다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(I) - 단열성능 및 물리적 성질 - (Characteristics of Low Density Fiberboards for Insulation Material with Different Adhesives (I) - Thermal Insulation Performance and Physical Properties -)
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- Journal of the Korean Wood Science and Technology
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- 제45권3호
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- pp.360-367
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- 2017