• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.137-137
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• 2013

본 연구에서는 반도체 검사 장비인 프로브 카드의 핵심 부품인 프로브 니들의 팁 부분의 내마모성을 향상시키기 위하여 무전해 Ni-B-W 합금 도금 실험을 실시하였다. 무전해 Ni-B-W 합금 도금 실험에서 여러 가지 제어인자 중 도금욕의 pH와 온도 그리고 환원제의 농도 등을 변수로 하였다. 도금욕 pH와 온도에 따른 전착속도 및 물성 변화를 관찰하였으며, 환원제 농도 변화에 의한 open circuit potential의 변화를 측정하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.04a
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• pp.338-341
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• 1997

According to reports, it is impossible to make Ohmic Contact with high resistivity p type CdTe or CdZnTe semiconductor theoretically. But it is in need of making Ohmic Contact to fabricate semiconductor radiation detector By electroless deposition method using gold chloride solution, we made Ohmic Contact of Au and p-Cd$_{80}$Zn$_{20}$Te which grown by High Presure Bridgman Method in Aurora Technologies Corporation. We investigated the interface with Rutherford Backscattering Spectrometry and Auger electron spectroscopy. And we evaluated the degree of Ohmic Contact for the Au/CdZnTe interface by the I/V characteristic curve. As a result, we concluded that it showed excellent Ohmic Contact property by tunneling mechanism through the interface.e.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.34D no.4
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• pp.47-53
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• 1997

We fabricated gamma radiation detector using high resistive p-Cd$_{80}$Zn$_{20}$Te grown by high pressure bridgman method and forming au thin film electrode by chemically electroless deposition method. The device of Au/Cd$_{80}$Zn$_{20}$Te/Au is a typical MIM structure. The characteristic of current-voltage showed good linearity to 3kV/cm but it depend on the square of electric field over 3kV/cm. As the results of rutherford backscattering spectroscope(RBS) and auger spectroscope on the Au/Cd$_{80}$Zn$_{20}$Te, Au penetrated to the surface of Cd$_{80}$Zn$_{20}$Te detector absorbed slightly high energy radiation like a few hundred keV and showed good performance to detect low energy gamma ray.mma ray.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.118-121
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• 2003

The electrochemical behaviors of UBM nickel were investigated. Electrode potential has been changed with the surface composition. Zinc is dissolved into the solution immediately after immersion. Electrode potential has three distinct regions: Zinc dissolution region, transient region and nickel plating region. The effects additives on electrode potential and polarization curves were also investigated. The addition of suppressor lowered the current density which is related with deposition rate.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.266-266
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• 2012

Ni films with a thickness of 700-800 nm were deposited on carbon fiber layers using electroless deposition, and surface structures and chemical properties of these films with various annealing temperatures (300, 600 and $900^{\circ}C$) were studied. $600^{\circ}C$-annealing under atmospheric conditions resulted in formation of porous surface structures with a mean pore size of ~100 nm, whereas the other samples showed non-porous surface structures. $600^{\circ}C$-annealed Ni film showed much higher reactivities for toluene adsorption and CO oxidation comparing to other non-porous surfaces.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.127-128
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• 2014

현재 기술 산업에서 PET위 무전해 도금을 실행하기 위해 다양한 전처리 공정과 Catalyst가 소개되고 있다. 그 중에서 가장 일반적으로 사용되고 있는 Catalyst는 Palladium으로서 Tin과 산화 환원 반응으로 Electroless Copper Deposition 단계에서 구리 도금의 Target으로 작용하고 있다. 하지만 상대적으로 Palladium은 생산 비용이 높으며 Tin은 쉽게 산화되는 문제점이 남아 있다. 이를 대체하기 위한 대안 공정으로서 Palladium 대신 Silver를 이용하여 Catalyst로서의 역할을 하는 공정이다. 이전에 PET위 전처리 공정으로 Ultra Violet을 사용하여 표면을 개질 시키는 방법을 연구했으며, 그 후 Potassium Permanganate와 Silver Catalyst의 Mechanism을 연구 했다. PET 표면 개질을 거치면서 화학 구조가 바뀌어 표면에 Carbon Carbon Double Bond를 형성한다. 이때 Permanganate ion이 새로이 형성된 이중 결합과 반응하여 두 개의 extra-OH functional group을 생성함과 동시에 $MnO_2$를 만들어 표면에 흡착 시킨다. $MnO_2$는 전위차에 의해 Silver Ion과 Redox Reaction을 일으키며 실질적인 Catalyst 역할을 하게 된다. Silver Catalyst는 무전해 구리 도금 용액 안에서 Copper의 Target으로 작용한다.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.314-324
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• 1996

