• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05a
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• pp.86-89
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• 2004

Organic thin film transistors (OTFTs) are fabricated on the plastic substrate through 4-level mask process without photolithographic patterning to yield the simple fabrication process. And we herewith report for the effect of dielectric surface modification on the electrical characteristics of OTFTs. The KIST-JM-1 as an organic molecule for the surface modification is deposited onto the surface of zirconium oxide $(ZrO_2)$ gate dielectric layer. In this work, we have examined the dependence of electrical performance on the interface surface state of gate dielectric/pentacene, which may be modified by chemical properties in the gate dielectric surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.523-525
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• 2008

Inkjet printing is being considered as an alternative to the conventional lithography in the electronic industry. Surface energy control of substrate is a critical issue in controlling the dimension of microstructures by the inkjet printing. This study introduces the surface energy control of ITO substrate for in/q'et printing of PEDOT/PSS.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.407-410
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• 2003

We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.446-449
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• 2005

The alignment property of liquid crystals on the two-easy axes substrate is investigated. The two-easy axes substrate frustrates the orientation of the LCs next to the substrate, and hence influences the birefringence of the LC cell. Experimental findings reveal that the ratio of the rubbing strengths in the different rubbing directions and the cell thickness substantially influence the birefringence of the LC cell. The surface anchoring energetic competition between the different rubbing directions contributes to the observed results.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.75-80
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• 2004

By the SOG (System-on-Glass) technology with excimer laser anneal process, the number of IC chips and the area of the mounted IC chips on the printed circuit board are reduced. In new circuit integrations on the glass substrate, we have developed D/A converter including the new capacitor array, amplifier comprising the original comparators and new display device with capturing images by integrated sensor into a pixel. This paper discusses the application of circuit integration of low-temperature poly-Si.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.273-276
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• 2003

Polymerization induced diffusion has been successfully applied to create new display components. Based on this principle a new technique to produce polymer covered liquid crystal layers on a single substrate, called photo-enforced stratification, allows cost-effective production of ultra-thin LCDs. The two-step photopolymerization-induced phase separation of a liquid crystal and a polymer precursor can be performed on a variety of substrates and provides freedom in display design.

• Proceedings of the Korean Vacuum Society Conference
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• 2008.08a
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• pp.179-179
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• 2008

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.5
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• pp.330-334
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• 2018

With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

• Journal of the Semiconductor & Display Technology
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• v.22 no.3
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• pp.14-20
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• 2023

The electrostatic chuck is a technology that uses electroadhesion to attach objects and is widely used in semiconductor and display processes. This research conducted Maxwell by varying parameters to examine the distribution and variations of chucking force in a bipolar-type ESC. The parameters that were changed include the material properties of the dielectric layer and attachment substrate, applied voltage to the electrode, and the gap and width between the electrodes. The analysis results showed that as the relative permittivity of the dielectric layer and substrate increased, the chucking force also increased, with the relative permittivity of the substrate having a greater impact on the chucking force. And increasing the applied voltage led to an increase in both the chucking force and its rate of change. Lastly, as the gap between the electrodes increased, the chucking force rapidly decreased until a certain distance, after which the decrease became less significant. On the contrary, increasing the electrode width resulted in a rapid increase in the chucking force until a certain width, beyond which the increase became less pronounced, eventually converging to a chucking force of 1700 Pa. This paper is expected to have high potential for the development and research of ESC for OLED deposition.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.1
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• pp.30-34
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• 2016

In this paper, we report that selective etching on N-polar face by EC (electro-chemical)-etching effect on the reduction of bowing and strain of FS (free-standing)-GaN substrates. We applied the EC-etching to concave and convex type of FS-GaN substrates. After the EC-etching for FS-GaN, nano porous structure was formed on N-polar face of concave and convex type of FS-GaN. Consequently, the bowing in the convex type of FS-GaN substrate was decreased but the bowing in the concave type of FS-GaN substrate was increased. Furthermore, the FWHM (full width at half maximum) of (1 0 2) reflection for the convex type of FS-GaN was significantly decreased from 601 to 259 arcsec. In the case, we confirmed that the EC-etching method was very effective to reduce the bowing in the convex type of FS-GaN and the compressive stress in N-polar face of convex type of FS-GaN was fully released by Raman measurement.