• Title/Summary/Keyword: electrical characteristic

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DRAM Package Substrate Using Aluminum Anodization (알루미늄 양극산화를 사용한 DRAM 패키지 기판)

  • Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.4
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    • pp.69-74
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    • 2010
  • A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

A Comparison Study of Input ESD Protection schemes Utilizing Thyristor and Diode Devices (싸이리스터와 다이오드 소자를 이용하는 입력 ESD 보호방식의 비교 연구)

  • Choi, Jin-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.4
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    • pp.75-87
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    • 2010
  • For two input-protection schemes suitable for RF ICs utilizing the thyristor and diode protection devices, which can be fabricated in standard CMOS processes, we attempt an in-depth comparison on HBM ESD robustness in terms of lattice heating inside protection devices and peak voltages developed across gate oxides in input buffers, based on DC, mixed-mode transient, and AC analyses utilizing a 2-dimensional device simulator. For this purpose, we construct an equivalent circuit for an input HBM test environment of a CMOS chip equipped with the input ESD protection circuits, which allows mixed-mode transient simulations for various HBM test modes. By executing mixed-mode simulations including up to six active protection devices in a circuit, we attempt a detailed analysis on the problems, which can occur in real tests. In the procedure, we suggest to a recipe to ease the bipolar trigger in the protection devices and figure out that oxide failure in internal circuits is determined by the junction breakdown voltage of the NMOS structure residing in the protection devices. We explain the characteristic differences of two protection schemes as an input ESD protection circuit for RF ICs, and suggest valuable guidelines relating design of the protection devices and circuits.

Evaluation of Clinical Usefulness of EIS(Electro Interstitial Scan) (EIS(Electro Interstitial Scan) 방법의 임상적 유효성 연구)

  • Kim, Soochan;Bae, Jang-Han;Jun, Min-Ho;Kim, Jaeuk U.
    • Journal of the Institute of Electronics and Information Engineers
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    • v.52 no.12
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    • pp.124-133
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    • 2015
  • Electro interstitial scan shows potential as a non-invasive screening method. It can discriminate some diseases based on electric current response to induce low intensity direct current to limbs or local area of body. DDFAO was invented in France and it is claimed that multi-channel EIS(Electro Interstitial Scan) is useful for various diseases, especially, diagnoses of endocrine system such as diabetics are very effective. In this study, we verified the repeatability and sensitivity of DDFAO by using a RC phantom model and its clinical usefulness using data obtained from normal and diabetes subject groups. As a result, it showed the repeatability and the output change according to change of phantom characteristic, but it was hard to distinguish normal and patient groups non-invasively with just six surface electrodes of DDFAO. The repeatability and the clinical accuracy was not sufficient for screening or diagnostic purposes, as well. In spite of the results with low repeatability and accuracy conducted in this study, we still need further investigations to improve the EIS-based measurement method; EIS is very convenient and simple and it shows potential as a screening tool of the whole body health conditions rather than localized disease diagnosis.

Implementation of an LTCC RF Front-End Module Considering Parasitic Elements for Wi-Fi and WiMAX Applications (기생 성분을 고려한 Wi-Fi와 WiMAX용 LTCC 무선 전단부 모듈의 구현)

  • Kim, Dong-Ho;Baek, Gyung-Hoon;Kim, Dong-Su;Ryu, Jong-In;Kim, Jun-Chul;Park, Jong-Chul;Park, Chong-Dae
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.21 no.4
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    • pp.362-370
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    • 2010
  • In this paper, a compact RF Front-end module for Wireless Fidelity(Wi-Fi) and Worldwide Interoperability for Microwave Access(WiMAX) applications is realized by low temperature co-fired ceramic(LTCC) technology. The RF Front-end module is composed of three LTCC band-pass filters, a Film Bulk Acoustic Resonator(FBAR) filter, fully embedded matching circuits, an SPDT switch for mode selection, an SPDT switch for Tx/Rx selection, and an SP4T switch for band selection. The parasitic elements of 0.2~0.3 pF are generated by the structure of stacking in the top pad pattern for DC block capacitor of SPDT switch for mode selection. These kinds of parasitic elements break the matching characteristic, and thus, the overall electrical performance of the module is degraded. In order to compensate it, we insert a parallel lumped-element inductor on capacitor pad pattern for DC block, so that we obtain the optimized performance of the RF Front-end module. The fabricated RF front-end module has 12 layers including three inner grounds and it occupies less than $6.0mm{\times}6.0mm{\times}0.728mm$.