Scanning probe microscopes (SPMs) such as the scanning tunneling microscope (STM) and the atomic force microscope (AFM) were used for surface modification tools at the nanometer scale. Material surfaces, i. e., titanium, hydrogen-terminated silicon and trimethylsilyl organosilane monolayer on silicon, were locally oxidized with the best lateral spatial resolution of 20nm. The principle behind this proximal probe oxidation method is scanning probe anodization, that is, the SPM tip-sample junction connected through a water column acting as a minute electrochemical cell. An SPM-nanolithogrphy process was demonstrated using the organosilane monolayer as a resist. Area-selective chemical modifications, i. e., etching, electroless plating with gold, monolayer deposition and immobilization of latex nanoparticles; were achieved in nano-scale resolution. The area-selectivity was based on the differences in chemical properties between the SPM-modified and unmodified regions.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.87-88
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• 2007

무전해 구리 도금 공정에서 첨가제로 사용되는 HIQSA 화합물이 Damascene 공정을 이용한 60nm급 trench 패턴 내 무전해 구리 배선 형성 과정에 미치는 효과를 전기 화학적 기법과 광학적 기법을 이용하여 관찰하였다. HIQSA 농도별 open circuit potential의 변화를 관측한 결과, 3ppm 수준으로 첨가되었을 때, 무전해 도금 과정 중 가장 안정한 전위가 유지됨을 볼 수 있었다. 무전해 도금액 내 HIQSA 농도가 높아짐에 따라 구리 도금층의 두께는 지수적으로 감소하였으며, 표면의 결정 크기도 감소하였다. 60nm급 trench 내 무전해 구리 도금 시, 용액 내 침적 시간 60초가 무결함 superconformal copper filling을 얻기 위한 최적 시간이었다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.602-606
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• 2003

Silicon has been developed as an alternate anode material for lithium secondary batteries. A simple approach to improve the electrical contact of silicon powder has described. Carbon-coated and silver-coated silicon have been prepared by chemical vapor deposition and electroless plating respectively. Assembled cells, which consisted of surface modified silicon, lithium foil and $Li^+$ contained organic electrolyte, have been studied using electrochemical methods. Carbon-coated silicon was improved in the electrochemical performance such as reversibility and resistance compared to surface-unmodified silicon.

• Journal of Power System Engineering
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• v.5 no.2
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• pp.71-78
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• 2001

Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition; $CuSO_4\;0.025M,\;NiSO_4\;0.002M,\;NaH_2PO_2\;0.4M$, sodium citrate 0.06M, $H_3BO_3$ 0.6M, thiourea or 2-MBT $0.2mg/{\ell}$, and operation conditions; pH $9{\sim}10$ at bath temperature rage of $60{\sim}70^{\circ}C$. A small amount of nickel ion($Ni^{2+}/Cu^{2+}$=0.002/0.025) to the hypophosphite reduced solution promotes autocatalysis and continuous plating. An additive such as thiourea or 2-MBT of a small amount($0.2mg/{\ell}$) can be used to stabilize the solution without changing plating rate much. The attivation energy between $20^{\circ}C\;and\;70^{\circ}C$ were calculated to be 11.3kcal/mol for deposition weight. Plating reaction had been ceased by the adjustment of pH above 13, temperature higher than $90^{\circ}C\;and\;under\;20^{\circ}C$. Deposited surface became worse in the case of increment of bath temperature above $80^{\circ}C$.