• Journal of the Institute of Electronics and Information Engineers
• /
• v.52 no.1
• /
• pp.135-139
• /
• 2015

The address discharge time lags are investigated in each subfield time in AC plasma display panel and a modified driving waveform is proposed to reduce the address discharge time lag by applying different additional scan voltage under no misfiring discharge production. The weak plasma discharge in AC PDP is generated by applying high positive-going ramp waveform to the scan electrode during the first reset period and that induce the production of the priming particle and wall charge. Because the wall charge becomes the wall voltage in a cell, the wall plus external address voltage produce the address discharge. However, as the wall charge in a cell is gradually disappeared as time passed, the address discharge time in the subfield time for 1 TV frame is lagged. In the first subfield time, the address discharge is faster produced than the other subfield time because the wall charge are much remained by the high positive-going ramp voltage during the reset period in the first subfield time. Meanwhile, from the second to last subfield, the address discharge production time is gradually delayed due to the dissipation of the wall charge in a cell. In this study, the address discharge time lags are measured in each subfield time and the total address discharge time lags are shortened by applying the different additional scan voltage during the address period in each the subfield time.

• Journal of the Institute of Electronics and Information Engineers
• /
• v.51 no.2
• /
• pp.168-172
• /
• 2014

A new sustain driving method is proposed to improve luminous efficiency by the generation of the self-erasing discharge during a sustain period in AC plasma display panel. As one subfield time in the conventional AC PDP is divided into the reset, address, and sustain period. Among them, as the square sustain waveform is alternately applied to the X and Y electrodes on the front plate during the sustain period, the plasma discharge for displaying the image is continuously produced. Meanwhile, in the conventional driving method, the address waveform applied to the A electrode on the rear plate is only driving during an address period and grounded during a sustain period. In this experiment, the negative pulse is applied to the A electrode at the latter part of the sustain pulse for improving the luminous efficiency producing the self-erasing discharge during the sustain period. The negative pulse on the A electrode can change from the space to the wall charge and induce the additional discharge by the accumulated wall charge when the voltages of three electrodes are grounded. As a result, the luminous efficiency will be measured with changes in the voltage level of the A electrode and the new driving method can be improved to the luminous efficiency about 32 % compared with the conventional driving method.

• Journal of the Korean Magnetics Society
• /
• v.15 no.4
• /
• pp.246-249
• /
• 2005

The blue-color emitting phosphor powder, $CaMgSi_{2}O_6:Eu^{2+}(CMS:Eu^{2+})$ was synthesized by the solid-state reaction method. The synthesized powder was annealed from room temperature to $1,100^{\circ}C$ in air. Its PL property and valence state of Eu atoms was measured by the photoluminescence (PL) and the electron paramagnetic resonance (EPR) spectrometers, respectively. The PL intensity was stable to $700^{\circ}C$, but drastically decreased to $1,100^{\circ}C$. The behavior of EPR intensity was very similar to the PL intensity. The EPR measurement showed that decreased intensity of the PL was caused to the oxidation from the ion $Eu^{2+}$ to $Eu^{3+}$ ions. The EPR spectrometer was powerful as a tool that could distinguish between the valence states of Eu atom as a dopant in various phosphors.

• Journal of the Korean Ceramic Society
• /
• v.39 no.8
• /
• pp.721-727
• /
• 2002

In order to overcome trade-off among compositions, process and properties of the glasses with high PbO-base composition for PDP Rib, we studied glass crystallization and crystallization kinetics by Differential Thermal Analysis(DTA). Glass powder was obtained through melting/cooling/grinding, with 3 wt%TiO2 addition for the crystal nucleation and growth in $62PbO-19B_2O_3-10SiO_2-9(Al_2O_3-K_2O-BaO-ZnO)$(in wt%) composition glass. This powder was heat-treated for 1 to 10 h at $445^{\circ}C$ for nucleation. DTA measurements were performed to obtain the crystallization peak with $5∼25^{\circ}C/min$ heating rates. DTA crystallization peak temperature increased with increasing the heating rate and decreased with increasing the heating time. Because the Avrami parameter (n) was approximately 1, the surface crystallization occurred. The maximum nucleation time was 2 h.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.45 no.5
• /
• pp.12-18
• /
• 2008

