Journal of the Korean Wood Science and Technology

The Korean Society of Wood Science & Technology (한국목재공학회)
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Characteristics of Low Density Fiberboards for Insulation Material with Different Adhesives (I) - Thermal Insulation Performance and Physical Properties -

다양한 접착제로 제조한 단열재용 저밀도섬유판의 특성(I) - 단열성능 및 물리적 성질 -

  • Jang, Jae-Hyuk (Department of Forest Products, National Institute of Forest Science) ;
  • Lee, Min (Department of Forest Products, National Institute of Forest Science) ;
  • Kang, Eun-Chang (Department of Forest Products, National Institute of Forest Science) ;
  • Lee, Sang-Min (Department of Forest Products, National Institute of Forest Science)
  • 장재혁 (국립산림과학원 임산공학부) ;
  • 이민 (국립산림과학원 임산공학부) ;
  • 강은창 (국립산림과학원 임산공학부) ;
  • 이상민 (국립산림과학원 임산공학부)
  • Received : 2017.03.29
  • Accepted : 2017.05.08
  • Published : 2017.05.25
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Abstract

This study was carried out to compare the characteristics of low density fiberboards (LDFs) manufactured with different adhesive types such as melamine urea formaldehyde (MUF), phenol formalehyde (PF), emulsified MDI (eMDI) and latexes resins. As results, hard LDFs were successfully manufactured by MUF, PF and eMDI resins. Thermal conductivities of all LDFs were significantly lower than commercial medium density fiberboard. Especially, all LDFs showed comparable thermal insulation performance with extruded polystyrene foam (XPS). LDF manufactured with eMDI resins showed the highest physical properties such as thickness/length swelling by water absorption and bending strength.

본 연구에서는 단열성능 및 물리적 성질이 우수한 친환경 목섬유 단열재의 제조 기술을 확립하기 위하여 멜라민 요소 폼알데하이드(MUF), 페놀 폼알데하이드(PF), emulsified MDI (eMDI) 및 라텍스계 수지 등 서로 다른 접착제로 제조한 저밀도섬유판의 특성을 비교하였다. 그 결과 MUF, PF, eMDI 수지 접착제로부터는 경질(硬質) 저밀도섬유판이, 라텍스계 수지 접착제로부터는 연질(軟質)의 저밀도섬유판이 각각 제조되었다. 모든 저밀도섬유판은 일반 중밀도섬유판에 비해 현저히 낮은 열전도율을 나타냈으며, 압출 발포 폴리스티렌과 유사한 단열 성능을 나타내는 것으로 조사되었다. 한편 본 연구에서 제조한 저밀도섬유판 중 eMDI를 사용한 것은 흡수 두께/길이 팽창률 및 휨 강도 등 물리적 성질이 가장 우수하였다.

Keywords

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