• Journal of Acupuncture Research
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• v.15 no.2
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• pp.393-406
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• 1998

Twenty five cases of the patient admission-treatment from chiefly complained of neck pain observed clinically from first January 1997 to thirty first December 1997 in the Dept. of Acupuncture and Moxibustion, Oriental Hospital, Taejon University, Taejon, Korea. And the results were obtained as follows; 1. The distribution of sex was male 13(52%) cases, female 12(48%) cases and the male to female ratio was 1.1 : 1. The distribution of age was the most predominant as the fifties 6(24%) cases. 2. The contributing factors were the most predominant as the reason unknown 9(36%) cases, unstable position 5(20%) cases. 3. The distribution of duration was the most predominant of 9(36%) cases in a week. 4. The distribution of before admission-treatments were the most predominant as west-medication 13(32.5%) cases. 5. The distribution of patient's condition of first treatment was the most predominant as Gr.III 13(52%) cases. 6. The distribution of duration for admission was the most predominant as 13(52%) cases in a week. 7. The distribution of radiological studies were the nust predominant as the HIVD 26(63.4%) cases. 8. The distribution of clinical symptoms were the most predominant as neck pain 25(21.0%) cases, radiating pain to the upper extremities 23(19.3%) cases. 9. The distribution of located on clinical syrnptoms were the most predominant as neck-shoulder and back-upper extremities 11(44%) cases. 10. The distribution of clinical diagnosis was the most predominant as HIVD 16(45.7%) cases. 11. The distribution of methods of treatment were the most predominant as Acupuncture -­ Herb Medication - Electro Acupuncture treatment 8(32%) cases. 12. The effect of treatment by discharge was the most predominant of 11(44%) cases as Good result.

• Journal of IKEEE
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• v.11 no.1 s.20
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• pp.54-60
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• 2007

In this study novel ESD protection device, namely, N/P-type Low Voltage Triggered SCR, has been proposed, for high speed I/O interface. Proposed device could lower high trigger voltage($\sim$20V) of conventional SCR and reduce latch-up phenomenon of protection device during the normal condition. In this Study, the proposed NPLVTSCR has been simulated using TMA MEDICI device simulator for electrical characteristic. Also the proposed device's test pattern was fabricated using 90nm TSMC's CMOS process and was measured electrical characteristic and robustness. In the result, NPLVTSCR has 3.2V $\sim$ 7.5V trigger voltage and 2.3V $\sim$ 3.2V holding voltage by changing PMOS gate length and it has about 2kV, 7.5A HBM ESD robustness(IEC61000-4-2).

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.285-293
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• 2004

Oxidation behavior of 304 and 430 stainless steel were studied using thin film X-ray analysis and glow discharge spectrum analysis (here-after GDS). The oxidation layer of 304 stainless steel was composed of $Cr_2O_3\;and\;FeCrO_4$ and its thickness was about $1.5{\mu}m$ after $1\~5$ minutes of annealing at $1120^{\circ}C$ open air. However, the oxidation layer of 430 stainless steels was mainly composed of $Cr_2O_3$ and its typical thickness was 0.5um after $1\~5$ minutes of annealing at $1000^{\circ}C$ open air. Electro-chemical analysis revealed that the descaling of oxidation layer could be activated by Fe, Cr dissolution from the matrix behind the oxidation layer at the current density of $5\~10ASD$ and by Fe, Cr-oxide dissolution from the oxidation layer at the current density over than 10ASD. Electrolytic stripping of 430 and 304 revealed the intial incubation period of descaling by oxygen evolving at low current density range such as $5\~10ASD$. However the dissolution of oxide layer was occurred when applying the anodic current of $10\~20ASD$ on 430 and 304 stainless steels. It was suggested that the electrolytic pickling of high Cr bearing stainless steel such as 430 and 304 seemed to be the more effective in the high current density range such as $10\~20ASD$ than the low current density range such as $5\~10ASD$.

