• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.206-207
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• 2002

전기도금방식으로 구현된 자기박막 재료로서 CoPtP 박막은 이제까지 보고된 재료 중 가장 높은 보자력 (H$_{c}$ > 5 kOe)과 뛰어난 각형비 (S＊≒0.7)를 가지고 있는 3원계 합금 박막재료이며[1], 차세대 고밀도 자기저장매체로서 [2] 각광받고 있다. 하지만 이제까지 보고된 연구결과는 CoPtP 박막을 전기도금방식으로 제작했을 때, 두께가 약 1$\mu\textrm{m}$ 이상일 경우, 결정립이 큰 칼럼구조(columnar structure)가 성장하여 보자력이 현저히 떨어지는 현상[3]을 보여왔으며, 이러한 이유 때문에 MEMS 등에 응용되는데 많은 제약을 받아왔다. (중략)

• Journal of the Korean Magnetics Society
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• v.15 no.5
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• pp.276-281
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• 2005

We have investigated the effects of an external magnetic field on the growth direction and the grain size of electrochemically prepared CoPtP alloys. Electrodeposited CoPtP alloys were synthesized by appling an external magnetic field with 0 to 1 T to the perpendicular direction of the films. In the electrodeposited CoPtP alloys without external magnetic field, the growth direction of the alloys was mixed by fcc (111) and hop (002), but only hop (002) was observed in the alloys with 1 T external magnetic field. CoPtP alloys were grown as the columnar growth and the grain size increases with growing the alloys. With appling an external field, the grain size of the alloys was controlled less than 20 nm which is smaller than single domain of Co, and the easy axis of alloys, hcp (002) direction, was grown perpendicular to the films up to 200 nm. We could obtain the optimal thickness of the alloys and electrodeposition condition from the above results. Coercivity and squareness of CoPtP alloys taken out-of-plane are 6.1 kOe and 0.9, respectively. The magnetic properties of CoPtP alloys were measured by VSM, and the microstructural characterization and crystalline orientation measurement of the alloys were carried out by TEM and XRD.

• Journal of the Korean Wood Science and Technology
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• v.44 no.5
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• pp.750-759
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• 2016

The $MnO_2$ electrodeposited on the surface of the carbon nanofiber mats ($MnO_2$-LCNFM) were prepared from electrospun lignin-g-PAN copolymer via heat treatments and subsequent $MnO_2$ electrodeposition method. The resulting $MnO_2$-LCNFM was evaluateed for its potential use in a supercapicitor electrode. The increase of $MnO_2$ electric deposition time was revealed to increase diameter of carbon nanofibers as well as $MnO_2$ content on the surface of carbon nanofiber mats as confirmed by scanning electon microscope (SEM) analysis. The electrochemical properties of $MnO_2$-LCNFM electrodes are evaluated through cyclic voltammetry test. It was shown that $MnO_2$-LCNFM electrode exhibited good electrochemical performance with specific capacitance of $168.0mF{\cdot}cm^{-2}$. The $MnO_2$-LCNFM supercapacitor successfully fabricated using the gel electrolyte ($H_3PO_4$/Polyvinyl alcohol) showed to have the capacitance efficiency of ~90%, and stable behavior during 1,000 charging/discharging cycles.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.4
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• pp.9-15
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• 2009

Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

• Journal of Hydrogen and New Energy
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• v.21 no.1
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• pp.26-34
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• 2010

The electrocatalystic prperties of Pt-Co and Pt-Ni with heteropolyacids (HPAs) entrapped in covalently cross-linked sulfonated poly(ether ether ketone) (CL-SPEEK)/HPA membranes were investigated for water electrolysis. The HP As, including molybdophosphoric acid (MoPA), and tungstophosphoric acid (TPA) were both used as membrane additives and electrocatalysts. The membrane electrode assembly (MEA) was prepared by a nonequilibrium impregnation-reduction (I-R) method. $Pt(NH_3)_4Cl_2$, $NiCl_2$ and $CoCl_2$ as electrocatalytic materials and $NaBH_4$ as reducing agent were used. I order to enhance electrocatalytic activity, the catalyst layer prepared above was electrodeposited (Dep) with HP A. Surface morphologies and physico-chemical properties of MEA were investigated by means of SEM, EDX and XRD. The electrocatalytic properties of composite membranes such as the cell voltage and coulombic charge in CV were in the order of magnitude: CL-SPEEK/MoPA40 (wt%) > CL-SPEEK/TPA30 > Nafion117. In the optimum cell applications for water electrolysis, the cell voltage of Pt/CL-SPEEK-MoPA40/Pt-Co (Dep-MoPA) and Pt/CL-SPEEK-TPA30/Pt-Co (Dep-TPA) was 1.75 Vat $80^{\circ}C$ and $1\;A/cm^2$ and voltage efficiency was 87.1%. Also, the observed activity of Pt-Co (84:16 atomic ratio by EDX) is a little higher than that of Pt-Ni (86: 14). The current density peak of electrodeposited electrodes were better a little than those of unactivated electrodes based on the same membranes.