The Effect of Glass Fabric Separator Elongation on Electric Property in Structural Battery (유리섬유 분리막 인장으로 인한 구조전지의 전기적 물성 변화)

  • Shin, Jae-Sung;Park, Hyun-Wook;Park, Mi-Young;Kim, Chun-Gon;Kim, Soo-Hyun
    • Composites Research
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    • v.30 no.1
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    • pp.46-51
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    • 2017
  • Structural battery has been researched extensively to combine the functions of the battery and structure without gravimetric or volumetric increments compared to their individual components. The main idea is to employ carbon fabric as the reinforcement and electrode, glass fabric as the separator, and solid-state electrolyte which can transfer load. However, state-of-the-art solid-state electrolytes do not have sufficient load carrying functionality and exhibiting appropriate ion conductivity simultaneously. Therefore, in this research, a system which has both battery and load carrying capabilities using glass fabric separator and liquid electrolyte was devised and tested to investigate the potential and feasibility of this structural battery system and observe electric properties. It was observed that elongating separator decreased electrical behavior stability. A possible cause of this phenomenon was the elongated glass fabric separator inadequately preventing the penetration of small particles of the cathode material into the anode. This problem was verified additionally by using a commercial separator. The characteristic of the glass fabric and the interface between the electrode and glass fabric needed to be further studied for the realization of such a load carrying structural battery system.

Decision Support System of Obstacle Avoidance for Mobile Vehicles (다양한 자율주행 이동체에 적용하기 위한 장애물 회피의사 결정 시스템 연구)

  • Kang, Byung-Jun;Kim, Jongwon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.19 no.6
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    • pp.639-645
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    • 2018
  • This paper is intended to develop a decision model that can be applied to autonomous vehicles and autonomous mobile vehicles. The developed module has an independent configuration for application in various driving environments and is based on a platform for organically operating them. Each module is studied for decision making on lane changes and for securing safety through reinforcement learning using a deep learning technique. The autonomous mobile moving body operating to change the driving state has a characteristic where the next operation of the mobile body can be determined only if the definition of the speed determination model (according to its functions) and the lane change decision are correctly preceded. Also, if all the moving bodies traveling on a general road are equipped with an autonomous driving function, it is difficult to consider the factors that may occur between each mobile unit from unexpected environmental changes. Considering these factors, we applied the decision model to the platform and studied the lane change decision system for implementation of the platform. We studied the decision model using a modular learning method to reduce system complexity, to reduce the learning time, and to consider model replacement.

Electrical Characteristic of IGZO Oxide TFTs with 3 Layer Gate Insulator

  • Lim, Sang Chul;Koo, Jae Bon;Park, Chan Woo;Jung, Soon-Won;Na, Bock Soon;Lee, Sang Seok;Cho, Kyoung Ik;Chu, Hye Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.344-344
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    • 2014
  • Transparent amorphous oxide semiconductors such as a In-Ga-Zn-O (a-IGZO) have advantages for large area electronic devices; e.g., uniform deposition at a large area, optical transparency, a smooth surface, and large electron mobility >10 cm2/Vs, which is more than an order of magnitude larger than that of hydrogen amorphous silicon (a-Si;H).1) Thin film transistors (TFTs) that employ amorphous oxide semiconductors such as ZnO, In-Ga-Zn-O, or Hf-In-Zn-O (HIZO) are currently subject of intensive study owing to their high potential for application in flat panel displays. The device fabrication process involves a series of thin film deposition and photolithographic patterning steps. In order to minimize contamination, the substrates usually undergo a cleaning procedure using deionized water, before and after the growth of thin films by sputtering methods. The devices structure were fabricated top-contact gate TFTs using the a-IGZO films on the plastic substrates. The channel width and length were 80 and 20 um, respectively. The source and drain electrode regions were defined by photolithography and wet etching process. The electrodes consisting of Ti(15 nm)/Al(120 nm)/Ti(15nm) trilayers were deposited by direct current sputtering. The 30 nm thickness active IGZO layer deposited by rf magnetron sputtering at room temperature. The deposition condition is as follows: a rf power 200 W, a pressure of 5 mtorr, 10% of oxygen [O2/(O2+Ar)=0.1], and room temperature. A 9-nm-thick Al2O3 layer was formed as a first, third gate insulator by ALD deposition. A 290-nm-thick SS6908 organic dielectrics formed as second gate insulator by spin-coating. The schematic structure of the IGZO TFT is top gate contact geometry device structure for typical TFTs fabricated in this study. Drain current (IDS) versus drain-source voltage (VDS) output characteristics curve of a IGZO TFTs fabricated using the 3-layer gate insulator on a plastic substrate and log(IDS)-gate voltage (VG) characteristics for typical IGZO TFTs. The TFTs device has a channel width (W) of $80{\mu}m$ and a channel length (L) of $20{\mu}m$. The IDS-VDS curves showed well-defined transistor characteristics with saturation effects at VG>-10 V and VDS>-20 V for the inkjet printing IGZO device. The carrier charge mobility was determined to be 15.18 cm^2 V-1s-1 with FET threshold voltage of -3 V and on/off current ratio 10^9.