• Journal of Powder Materials
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• v.22 no.4
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• pp.229-233
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• 2015

Porous metallic glass compact (PMGC) are developed by electro-discharge sintering (EDS) process of gas atomized $Zr_{41.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ metallic glass powder under of 0.2 kJ generated by a $450{\mu}F$ capacitor being charged to 0.94 kV. Functional iron-oxides are formed and growth on the surface of PMGCs via hydrothermal synthesis. It is carried out at $150^{\circ}C$ for 48hr with distilled water of 100 mL containing Fe ions of 0.18 g/L. Consequently, two types of iron oxides with different morphology which are disc-shaped $Fe_2O_3$ and needle-shaped $Fe_3O_4$ are successfully formed on the surface of the PMGCs. This finding suggests that PMGC witih hydrothermal technique can be attractive for the practical technology as a new area of structural and functional materials. And they provide a promising road map for using the metallic glasses as a potential functional application.

• Journal of the Korean Society for Nondestructive Testing
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• v.19 no.6
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• pp.426-432
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• 1999

A plus-point eddy current test(ECT) probe was developed to examine the defects on the welds of pumps, valves, and pipings which are the major components of the electric power plants, non-destructive evaluation (NDE) techniques for detecting and sizing the flaws were studied adapting this probe. Differential plus-point ECT probe is consists of two "I"-type coils crossed each other and has an advantage having a small influence on the sensitivity by lift-off variation to the conventional types of probe. The specimens with crack-like electro discharge machining(EDM) notches on the weld of type 304 stainless-steel were fabricated in order to evaluate the plus-point ECT probe response to the flaws. NDE techniques to detect and size the flaws and estimate the flaw type were established with this specimens.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.10
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• pp.979-986
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• 2013

In this paper, a TVS diode which is commonly used as a ESD protector in wireless communication devices could cause antenna wireless sensitivity to decrease has been analyzed. When a smartphone doesn't have enough space to place many components, there would be its speaker near antenna area. In order to protect ESD coming through the speaker there also could be a TVS within antenna GND area. Digital audio signal which was sent to speaker and CDMA RF communication signal coupled from antenna was mixed by TVS. And this leakage current running through TVS resulted in decrease of antenna wireless sensitivity. The results of various experiments can be explained using circuit simulation. Following works will give us some insights that can reduce unwanted summation of digital and RF signal due to nonlinearity of ESD protectors.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.529-534
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• 2002

It was recommended for all ship engaged in international voyages to carry the dedicated Digital Selective Calling receiver, DSC equipment, VHF transceiver, etc according to Global Maritime Distress & Safety System. Also International Maritime Organization recommended for navigation and communication equipments to applicate the EMC regulations, therefore most of electronic equipments using in the vessel to be faced with problems to cope with new regulations. This study has applied and analyzed the EMC for an equipment integrated with Ch.70 dedicated DSC receiver, DSC equipment, VHF transceiver and groped for solutions to cope with. The test has applied the electromagnetic interference such as the measurement for unwanted emissions from conductive & radio emission and the electromagnetic susceptibility such as the immunity from voltage, frequency variation and electro static discharge, hence comes to be understand the problems related with the power and the earth.

• International Journal of Precision Engineering and Manufacturing
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• v.8 no.2
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• pp.38-43
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• 2007

This paper describes ultrasonically assisted grinding used to obtain a glossy surface quickly and precisely. High-quality surfaces are required for plastic injection molding dies used in the production of plastic parts such as dials for cellular phones. Traditionally, in order to finish the dies, manual polishing by a skilled worker has been required after the machining processes, such as electro discharge machining (EDM), which leaves an affected layer, and milling, which leaves tooling marks. However, manual polishing causes detrimental geometrical deviations of the die and consumes several days to finish a die surface. Therefore, a machining process for finishing dies without manual polishing to improve the surface roughness and form accuracy would be extremely valuable. In this study, a 3D positioning machine equipped with an ultrasonic spindle was used to conduct grinding experiments. An electroplated diamond tool was used for these experiments. Generally, diamond tools cannot grind steel because of excessive wear as a result of carbon atoms diffusing into bulk steel and chips. However, ultrasonically assisted grinding can achieve a fine surface (roughness Rz of $0.4{\mu}m$) on die steel without severe tool wear. The final aim of this study is to realize mirror surface grinding for injection molding dies without manual polishing. To do this, it is necessary to fabricate an electroplated diamond tool with high form accuracy and low run-out. This paper describes a tool-making method for high precision grinding and the grinding performance of a self-electroplated tool. The ground surface textures, tool performance and tool life were investigated A ground surface roughness Rz of 0.14 um was achieved Our results show that the spindle speed, feed rate and cross feed affected the surface texture. One tool could finish $5000mm^2$ of die steel surface without any deterioration of the ground surface roughness.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.12
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• pp.105-112
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• 2009

