References
- M. Meneghini, A. Tazzoli, G. Mura, G. Meneghesso, and E. Zanoni, IEEE Trans. Electron Devices 57, 108 (2010).
- M. Lee, C. Hillman, and D. Kim, Mil. Aerosp. Electron. (2005). http://mae.pennnet.com/Articles/Article_Display. cfm?ARTICLE_ID=230223&p=32&cat=Depar.
- S. Fujita, S. Yoshihara, A. Sakamoto, S. Yamamoto, and S. Tanabe, Fifth International Conference on Solid State Lighting, Bellingham, 2005.
- R. Prasher, Proc. IEEE 94, 1571 (2006). https://doi.org/10.1109/JPROC.2006.879796
- C. Deppisch, T. Fitzgerald, A. Raman, and F. Hua, C. Zhang, P. Liu, and M. Miller, J. Miner. 58, 67 (2006).
- E. Fred Schubert, Light-Emitting Diodes, 2nd ed. (Cambridge University Press, Cambridge, United Kingdom, 2003).
- D.G. Todorov and L.G. Kapisazov, ELECTRONICS'2008, Sozopol, Bulgaria, 2008.
- L. Jayasinghe et al., Seventh International Conference on Solid State Lighting, 2007.
- L.Yang, S. Jang,W. Hwang, and M. Shin, Thermochim. Acta 455, 95 (2007).
- S. Chhajed,Y. Xi,Y.-L. Li, Th. Gessmann, and E.F. Schubert, J. Appl. Phy. 97, 054506 (2005). https://doi.org/10.1063/1.1852073
- L. Yang, J. Hu, L. Kim, and M.W. Shin, IEEE Trans. Device Mater. Reliab. 8, 571 (2008). https://doi.org/10.1109/TDMR.2008.2002357
- V. Szekely and M.R. Rencz, IEEE Trans. Compon. Packag. Technol. 25, 547 (2002). https://doi.org/10.1109/TCAPT.2002.808003
- V. Szekely, Microelectron. J. 28, 277 (1997). https://doi.org/10.1016/S0026-2692(96)00031-6
- V. Szekely, R. Marta, P. Andras, and C. Benard, Analog Integr. Circuits Signal Process 29, 49 (2001). https://doi.org/10.1023/A:1011226213197
- J.P. Holman, Heat Transfer, 10th ed. (McGraw-Hill New York, USA, Korea, 2010).
- P.E. Shade and L.T. Jenkins, Thermal Characterization Techniques (Books on Demand, Stoughton, USA, 1970).
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