• Journal of the Korean Society for Precision Engineering
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• 제22권11호
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• pp.165-172
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• 2005

In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

• Journal of the Institute of Electronics Engineers of Korea TC
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• 제39권11호
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• pp.40-46
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• 2002

A MEMS(Micro Electro Mechanical System) package using a doped-silicon(Si) carrier for coplanar microwave and millimeter-wave integrated circuits is proposed in order to reduce parasitic problems of leakage, coupling and resonance. The proposed carrier scheme is verified by fabrication and measuring a GaAs CPW(Coplanar Waveguide) on the three types of Si-carriers(gold-plated high resistivity, lightly doped, high resistivity). The proposed MEMS package using the lightly doped(15 ${\Omega}{\cdot}$) Si-carrier shows parasitic-free performance since the lossy Si-carrier effectively absorbs and suppresses the resonant leakage.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제27권1호
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• pp.61-69
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• 2014

In this paper, we have researched semiconductor optical filters to solve the problem of the high failure rate that are recognize bad of financial account, jam of financial account and the ATM service interruption due to failure of accurate location information among the operation of the ATM (automatic teller machine) systems. A semiconductor optical filters that have high resolution and less diffuse, high transmittance are able to detect the information of financial account surface accurately. Therefore, it is a stable filter that is able to minimize the incidence of disability. In this paper, we drew the determinants by element for implement an excellent semiconductor optical filters. Based on this, we had to be able to implement the semiconductor optical filter that is able to be mounted on the actual ATM system through future studies.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제27권1호
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• pp.27-32
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• 2014

In this paper, PZT piezoelectric ceramic specimens with 4 compositions (Zr/Ti=50/50, 53/47, 56/44, 58/42) in $Pb(Zr,Ti)O_3$ system were fabricated. We studied effects of poling strength and thermal aging on the temperature characteristics of eletromechanical coupling factor k31 of the specimens, which were poled with the DC electric fields, 1.5, 2.5 and 3.5 kV/mm respectively and thermally aged for an hour at $200^{\circ}C$. The eletromechanical coupling factor k31 of the specimen with the composition Zr/Ti= 53/47, nearest to the morphotropic phase boundary decreased the most greatly, irrelevant to the intensity of poling field, due to 1st thermal aging. And the temperature coefficient of eletromechanical coupling factor k31 was (-) in the tetragonal phase composition and (+) in the rhombohedral phase composition, which is reverse in the temperature coefficient of resonance frequency. It is interesting that eletromechanical coupling factor k31 of PZT ceramics is shown to be able to increase as temperature increase in the interval $-20{\sim}80^{\circ}C$.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• 제10권5호
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• pp.52-56
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• 1996

Fluorescent lamps are widely accepted to energy efficient commercial lighting applications. In designing a fluorescent lamp system, a ballast design heavily relies on the characteristic of a fluorescent lamp under consideration. Especially, at startup time, the transient characteristic of a fluorescent lamp puts much tighter specification of a design. In this paper, based on the transient characteristic at the startup time, a transient behavioral model of a fluorescent lamp is presented with an equivalent circuit. The model is applicable to the wide range of fluorescent lamps provided by different manufacturers. The experimental results are compared with the results provided by PSPICE simulation. The result shows the model is effective In practice. As a result, we could identify more accurate startup constraints to decide the design of either an electro mechanical or an electronic ballast.

• Journal of Power Electronics
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• 제16권5호
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• pp.1843-1850
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• 2016

This study focused on predicting the fatigue life of an insulated gate bipolar transistor (IGBT) power module for electric locomotives. The effects of different wiring technologies, including aluminum wires, copper wires, aluminum ribbons, and copper ribbons, on solder fatigue life were investigated to meet the high power requirement of the IGBT module. The module's temperature distribution and solder fatigue behavior were investigated through coupled electro-thermo-mechanical analysis based on the finite element method. The ribbons attained a chip junction temperature that was 30℃ lower than that attained with conventional round wires. The ribbons also exhibited a lower plastic strain in comparison with the wires. However, the difference in plastic strain and junction temperature among the different ribbon materials was relatively small. The ribbons also exhibited different crack propagation behaviors relative to the wires. For the wires, the cracks initiated at the outmost edge of the solder, whereas for the ribbons, the cracks grew in the solder layer beneath the ribbons. Comparison of fatigue failure areas indicated that ribbon bonding technology could substantially enhance the fatigue life of IGBT modules and be a potential candidate for high power modules.