In this paper, we investigated abnormal ESD failure on guard-rings in the smart power IC fabricated with $0.35{\mu}m$ Bipolar-CMOS-DMOS (BCD) technology. Initially, ESD failure occurred below 200 V in the Machine Model (MM) test due to current crowding in the parasitic diode associated with the guard-rings which are generally adopted to prevent latch-up in high voltage devices. Optical Beam Induced Resistance Charge (OBIRCH) and Scanning Electronic Microscope (SEM) were used to find the failure spot and 3-D TCAD was used to verify cause of failure. According to the simulation results, excessive current flows at the comer of the guard-ring isolated by Local Oxidation of Silicon (LOCOS) in the ESD event. Eventually, the ESD failure occurs at that comer of the guard-ring. The modified comer design of the guard-ring is proposed to resolve such ESD failure. The test chips designed by the proposed modification passed MM test over 200 V. Analyzing the test chips statistically, ESD immunity was increased over 20 % in MM mode test. In order to avoid such ESD failure, the automatic method to check the weak point in the guard-ring is also proposed by modifying the Design Rule Check (DRC) used in BCD technology. This DRC was used to check other similar products and 24 errors were found. After correcting the errors, the measured ESD level fulfilled the general industry specification such as HBM 2000 V and MM 200V.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.146-147
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• 2011

Processing a large area substrate for liquid crystal display (LCD) or solar panel applications in a capacitively coupled plasma (CCP) reactor is becoming increasingly challenging because of the size of the substrate size is no longer negligible compared to the wavelength of the applied radio frequency (RF) power. The situation is even worse when the driving frequency is increased to the Very High Frequency (VHF) range. When the substrate size is still smaller than 1/8 of the wavelength, one can obtain reasonably uniform process results by utilizing with methods such as tailoring the precursor gas distribution by adjustingthrough shower head hole distribution or hole size modification, locally adjusting the distance between the substrate and the electrode, and shaping shower head holes to modulate the hollow cathode effect modifying theand plasma density distribution by shaping shower head holes to adjust the follow cathode effect. At higher frequencies, such as 40 MHz for Gen 8.5 (2.2 m${\times}$2.6 m substrate), these methods are not effective, because the substrate is large enough that first node of the standing wave appears within the substrate. In such a case, the plasma discharge cannot be sustained at the node and results in an extremely non-uniform process. At Applied Materials, we have studied several methods of modifying the standing wave pattern to adjusting improve process non-uniformity for a Gen 8.5 size CCP reactor operating in the VHF range. First, we used magnetic materials (ferrite) to modify wave propagation. We placed ferrite blocks along two opposing edges of the powered electrode. This changes the boundary condition for electro-magnetic waves, and as a result, the standing wave pattern is significantly stretched towards the ferrite lined edges. In conjunction with a phase modulation technique, we have seen improvement in process uniformity. Another method involves feeding 40 MHz from four feed points near the four corners of the electrode. The phase between each feed points are dynamically adjusted to modify the resulting interference pattern, which in turn modulate the plasma distribution in time and affect the process uniformity. We achieved process uniformity of <20% with this method. A third method involves using two frequencies. In this case 40 MHz is used in a supplementary manner to improve the performance of 13 MHz process. Even at 13 MHz, the RF electric field falls off around the corners and edges on a Gen 8.5 substrate. Although, the conventional methods mentioned above improve the uniformity, they have limitations, and they cannot compensate especially as the applied power is increased, which causes the wavelength becomes shorter. 40 MHz is used to overcome such limitations. 13 MHz is applied at the center, and 40 MHz at the four corners. By modulating the interference between the signals from the four feed points, we found that 40 MHz power is preferentially channeled towards the edges and corners. We will discuss an innovative method of controlling 40 MHz to achieve this effect.