• Journal of the Korean Electrochemical Society
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• v.14 no.3
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• pp.163-170
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• 2011

Nanocrystalline Ni thin films were electodeposited from chloride baths to investigate the influences of additive concentration, current density and solution pH on residual (or internal) stress, surface morphology, and microstructure of the films. It was observed that residual stress in Ni thin film was changed from tensile stress mode (about 150 MPa) to compressive stress mode (about -100 MPa) with increasing saccharin concentration as an additive. Microstructure of Ni thin films was changed with/without saccharin in baths. Ni thin films electrodeposited from saccharinfree bath mainly consisted of both FCC(111) and FCC(200) phases. However, Ni thin film electrodeposited from the baths containing saccharin exhibited FCC(111), FCC(200) and FCC (311) phases [sometimes, FCC (220)]. Current density influenced residual stress of Ni thin films. It was measured to be the lowest compressive stress value (about-100 MPa) in range of current density of $2.5\sim10mA{\cdot}cm^{-2}$. Solution pH also influenced residual stress of Ni thin film. Addition of saccharin in baths affected grain size of Ni thin films. Grain sizes of Ni thin films were measured to be about 60 nm without saccharin and 24~38 nm with more than 0.0005M saccharin concentration. Surface of Ni thin films was changed from nodular to smooth surface morphology with addition of saccharin.

• Journal of the Korean Magnetics Society
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• v.27 no.4
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• pp.135-139
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• 2017

The magneto-impedance effect (MI effect) has been investigated in metal core/soft magnetic shell composite wires fabricated by electrodeposition of $Ni_{80}Fe_{20}$ on Cu wire (diameter $190{\mu}m$). The diagonal impedances $Z_{zz}$ and $Z_{{\theta}{\theta}}$ in cylindrical coordinate showed strong MI effect for the magnetic field applied along z-axis, while the off-diagonal impedance $Z_{{\theta}z}$ showed very weak MI effect. We have tried to develop the Cu $core/Ni_{80}Fe_{20}$ shell composite wire having strong MI effect in off-diagonal impedance by electrodeposion under torsional strain. The core/shell composite wire electrodeposited under torsional angles above $270^{\circ}$ showed significantly enhanced MI effect in the off-diagonal impedance. The maximum MI effect was observed in the composite wire electrodeposited under torsional angle of $360^{\circ}$. The developed method to enhance off-diagonal MI effect is expected to increase the applicability of the core/shell composite wire to magnetic sensor material.

• Journal of the Korean Electrochemical Society
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• v.13 no.2
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• pp.89-95
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• 2010

The chalcopyrite $Cu(In_xGa_{(1-x)})Se_2$ (CIGS) is considered to be one of the effective light-absorbing materials for thin film photovoltaic solar cells. We describe the electrodeposition of CIGS thin films in ambient laboratory conditions, and suggest the electrochemical conditions to prepare stoichiometric CIGS thin films of Ga/(In + Ga) = 0.3. In acidic solutions containing $Cu^{2+}$, $In^{3+}$, $Ga^{3+}$ and $Se^{4+}$ ions, the CIGS films of different Cu/In/Ga/Se chemical compositions were electrodeposited onto Mo/Glass substrate. The structure, morphology and chemical composition of electrodeposited CIGS films were characterized by X-ray diffraction (XRD), Scanning electron microscopy (SEM), and Energy dispersive X-ray spectroscopy (EDS), respectively.

• Journal of the Korean Electrochemical Society
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• v.8 no.2
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• pp.94-98
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• 2005

Coptp films with the additive elements (X=Fe, Mn) of varying concentrations were prepared by in-situ electrodeposition, to tailor their magnetic properties. Alloys of CoPtP-X (X=Fe, Mn) were synthesized by changing the solution concentrations of Fe and Mn for electrodeposition. In the electrodeposited CoFePtP alloys, preferred orientation of the electrodeposited films changed from hexagonal (001) to (100) direction with increasing iron contents as revealed by X-ray diffraction, and these films exhibited various magnetic properties ranging from a typical hard magnetic to a soft magnetic property in accordance with microstructural variations. In the case of Mn addition, excellent hard magnetic property was observed at a specific Mn concentration of 0.0126 M in the electrolyte, with the coercivity of 4630 Oe and squareness of 0.856 and this was attributed to the fact that magnetization easy-axis (hexagonal c-axis) coincides with the preferred growth orientation of the film confirmed by transmission electron microscopy.

• Journal of Magnetics
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• v.11 no.2
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• pp.87-89
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• 2006

CoFeV thin film alloys were fabricated by electrodeposition, and the dependences of their magnetic properties on the current density were investigated using an X-ray diffractometer and a vibrating sample magnetometer. The deposited Co increased from about 45 to 60 wt.% with increasing current density until $25mA/cm^2$ whereas the deposited Fe decreased from about 55 to 40 wt.% with increasing current density until $25mA/cm^2$. The deposited V, about 2 wt.%, was independent of the current density. The current efficiencies of electrodeposition decreased linearly from about 40 to 29% with increasing current density. The X-ray diffraction measurement showed that all peaks of the CoFeV films were consistent with those of a typical Co hcp and Fe bcc mixed phase. An increase in the current density decreased the grain size and increased the lattice constant. The saturation magnetization increased from about 2.2 to 2.5 T with increasing current density. The coercivity measured in the perpendicular direction decreased from 260 to 120 Oe with increasing current density; a drastic drop of 60 Oe occurred at $5mA/cm^2$. The coercivity measured in the in-plane direction remained almost unchanged, at about 20 Oe, with increasing current density.