Ag paste was employed for source and drain electrode of OTFTs and for the data metal lines of OTFT-OLED array on PC(polycarbonate) substrate. We tested two kinds of Ag-pastes such as pastes for 325 mesh and 500 mesh screen mask to examine the pattern ability and electrical performance for OTFTs. The minimum feature size was 60 ${\mu}m$ for 325 mesh screen mask and 40 ${\mu}m$ for 500 mesh screen mask. The conductivity was 60 $m{\Omega}/\square$ for 325 mesh and 133.1 $m{\Omega}/\square$ for 500 mesh. For the OTFT performance the mobility was 0.35 $cm^2/V{\cdot}sec$ and 0.12 $cm^2/V{\cdot}sec$, threshold voltage was -4.7 V and 0.9 V, respectively, and on/off current ratio was ${\sim}10^5$, for both screen masks. We applied the 500 mash Ag paste to OTFT-OLED array because of its good patterning property. The pixel was composed of two OTFTs and one capacitor and one OLED in the area of $2mm{\times}2mm$. The panel successfully worked in active mode operation even though there were a few bad pixels.

• Korean Journal of Materials Research
• /
• v.11 no.4
• /
• pp.305-311
• /
• 2001

$PbO-B_2O_3-SiO_2-Al_2O_3$, system was investigated for optical, thermal and electrical properties of transparent dielectric. We also studied the reaction between transparent dielectric and transparent electrode(Indium Tin Oxide, ITO) during firing. For the evaluation of properties, dielectrics were prepared under the conditions fired at 520~58$0^{\circ}C$ with 12$\mu\textrm{m}$ thickness. In the reaction between dielectrics and electrode(ITO), In ions diffused into dielectric layer, while Sn ion diffusion was not observed. The coefficient of thermal expansion, the dielectric constant, the glass transition temperature and the transmittance of the dielectric were greatly dependent on PbO content. The increase of the coefficient of thermal expansion and the dielectric constant were monitored by increasing PbO, while the glass transition temperature and the transmittance were decreased. With the increased $Al_2O_3/B_2O_3$ ratio, the coefficient of thermal expansion and the transmittance were decreased, while the dielectric constant was increased. The glass transition temperature did not change significantly.

• Journal of the Korean Vacuum Society
• /
• v.12 no.3
• /
• pp.168-173
• /
• 2003

Recently, according to the rapid progress in Flat-panel-display industry, there has been a growing interest in the poly-Si process. Compared with a-Si, poly-Si offers significantly high carrier mobility, so it has many advantages to high response rate in Thin Film Transistors (TFT's). We have investigated a new process for the high temperature Solid Phase Crystallization (SPC) of a-Si films without any damages on glass substrates using thin film heater. because the thin film heater annealing method is a very rapid thermal process, it has very low thermal budget compared to the conventional furnace annealing. therefore it has some characteristics such as selective area crystallization, high temperature annealing using glass substrates. A 500 $\AA$-thick a-Si film was crystallized by the heat transferred from the resistively heated thin film heaters through $SiO_2$ intermediate layer. a 1000 $\AA$-thick $TiSi_2$ thin film confined to have 15 $\textrm{mm}^{-1}$ length and various line width from 200 to 400 $\mu\textrm{m}$ was used as the thin film heater. By this method, we successfully crystallized 500 $\AA$-thick a-Si thin films at a high temperature estimated above $850^{\circ}C$ in a few seconds without any thermal deformation of g1ass substrates. These surprising results were due to the very small thermal budget of the thin film heaters and rapid thermal behavior such as fast heating and cooling. Moreover, we investigated the time dependency of the SPC of a-Si films by observing the crystallization phenomena at every 20 seconds during annealing process. We suggests the individual managements of nucleation and grain growth steps of poly-Si in SPC of a-Si with the precise control of annealing temperature. In conclusion, we show the SPC of a-Si by the thin film heaters and many advantages of the thin film heater annealing over other processes

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.08a
• /
• pp.146-147
• /
• 2011

