Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Enhancement of Transmittance and Adhesion of Flexible Display Adhesion Surface by Bubble Removing Process

기포 제거 공정을 통한 유연한 디스플레이 합착 면의 투과율 및 접착력 향상

  • Kim, Jungsoo (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Jang, Kyungsoo (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Phu, Cam (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Park, Heejun (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Shin, Donggi (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Lee, Younjung (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity) ;
  • Yi, Junsin (Department of Electronic and Electrical and Computer Engineering, College of Information and Communication Engineering, Sungkyunkwan Unversity)
  • 김정수 (성균관대학교 정보통신대학 전자전기컴퓨터공학부) ;
  • 장경수 (성균관대학교 정보통신대학 전자전기컴퓨터공학부) ;
  • ;
  • 박희준 (성균관대학교 정보통신대학 전자전기컴퓨터공학부) ;
  • 신동기 (성균관대학교 정보통신대학 전자전기컴퓨터공학부) ;
  • 이윤정 (성균관대학교 정보통신대학 전자전기컴퓨터공학부) ;
  • 이준신 (성균관대학교 정보통신대학 전자전기컴퓨터공학부)
  • Received : 2018.01.04
  • Accepted : 2018.04.10
  • Published : 2018.07.01
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Abstract

With the development of the Internet of Things, the use of flexible displays has become widespread. In particular, the use of curved, bendable, and rollable displays is increasing. Flexible display production processes include various important components such as lamination material, flexible substrates, and adhesives. Among them, improvement of the lamination process comprises a large proportion of efforts for further development. In this paper, we attempt to improve the transmittance of the display substrate by performing a bubble removal process after adhesion. The transmittance of the glass substrate with the bubble removal process was 5~12% higher than that of the substrate without the bubble removal process. The fill-strength after the bubble removal process was improved by 21.4%, and the shear-strength was improved by 43.9%.

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References

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