• Journal of Power Electronics
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• 제11권1호
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• pp.82-89
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• 2011

Differences in the frequency characteristic applied to a ripple current may shorten fuel cell life span and worsen the fuel efficiency. Therefore, this paper presents an experimental analysis of the ripple current applied variable frequency characteristic in a polymer electrolyte membrane fuel cell (PEMFC). This paper provides the first attempt to examine the impact of ripple current through immediate measurements on a single cell test. After cycling for hours at three frequencies, each polarization and impedance curve is obtained and compared with those of a fuel cell. Through experimental results, it can be absolutely concluded that low frequency ripple current leads to long-term degradation of a fuel cell. Three different PEMFC failures such as membrane dehydration, flooding and carbon monoxide (CO) poisoning that lead to an increase in the impedance magnitude at low frequencies are simply introduced.

• Journal of the Korean Society for Precision Engineering
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• 제22권2호
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• pp.180-187
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• 2005

This paper is focused on the development of the flexible electrode for disc-type polymer actuators using Segmented Polyurethane(SPU). This paper consists of two parts. The one is about the mechanical property such as elastic modulus. these parameters mainly affect behaviors of polymer actuators and the other is about the electro-chemical property such as the surface resistance of the composite electrode affects the strength of electrostatic force, results in the deformation of polymer actuators. The Young's modulus was measured by UTM. As result, by increasing the modulus of a body of polymer actuators, the maximum displacement of polymer actuators are decreased. The surface resistance of the electrode was measured by 4 point probe system. Compared with the conductive silver grease, the displacement of polymer actuators using carbon black(CB) composite electrodes is comparably small but CB composite electrode should be the practical approach for the improvement of the performance of all-solid actuators, compared with another types of electrode materials.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2002년도 추계학술대회 논문집 Vol.15
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• pp.387-390
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• 2002

SiC direct bonding technology is very attractive for both SiCOI(SiC-on-insulator) electric devices and SiC-MEMS(micro electro mechanical system) fields because of its application possibility in harsh environments. This paper presents pre-bonding techniques with variation of HF pre-treatment conditions for 2 inch SiC wafer direct bonding using PECVD(plasma enhanced chemical vapor deposition) oxide. The PECVD oxide was characterized by XPS(X-ray photoelectron spectrometer) and AFM(atomic force microscopy). The characteristics of the bonded sample were measured under different bonding conditions of HF concentration and an applied pressure. The bonding strength was evaluated by the tensile strength method. The bonded interface was analyzed by using IR camera and SEM(scanning electron microscope). Components existed in the interlayer were analyzed by using FT-IR(fourier transform infrared spectroscopy). The bonding strength was varied with HF pre-treatment conditions before the pre-bonding in the range of $5.3 kgf/cm^2$ to $15.5 kgf/cm^2$

• Transactions of Materials Processing
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• 제13권3호
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• pp.285-289
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• 2004

Micro tensile test specimens of thin film single crystal silicon for the most useful structural materials in MEMS (Micro Electro Mechanical System) devices were fabricated using SOI (Silicon-on-Insulator) wafers and MEMS processes. Dimensions of micro tensile test specimens were thickness of $7\mu\textrm{m}$, width of 50~$350\mu\textrm{m}$, and length of 2mm. Top and bottom silicon were etched using by deep RIE (Reactive Ion Etching). Thin film aluminum markers on testing region of specimens with width of $5\mu\textrm{m}$, lengths of 30~$180\mu\textrm{m}$ and thickness of 200 nm for measuring tensile strain were fabricated by aluminum wet etching method. Fabricated side wall angles of aluminum marker were about $45^{\circ}~50^{\circ}$. He-Ne laser with wavelength of 633nm was used for checking fringed patterns.