Processing a large area substrate for liquid crystal display (LCD) or solar panel applications in a capacitively coupled plasma (CCP) reactor is becoming increasingly challenging because of the size of the substrate size is no longer negligible compared to the wavelength of the applied radio frequency (RF) power. The situation is even worse when the driving frequency is increased to the Very High Frequency (VHF) range. When the substrate size is still smaller than 1/8 of the wavelength, one can obtain reasonably uniform process results by utilizing with methods such as tailoring the precursor gas distribution by adjustingthrough shower head hole distribution or hole size modification, locally adjusting the distance between the substrate and the electrode, and shaping shower head holes to modulate the hollow cathode effect modifying theand plasma density distribution by shaping shower head holes to adjust the follow cathode effect. At higher frequencies, such as 40 MHz for Gen 8.5 (2.2 m${\times}$2.6 m substrate), these methods are not effective, because the substrate is large enough that first node of the standing wave appears within the substrate. In such a case, the plasma discharge cannot be sustained at the node and results in an extremely non-uniform process. At Applied Materials, we have studied several methods of modifying the standing wave pattern to adjusting improve process non-uniformity for a Gen 8.5 size CCP reactor operating in the VHF range. First, we used magnetic materials (ferrite) to modify wave propagation. We placed ferrite blocks along two opposing edges of the powered electrode. This changes the boundary condition for electro-magnetic waves, and as a result, the standing wave pattern is significantly stretched towards the ferrite lined edges. In conjunction with a phase modulation technique, we have seen improvement in process uniformity. Another method involves feeding 40 MHz from four feed points near the four corners of the electrode. The phase between each feed points are dynamically adjusted to modify the resulting interference pattern, which in turn modulate the plasma distribution in time and affect the process uniformity. We achieved process uniformity of <20% with this method. A third method involves using two frequencies. In this case 40 MHz is used in a supplementary manner to improve the performance of 13 MHz process. Even at 13 MHz, the RF electric field falls off around the corners and edges on a Gen 8.5 substrate. Although, the conventional methods mentioned above improve the uniformity, they have limitations, and they cannot compensate especially as the applied power is increased, which causes the wavelength becomes shorter. 40 MHz is used to overcome such limitations. 13 MHz is applied at the center, and 40 MHz at the four corners. By modulating the interference between the signals from the four feed points, we found that 40 MHz power is preferentially channeled towards the edges and corners. We will discuss an innovative method of controlling 40 MHz to achieve this effect.

• Journal of the Korean Chemical Society
• /
• v.44 no.5
• /
• pp.453-459
• /
• 2000

FED has deserved an intensive attentioD as a new flat panel display. The present investigationaims at undemtanding the photoluminescence and cathodoluminescent properties of hGaO$_3$: $Eu^{3+}$ phosphor bytaking into account the possibility that this phosphor could be applied for FED. In onler to investigate on.sucha detailed behavior; 8everM experimental skil18 Je conducted to the LaGaO$_3$:$Eu^{3+}$ phosphoL The excimtion srectrum artd emission spectmn were rnezsured in the UV range and then decay curve of $^5D_0$+$^7F_j$transitions\vas examined. The decay behavior of $^5D_0$ emission was anMyzed by a newly Iuoposed cross-relaxation mech-ani8In in asswiation with inteFwnter di1ffision (or migration). The cross-mlaxation from $^5D_0$ to CTB (Cha'geTransfer Band) wuld be a quite retsonable by considering the excitation spectrum. It could be also found thatthe quenching type was changed from ditfrsion controlled process to the direct quenching process -s inJeasing $Eu^{3+}$ oncntration.

• Polymer(Korea)
• /
• v.38 no.5
• /
• pp.640-644
• /
• 2014

As a process of plat panel display production, slot coating is widely used for the coating of photoresist on a wide glass substrate. A uniform coating thickness is important, and the coating uniformity is divided into nozzle and machine directions. The machine and nozzle directions coating uniformities are influenced by the operation condition of coater and flow uniformity inside the die, respectively. Non-uniform coating during steady coating process occurs according to those factors, however, non-uniform coating along the machine and nozzle directions has been observed at the beginning of coating by unsteady flow. In this study, steady and unsteady state flow simulations have been performed and compared with experiment to examine the causes of non-uniform coating. Computational results exhibited that it took a time to get a uniform pressure distribution at whole inside the die, and during this period of time edge regions showed lower exit velocity compared with center region. Subsequently edge regions had thinner coated layers than center region. However edge regions showed higher exit velocity than center region after steady state, and this made edge regions had thicker coated layer than center region.