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Annealed effect on the Optical and Electrical characteristic of a-IGZO thin films transistor.

  • Kim, Jong-U;Choe, Won-Guk;Ju, Byeong-Gwon;Lee, Jeon-Guk
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2010.05a
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    • pp.53.2-53.2
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    • 2010
  • 지금까지 능동 구동 디스플레이의 TFT backplane에 사용하고 있는 채널 물질로는 수소화된 비정질 실리콘(a-Si:H)과 저온 폴리실리콘(low temperature poly-Si)이 대표적이다. 수소화된 비정질 실리콘은 TFT-LCD 제조에 주로 사용되는 물질로 제조 공정이 비교적 간단하고 안정적이며, 생산 비용이 낮고, 소자 간 특성이 균일하여 대면적 디스플레이 제조에 유리하다. 그러나 a-Si:H TFT의 이동도(mobility)가 1 cm2/Vs이하로 낮아 Full HD 이상의 대화면, 고해상도, 고속 동작을 요구하는 UD(ultra definition)급 디스플레이를 개발하는데 있어 한계 상황에 다다르고 있다. 또한 광 누설 전류(photo leakage current)의 발생을 억제하기 위해서 화소의 개구율(aperture ratio)을 감소시켜야하므로 패널의 투과율이 저하되고, 게이트 전극에 지속적으로 바이어스를 인가 시 TFT의 문턱전압(threshold voltage)이 열화되는 문제점을 가지고 있다. 문제점을 극복하기 위한 대안으로 근래 투명 산화물 반도체(transparent oxide semiconductor)가 많은 관심을 얻고 있다. 투명 산화물 반도체는 3 eV 이상의 높은 밴드갭(band-gap)을 가지고 있어 광 흡수도가 낮아 투명하고, 광 누설 전류의 영향이 작아 화소 설계시 유리하다. 최근 다양한 조성의 산화물 반도체들이 TFT 채널 층으로의 적용을 목적으로 활발하게 연구되고 있으며 ZnO, SnO2, In2O3, IGO(indium-gallium oxide), a-ZTO(amorphous zinc-tin-oxide), a-IZO (amorphous indium-zinc oxide), a-IGZO(amorphous indium-galliumzinc oxide) 등이 그 예이다. 이들은 상온 또는 $200^{\circ}C$ 이하의 낮은 온도에서 PLD(pulsed laser deposition)나 스퍼터링(sputtering)과 같은 물리적 기상 증착법(physical vapor deposition)으로 손쉽게 증착이 가능하다. 특히 이중에서도 a-IGZO는 비정질임에도 불구하고 이동도가 $10\;cm2/V{\cdot}s$ 정도로 a-Si:H에 비해 월등히 높은 이동도를 나타낸다. 이와 같이 a-IGZO는 비정질이 가지는 균일한 특성과 양호한 이동도로 인하여 대화면, 고속, 고화질의 평판 디스플레이용 TFT 제작에 적합하고, 뿐만 아니라 공정 온도가 낮은 장점으로 인해 플렉시블 디스플레이(flexible display)의 backplane 소재로서도 연구되고 있다. 본 실험에서는 rf sputtering을 이용하여 증착한 a-IGZO 박막에 대하여 열처리 조건 변화에 따른 a-IGZO 박막들의 광학적, 전기적 특성변화를 살펴보았고, 이와 더불어 a-IGZO 박막을 TFT에 적용하여 소자의 특성을 분석함으로써, 열처리에 따른 Transfer Curve에서의 우리가 요구하는 Threshold Voltage(Vth)의 변화를 관찰하였다.

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An Epidemiological Observation of Fire Accident in Korea (화재사고(火災事故)(WHO-E 916)에 관(關)한 역학적관찰(疫學的觀察))

