• Journal of Distribution Science
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• v.10 no.9
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• pp.13-21
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• 2012

Purpose - Korean traditional markets are falling behind the times, because they have not met the demands of social changes including: an overall improvement in standards of living, shift in purchasing form and propagation of cars. It is one of the most indigenous and conventional foods of Korea, taking a seat far in the corner of Korean traditional culture. Research design / data / methodology - Korean traditional rice cakes however have their limits. They are produced and sold by independent shop owners who cannot compete with the brand power of franchise organizations. The leadership of adminstration is needed for these shop owners particularly in visual merchandising related to interior design and display. Results - Additionally, the advent of major company-run rice cake cafe adds fresh fuel to the problem in addition to small but luxurious packaging. Small business owners need packaging technology for overall quality improvement of sales of rice cakes. Additional help is needed with the mode of packing to promote sales and win consumer confidence. Conclusions - Further assistance with marketing for seasonal displays is needed as well as teaching business owners how to read graphic data. Regular specialized education for visual merchandising of rice cakes could help independent market owners win the competition against franchise-based organizations.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.11-17
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• 2007

The CCFLs, EEFLs and FFLs use mercury and the operating conditions are different at warm or cold temperature. At start of operation, there may exist a possibility of inhomogeneous operation of lamps or channels of FFL to the very low vapor pressure of mercury at low temperature. In this paper, an inverter with level control block (LCB) was developed to drive LCD backlight using FFL stably at low temperature range. The operation of FFL backlight at $-20^{\circ}C$ was successfully demonstrated by developing inverter with LCB under 130 Watt of power consumption.

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.65-69
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• 2019

The cure properties of ethoxysilyl diglycidyl isocyanurate(Ethoxysilyl-DGIC) and ethylsilyl diglycidyl isocyanurate (Ethylsilyl-DGIC) epoxy resin systems with a phenol novolac hardener were investigated for anticipating fan out-wafer level package(FO-WLP) applications, comparing with ethoxysilyl diglycidyl ether of bisphenol-A(Ethoxysilyl-DGEBA) epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The isocyanurate type epoxy resin systems represented the higher cure conversion rates comparing with bisphenol-A type epoxy resin systems. The Ethoxysilyl-DGIC epoxy resin system showed the highest cure conversion rates than Ethylsilyl-DGIC and Ethoxysilyl-DGEBA epoxy resin systems. It can be figured out by kinetic parameter analysis that the highest conversion rates of Ethoxysilyl-DGIC epoxy resin system are caused by higher collision frequency factor. However, the cure conversion rate increases of the Ethylsilyl-DGEBA comparing with Ethoxysilyl-DGEBA are due to the lower activation energy of Ethylsilyl-DGIC. These higher cure conversion rates in the isocyanurate type epoxy resin systems could be explained by the improvements of reaction molecule movements according to the compact structure of isocyanurate epoxy resin.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.305-308
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• 2006

Advanced mobile communication devices require a bright, high information content display in a small, light-weight, low power consumption package. For portable applications flexible (or conformable) and rugged displays will be the future. In this paper we outline our progress towards developing such a low power consumption active-matrix flexible OLED $(FOLED^{TM})$ display. We demonstrate full color 100 ppi QVGA active matrix OLED displays on flexible stainless steel substrates. Our work in this area is focused on integrating three critical enabling technologies. The first technology component is based on UDC's high efficiency long-lived phosphorescent OLED $(PHOLED^{TM})$ device technology, which has now been commercially demonstrated as meeting the low power consumption performance requirements for mobile display applications. Secondly, is the development of flexible active-matrix backplanes, and for this our team are employing PARC's Excimer Laser Annealed (ELA) poly-Si TFTs formed on metal foil substrates as this approach represents an attractive alternative to fabricating poly-Si TFTs on plastic for the realization of first generation flexible active matrix OLED displays. Unlike most plastics, metal foil substrates can withstand a large thermal load and do not require a moisture and oxygen permeation barrier. Thirdly, the key to reliable operation is to ensure that the organic materials are fully encapsulated in a package designed for repetitive flexing, and in this device we employ a multilayer thin film Barix encapsulation technology in collaboration with Vitex systems. Drive electronics and mechanical packaging are provided by L3 Displays.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.315-321
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• 2005

Chip-on-glass technology to attach IC chip directly on the glass substrate of flat panel display was studied by using induction heating body in AC magnetic field. With applying magnetic field of 230 Oe at 14 kHz, the temperature of an induction heating body made with Cu electrodeposited film of 5 mm${\times}$5 mm size and $600{\mu}m$ thickness reached to $250^{\circ}C$ within 60 seconds. However, the temperature of the glass substrate was maintained below $100^{\circ}C$ at a distance larger than 2 mm from the Cu induction heating body. COG bonding was successfully accomplished with reflow of Sn-3.5Ag solder bumps by applying magnetic field of 230 Oe at 14 kHz for 120 seconds to a Cu induction heating body of 5mm${\times}$5mm size and $600{\mu}m$ thickness.

