 섬유고분자공학과 기능성고분자신소재 연구센타) ;
  • 김성훈 (한양대학교 섬유고분자공학과 기능성고분자신소재 연구센타)
  • Published : 2003.07.01
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Abstract

Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar＞HCl＞O$_2$＞NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$＜Ar＜HCl＜NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

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References

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