  • Lee, Chong-Dae;Han, Seong-Un;Bin, Soon-Duk;Chu, In-Ho
    • Journal of Preventive Medicine and Public Health
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    • v.1 no.1
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    • pp.43-49
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    • 1968
  • Epidemiological and statistical observations were made of fire hazards that occurred during the past 18 years, 1948 to 1965. Injury and mortality rates for all ages were computed chronologically. For the years of 1955, 1961 and 1965, all fire accidents were epidemiologically analysed to draw characteristic patterns in relation to the seasonal and 24 hour distribution, causes and sites of accidents etc.. Fire hazards observed herein are the categorys E 916 of the International Classification of Causes of Death, 1955, and includes all accidents caused by fire and explosion of combustible materials. The following conclusion was made: 1. The average number of annual deaths due to fire was 183 and the number of the in jured due to the same cause was 335. The mortality rate per 100,000 population was 0.8 and the ratio of injuries per death was 1.83. 2. The casually rate including both the dead and injured was 5.0 per 100,000 in Seoul, the highest among the provinces and followed by 3.4 in Cheju -Do, 2.1 in Kangwon-Do, 1.7 in Kyunggi-Do accordingly. The other provinces had a range of 0.6 to 1.2. 3. The monthly distribution of fro accidents showed that the winter months, December through February, had more frequent accidents, while the summer season, June through August had less. The 24 hour distribution of accidents showed more cases from 12:00 to 18:00 and less from 4:00 to 10:00 hours. 4. The per cent distribution of causes of accidents showed; 90.0% for careless, 10.0% for arson. The cause of carelessness was further breakdown into; 15.0% for kitchen fire places, 13.8% for fire playing, 9,4% for electrical heating and wires, 8.3% for fuels, 6.3% for matches, 5.2% for ash dumps and the remaining for others. 5. The accidents as classified by place revealed that 56.8% of the total occurred at the common dwelling houses, 11.3 at various industrial workshops, 9.3% at the street shops and the remaining at the miscellaneous places.

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Electrical and Optical Characteristic Analysis of Silicon Nitride Film Deposited by $N_2$ Ambient (질소 가스 분위기에서 증착된 실리콘 질화막의 전기적, 광학적 특성 분석)

  • Gong, Dae-Yeong;Jung, Woo-Won;Yang, Doo-Hwan;Kim, Sun-Yong;Lee, Yong-Woo;Ko, Ji-Soo;Choi, Byoung-Deok;Yi, Jun-Sin
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.11a
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    • pp.384-384
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    • 2009
  • 최근 태양전지 개발이 본격화 되면서 태양전지 웨이퍼 표면에서의 재결합에 의한 손실을 줄이고 반사도를 감소시키기 위한 ARC 개발이 활발히 진행되고 있다. 이를 위해 널리 사용하는 ARC 물질로 수소화된 실리콘 질화막이 있다. 수소화된 실리콘 질화막은 PECVD 법으로 저온에서 실리콘 기판 위에 증착 가능한 장점이 있다. 또한 실리콘 질화막의 광학적, 전기적인 특성은 화학적 조성비에 의해 결정되며 증착온도 가변에 따라 균일도 및 굴절률 조절을 가능케 하여 태양전지의 효율을 향상 시킬 수 있다. 따라서 본 연구에서는 수소화된 실리콘 질화막을 태양전지에 적용하기 위해 질소 가스 분위기에서 PECVD를 이용하여 증착하고 그 특성을 분석하였다. 박막은 0.8 Torr의 압력에서 $150^{\circ}C{\sim}450^{\circ}C$의 기판 온도로 증착되었으며 이때의 RF power은 100W ~ 300W로 가변 하였다. 증착된 박막은 1.94 에서 2.23의 폭넓은 굴절률 값을 가지고 있었다. $SiH_4/NH_3$ 가스 비의 증가에 따라 박막 두께와 굴절률이 감소함을 확인 할 수 있었다. 이는 $NH_3$ 가스의 상대적인 증가에 따라 Si 생성을 선행하는 $SiH_4$ 가스의 부분압이 제한되기 때문이고, 이러한 결과로 박막내에 질소 원자가 증가함에 따라 N-H 결합이 증가하여 n-rich인 박막 상태가 되기 때문으로 분석된다. 증착된 실리콘 질화막의 소수반송자 수명 측정 결과 굴절률 2.23인 박막의 경우 약 87 us의 수명을 나타냈으며, 굴절률이 1.94로 줄어듦에 따라 소수반송자 수명 역시 79 us로 감소하였다. 수소화된 실리콘 질화막은 n-rich 보다 Si-rich 인 경우 effective 반송자 수명을 증가시켜 표면 재결합 속도를 줄이는데 유용함을 확인하였다. 또한 증착온도가 증가할수록, RF power가 증가 할수록 소수반송자 수명 역시 증가하였다. 반사도의 경우 $SiH_4$의 비율이 증가할수록 반사도가 감소함을 확인 하였으며, 증착온도 증가에 따라, RF power 증가에 따라 반사도가 감소하였다. 결과적으로 $450^{\circ}C$의 기판온도와 300W의 RF power에서 증착된 실리콘 질화막의 경우 가장 우수한 전기적, 광학적 특성을 보여주었다.

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