• Journal of the Semiconductor & Display Technology
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• v.17 no.4
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• pp.42-45
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• 2018

As The semiconductor decrease from 10 nanometer to 7 nanometer, It is suggested that "More than Moore" is needed to follow Moore's Law, which has been a guide for the semiconductor industry. Fan-Out Wafer Level Package(FOWLP) is considered as the key to "More than Moore" to lead the next generation in semiconductors, and the reasons are as follows. the fan-out WLP does not require a substrate, unlike conventional wire bonding and flip-chip bonding packages. As a result, the thickness of the package reduces, and the interconnection becomes shorter. It is easy to increase the number of I / Os and apply it to the multi-layered 3D package. However, FOWLP has many issues that need to be resolved in order for mass production to become feasible. One of the most critical problem is the warpage problem in a process. Due to the nature of the FOWLP structure, the RDL is wired to multiple layers. The warpage problem arises when a new RDL layer is created. It occurs because the solder ball reflow process is exposed to high temperatures for long periods of time, which may cause cracks inside the package. For this reason, we have studied warpage in the FOWLP structure using commercial simulation software through the implementation of the reflow process. Simulation was performed to reproduce the experiment of products of molding compound company. Young's modulus and poisson's ratio were found to be influenced by the order of influence of the factors affecting the distortion. We confirmed that the lower young's modulus and poisson's ratio, the lower warpage.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Journal of the Korean Society of Food Science and Nutrition
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• v.45 no.3
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• pp.402-408
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• 2016

Master packaging system consists of an inner individual package and secondary outer package. During the stages of chilled transport and distribution, the combination of primary individual package and secondary package was used to maintain a modified atmosphere for shiitake mushrooms. During the retail stage at higher temperature ($25^{\circ}C$), the primary individual package was exposed to display conditions after dismantling of the secondary packaging. The master packaging system was constructed to contain eight individual $30-{\mu}m$ thick polypropylene film bags of 500 g shiitake mushrooms inside a $40-{\mu}m$ low-density polyethylene bag. Carbon dioxide absorbent material [$Ca(OH)_2$] and/or moisture absorbent (superabsorbent polymer) were designed in their required amounts based on respiration characteristics and then applied to the outer secondary packaging in sachet form. Gas concentration of the packaging, temperature, and humidity were monitored throughout transport and storage. The quality of shiitake mushrooms was measured at the retail stage to determine the packaging effect. During the distribution stage of 108 h, $O_2$ and $CO_2$ concentrations in the master packaging system were maintained at 9~11% and 1~4% in the inner packaging, respectively, which are good for quality preservation. Compared to the control, the master packaging with $CO_2$ and/or moisture absorbents improved mushroom preservation and particularly reduced decay.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.77-81
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• 2020

Commercialization of flexible OLED displays, such as rollable and foldable displays, has attracted tremendous interest in next-generation display markets. However, during bending deformation, cracking and delamination of thin films in the flexible display panels are the critical bottleneck for the commercialization. Therefore, measuring mechanical properties of the fragile thin films in the flexible display panels is essential to prevent mechanical failures of the devices. In this study, tensile properties of the metal and ceramic nano-thin films were quantitatively measured by using a direct tensile testing method on the water surface. Elastic modulus, tensile strength, and elongation of the sputtered Mo, MoTi thin films, and PECVD deposited SiN_x thin films were successfully measured. As a result, the tensile properties were varied depending on the deposition conditions and the film thickness. The measured tensile property values can be applied to stress analysis modeling for mechanically robust flexible displays.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.189-194
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• 2001

PDP(Plasma Display Panel)의 투명 유전체에 적용 가능한 저융점 유리 중에서 납성분이 포함 되어 있지 않는 Bi계 유리의 연구를 행하였다. 기판과의 일체화를 위한 유리의 응용으로, 소자와의 반응 억제와 열응력 완화를 위해 유리의 저융점화 및 열팽창 계수를 제어하였다. 본 연구에서 제조된 Bi계 유리는 DTA와 TMA의 열분석을 통해 50$0^{\circ}C$부근에서 연화점이 있고, 7.31~10.02$\times$$10^{-6}$$^{\circ}C$, 비유전을 11.1~13.3, 광투과도가 80%이상으로 PDP 투명유전체에 적용 가능한 Bi계 유리를 얻을 수 있었다.