• Journal of the Semiconductor & Display Technology
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• v.10 no.4
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• pp.113-118
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• 2011

According to the high accuracy of semiconductor equipments, PCB substrate with much thin thickness is required. However, it is very difficult to sustain the PCB substrate without deformation in case of horizontal installation, due to low bending stiffness. In this research, new PCB process equipment with vertical installation has been developed in order to solve the problem of PCB substrate damage during etching process. As the main parts of etching system on PCB substrate, PCB substrate and JIG are analyzed through finite element method and experimental test. Through the analysis results of stress state, we could find the optimal JIG design to make the damage as low as possible.

• Journal of Information Display
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• v.3 no.4
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• pp.4-7
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• 2002

A recently developed phase separated composite film method has been employed to fabricate a liquid crystal (LC) based electro-optical device using a single glass substrate. The resulting device is made of adjacent parallel layers of LC and polymer maded by phase separation. The LC layer is confined between the solidified polymer layer on one side and the glass substrate on the other. The electro-optical properties of these devices demonstrate their technological potential in light weight and hand-held electronic products.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1178-1181
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• 2006

We fabricated a flexible OTFT(organic thin film transistor) backplane for the electrophoretic display. The backplane was composed of $128{\times}96pixels$ on the Polyethylene Naphthalate substrate in which each pixel had one OTFT. The OTFTs employed bottom contact structure and used the cross-linked polyvinylphenol for gate insulator and pentacene for active layer

• Journal of Institute of Control, Robotics and Systems
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• v.14 no.4
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• pp.336-341
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• 2008

Recently, research on a flat panel display(FPD) has focused on organic light-emitting display(OLED) which has wide angle of view, high contrast ratio and low power consumption. ITO(Indium-Tin-Oxide) films are the most widely used material as a transparent electrode of OLED and also in many other display devices like LCD or PDP. The performance and efficiency of OLED is related to the surface condition of ITO coated glass substrate. The typical surface defect of glass substrate is measured for electric characteristics and physical condition for transmittance and roughness. Since ITO coated glass substrate can be destroyed for inspection about surface roughness, sheet resistance, film thickness and transmittance, precise fabrication condition should be made based on the estimated relationship. In this paper, ITO films were prepared on the commercial glass substrate by the Ion-Plating method changing the partial pressure of gas(Ar, 02) and the chamber temperature between $200^{\circ}C$ and $300^{\circ}C$. The characteristics of films were examined by the 4-point probe, supersonic thickness measurement, transmittance measurement and AFM. We estimated the relationship between processing parameters(Ar gas, O2 gas, Temperature) and properties of ITO films (Sheet Resistance, Film Thickness, Transmittance, Surface Roughness).

• Journal of Information Display
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• v.8 no.4
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• pp.1-4
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• 2007

In the present study, we propose Monte Carlo simulation that takes into consideration the interface phenomena between liquid crystal and substrate. We use rigid model molecules of liquid crystal and substrate. Interface is generated using potential field that induces decomposition of molecules. We use hard spherocylinders as model liquid crystal molecules. Substrate is modeled as region composed of shorter spherocylinders. Our results show that there is a case in which nematic order is reinforced in the vicinity of rubbed substrate.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.1-6
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• 2007

In order to raise productivity of the OLED and realization of the OLED TV, the enlargement of the mother glass substrate is required. The large-size glass substrate has some difficulties regarding its deflection during handling operation due to its thin thickness (0.5$\sim$0.7t) which is not even enough to stand its mass itself. This paper is demonstrating a new solution of this difficult through clamping and bending boundary condition, which helps to minimize the deflection of the glass substrate. Based on the developed method, the experiments had been done for verifying the proposed method to minimize the glass-deflection. With the developed method, the new design of glass substrate handler can be proposed to allow the large OLED displays be manufactured.

• Journal of Information Display
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• v.13 no.1
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• pp.1-6
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• 2012

Decreasing the thermal resistance is the critical issue for high-brightness light-emitting diodes. In this paper, the effects of some design factors, such as chip size (24 and 35 mil), substrate material (AlN and high-temperature co-fired ceramic), and die-attach material (Ag epoxy and PbSn solder), on the thermal-dissipation characteristics were investigated. Using the thermal transient method, the temperature sensitivity parameter, $R_{th}$ (thermal resistance), and junction temperature were estimated. The 35-mil chip showed better thermal dissipation, leading to lower thermal resistance and lower junction temperature, owing to its smaller heat source density compared with that of the 24-mil chip. By adopting an AlN substrate and a PbSn solder, which have higher thermal conductivity, the thermal resistance of the 24-mil chip can be decreased and can be made the same as that of the 35-mil chip.

• Journal of the Semiconductor & Display Technology
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• v.23 no.2
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• pp.12-18
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• 2024

A Electrostatic chuck is a device that fixes the substrate, using the force between charges applied between two parallel plates to attract substrates such as wafers or OLED panels. Unlike mechanical suction methods, which rely on physical fixation, this method utilizes the force of electrostatics for fixation, making it important to verify the adhesion force. As the size of the substrate increases, deformations due to gravity or chucking force also increase, and the adhesion force decreases rapidly as the distance between the chuck and the substrate increases. The outlook for displays is shifting from small to large OLEDs, necessitating consideration of substrate deformations. In this paper, to confirm the deformation of the substrate through various patterns, a simplified 2D model using Ansys' electromagnetic field analysis program, Maxwell, and the static structural analysis program, Mechanical, was utilized to observe changes in adhesion force according to the variation in the air gap between the substrate and the chuck. Additionally, the chucking force was analyzed for the size of the substrate, and the deformation of the substrate was confirmed when gravity and chucking force act simultaneously.

• Advanced Industrial SCIence
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• v.1 no.1
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• pp.16-22
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• 2022

Starting with cathode ray tubes, displays are forming markets in the order of active marix organic light emitting diode (AMOLED) after PDP (Plasma Display Panel) and LCD (Liquid Crystal Display). OLED is recognized as a key field for the development of each country preparing for the fourth industrial revolution, and especially Samsung Display and LG Display, which are the top industries in Korea, are leading the market with more than 90% of OLED shares. Currently, AMOLED has moved to the area that can be folded or bent. This technology is possible because TFT (Thin Film Transistor) and OLED may be formed on a flexible substrate. In the future, the technology will move to stretchable displays, and for this, the development of substrate materials is first, and then TFT and OLED devices should also be implemented with stretchable materials.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1474-1476
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• 2005

ZnO:Al(AZO) has been investigated for the photovoltaic cell or TCO(Transparent Conductive Oxide) of the display, because it has good electrical and optical properties. In this study, the ZnO:Al(AZO) thin film prepared on variation of substrate temperature by FTS(Facing Targets Sputtering) system. In case of TCO, because resistivity and roughness values affect the lighting of the OLED, their factors are very important. Therefore, in this paper, the electrical and optical properties of the AZO thin film were investigated with the deposition conditions and its roughness was investigated on variation of the substrate temperature. In results, AZO thin film deposited with the transmittance over 80% and the resistivity was reduced from $1.36{\times}10^{-3}$ [O-cm] to $4{\times}10^{-4}$ [O-cm] with increasing the substrate temperature from R.T to $200[^{\circ}C]$. Especially, we could obtain the resistivity $4{\times}10^{-4}$ [O-cm] of AZO thin film prepared at working pressure 1[mTorr], input current 0.4[A] and substrate temperature $200[^{\circ}C]$.