Journal of the Korean Wood Science and Technology

The Korean Society of Wood Science & Technology (한국목재공학회)
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Characteristics of Low Density Fiberboards Bonded with Different Adhesives for Thermal Insulation (II) - Formaldehyde·Total Volatile Organic Compounds Emission Properties and Combustion Shapes -

다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(II) - 폼알데하이드·총휘발성유기화합물 방출 특성 및 연소 형상 -

  • Jang, Jae-Hyuk (Department of Forest Products, National Institute of Forest Science) ;
  • Lee, Min (Department of Forest Products, National Institute of Forest Science) ;
  • Kang, Eun-Chang (Department of Forest Products, National Institute of Forest Science) ;
  • Lee, Sang-Min (Department of Forest Products, National Institute of Forest Science)
  • 장재혁 (국립산림과학원 임산공학부) ;
  • 이민 (국립산림과학원 임산공학부) ;
  • 강은창 (국립산림과학원 임산공학부) ;
  • 이상민 (국립산림과학원 임산공학부)
  • Received : 2017.07.10
  • Accepted : 2017.08.20
  • Published : 2017.09.25
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Abstract

Woodfiber insulation board can be considered as a one of the key material for low energy consumption, comfortable and safety construction of residential space because of its eco-friendly and high thermal insulation performance. This study was carried out to investigate the formaldehyde (HCHO) total volatile organic compounds (TVOC) emission properties and combustion shapes by flame test of low density fiberboards (LDFs) prepared with different adhesives. HCHO TVOC emission and combustion properties of LDFs prepared by melamine urea formaldehyde (MUF), phenol formaldehyde (PF), emulsified methylene diphenyl diisocyanate (eMDI) and latex resin adhesives were measured by desiccator method, 20 L chamber method, and flame test, respectively. As results, LDFs manufactured by MUF, eMDI and latex resin adhesives satisfied the Super $E_0$ grade of HCHO emission performance except PF resin. Furthermore, TVOC emission of all LDFs were satisfied the Korean indoor air quality standard (below $400{\mu}g/m^2{\cdot}h$). Especially, LDF with eMDI resin adhesive showed the lowest HCHO and TVOC emissivity, that $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$, respectively. However, eMDI emitted the small amount ($3{\mu}g/m^2{\cdot}h$) of toluene in VOC components. In the flame test, LDF with MUF resin adhesives showed the most favorable shape after flame test compare to LDFs prepared other adhesives. Based on HCHO and TVOC emission, and combustion shapes, MUF resin adhesive may be recommended to prepare LDF for insulation purpose.

목섬유 단열재는 친환경 고단열성에 기인하여 저에너지 및 쾌적하고 안전한 주거 공간 형성을 위한 핵심 건축재료로 고려된다. 본 연구에서는 서로 다른 접착제로 제조한 단열재용 저밀도섬유판의 폼알데하이드(HCHO) 총휘발성유기화합물(TVOC) 방출 및 화염에 의한 연소 형상을 조사하였다. 멜라민 요소 폼알데하이드(MUF), 페놀 폼알데하이드(PF), emulsified methylene diphenyl diisocyanate (eMDI) 및 라텍스 수지 접착제 등으로 제조한 저밀도섬유판 4종의 HCHO TVOC 방출 특성 및 연소 형상은 각각 챔버법과 화염실험을 통하여 분석하였다. 그 결과 MUF, eMDI, 라텍스 수지 접착제로 제조한 저밀도섬유판들은 Super $E_0$급의 우수한 HCHO 저방출 성능을 나타냈다. 반면 PF 수지로 제조된 저밀도섬유판은 $E_0$급 성능을 나타내었다. TVOC 방출량은 모든 저밀도섬유판이 국내 실내공기질 기준(이하 $400{\mu}g/m^2{\cdot}h$)을 만족하였으며, 기존 석유계 합성원료 기반의 단열재보다 낮은 수치를 나타냈다. 그중에서도 특히 eMDI 수지 접착제로 제조한 경우에서는 HCHO 및 TVOC 방출량이 각각 $0.14mg/{\ell}$, $12{\mu}g/m^2{\cdot}h$로 가장 낮게 측정되었다. 그러나 eMDI로 제조한 저밀도섬유판에서 방출된 VOC의 성분을 조사한 결과, 톨루엔 성분($3{\mu}g/m^2{\cdot}h$)이 소량 검출되었다. 화염에 의한 연소시험에서는 MUF 수지 접착제로 제조한 저밀도섬유판이 다른 경우에 비하여 연소 후 비교적 가장 양호한 형상을 나타내었다. HCHO 및 TVOC 방출 특성, 연소 형상을 고려하였을 때 단열재용 저밀도섬유판은 MUF 수지 접착제가 가장 적합할 것으로 판단된다.

Keywords

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