• 마이크로전자및패키징학회지
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• 제23권2호
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• pp.1-10
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• 2016

This paper reports the trends of researches and technologies of electronic packaging using graphene. Electronic packaging is to provide the signal and electrical current among electronic components, to remove the heat in electronic systems or components, to protect and support the electronic components from external environment. As the required functions and performances of electronic systems or components increase, the electronic packaging has been intensively attracted attention. Therefore, technologies such as miniaturization, high density, Pb-free material, high reliability, heat dissipation and so on, are required in electronic packaging. Recently, graphene, which is a single two-dimensional layer of carbon atoms, has been extensively investigated because of its superior mechanical, electrical and thermal properties. Until now, many studies have been reported the applications using graphene such as flexible display, electrode, super capacitor, composite materials and so on. In this paper, we will introduce and discuss various studies on recent technologies of electronic packaging using graphene for solving the required issues.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.275-278
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• 2002

Conductive adhesives are commonly used for the interconnections of fine pitch, small packages like mobile applications. Since conductive particles connect mechanically with contact pads to give somewhat higher contact resistance, a metallurgical interconnection, which provides both fine pitch and low resistance, was studied using silver ball and indium which can be made at low temperatures. The connection resistance of the In-Ag metallurgical interconnection was lower than that of the Ni/Au-Ag mechanical interconnection and the former showed little dependency on the bonding load in contrast to the latter.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제48권9호
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• pp.656-661
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• 1999

As a fundamental study for FED tubeless packaging, sodalime-sodalime electrostatic bonding was performed by using on the developed bonding mechanism. Thebonding properties of the bonded sodalime-sodalime structure were investigated through SEM and SIMS analyses. Mo-tip FEA was vacuum-packaged by the developed bonding process and the packaged device generated the field emission current.

• Journal of Information Display
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• 제2권3호
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• pp.66-71
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• 2001

MCFEDs (MOSFET-Contoolled Field Emission Displays) were fabricated to evaluate the validity of MCFEA for display application. The electrical properties of FEAs (Field Emitter Arrays), HVMOSFETs (High-Voltage MOSFETs), and MCFEAs (MOSFET-Controlled Field Emitter Arrays) were measured. The extraction gate voltage of the FEAs to obtain the anode current of 10 nA/tip was around 71 V. The breakdown voltages of the HVMOSFETs were above 81 V for all the samples. The I-V characteristics of the MCFEAs showed that the emission currents of the FEAs were well controlled depending on the control gate voltages of the HVMOSFETs. To avoid the harmful effects during the packaging process, the performance of the MCFEDs was evaluated in a high vacuum chamber. The emission images of the MCFEDs were controlled through very-through operation. From the comparison with a conventional FED, it was proven that the poor uniformity of FED could be improved through the integration with HVMOSFET.

• 한국포장학회지
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• 제20권1호
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• pp.1-6
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• 2014

신선 농산물의 필름포장은 적정의 저온저장 시에는 적정 변형기체조건 유지로 품질유지가 양호하나, 상대적으로 온도가 높은 판매유통단계에서는 적정조건의 유지가 어려워 품질손실이 발생한다. 저온저장과 판매유통단계에서 농산물 주위에 적정 변형기체(modified atmosphere, MA)조성을 유지하는 개별(1차)포장/2차 포장의 결합 및 해체 개념을 설계한 마스터 포장 시스템이 최근에 제안되고, 단감, 큰느타리 버섯, 밤, 딸기에 대해서 적용된 바 있다. 온도에 따라 다른 농산물의 호흡과 포장의 기체이동 현상의 상호관계를 이용한 마스터 포장 시스템의 개념을 체계화하고, 적정 MA 유지를 위한 설계변수의 조합을 살펴보았다. 바람직한 포장기체조성을 형성 유지할 수 있는 마스터 포장 시스템의 설계를 위한 수학적 모델이 제시되었다. 아울러 마스터 포장 시스템의 이점과 함께 적용을 위한 한계에 대해서 논의하였다. 마스터 포장 시스템의 적용 확대를 위한 미래의 연구방향을 제시하였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.1005-1008
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• 2003

We report a new FCOG (flip chip on glass) technique using solder bumps for display packaging applications. The In and Sn solder bumps of 40 ${\mu}m$ pitches were formed on Si and glass substrate. The In and Sn bumps were bonded at 125 at the pressure of 3 mN/bump. The metallurgical bonding was confirmed using cross-sectional SEM. The contact resistance of the solder joint was 65 $m{\Omega}$ which was much lower than that of the joint made using the conventional ACF bonding technique. We demonstrate that the new COG technique using solder bump to bump direct bonding can be applied to advanced LCDs that lead to require higher quality, better resolution, and lower power consumption.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.63-69
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• 2012

As decreasing size of chips, the need of wafer level packaging is increased in semi-conductor and display industries. Temperature uniformity is a crucial factor in vacuum soldering process to guarantee quality of bonding between chips and wafer. In this paper, a stepwise iterative algorithm has been suggested to obtain output profile of each heat source. Since this algorithm is based on open-loop stepwise iterative experimental technique, it is easier to implement and cost effective than real time feedback controls. Along with some experiments, it was shown that the suggested algorithm can remarkably improve temperature uniformity of wafer during whole heating process compared with the ordinary manual trial-and error method.

• 반도체디스플레이기술학회지
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• 제17권1호
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• pp.62-65
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• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• 반도체디스플레이기술학회지
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• 제12권1호
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• pp.23-28
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• 2013

Epoxy resins are widely used in microelectronics packaging such as printed circuit board and encapsulating for semiconductor manufacturing. Water can diffuse into and through the epoxy matrix systems and moisture absorption at boarding interfaces of matrix resin systems can lead to a hydrolysis at the interfaces resulting in delamination of encapsulating materials. In the study, the changes of diffusion coefficient and moisture content ratio of epoxy resin systems with nano-sized fillers according to the change of liquid type epoxy resins were investigated. RE-304S, RE-310S, RE-810NM and HP-4032D as a epoxy resin, Kayahard AA as a hardener, and 1B2MI as a catalyst were used in these epoxy resin systems. After curing, moisture content ratios were measured with time under the 85 and 85% relative humidity condition using a thermo-hydrostat. The maximum moisture absorption ratio and diffusion coefficient of EMC decrease with the filler content. It can be seen that these decreases are due to the increase of filler surface area and the decrease of moisture through channel with the content of nano-sized filler.

• 마이크로전자및패키징학회지
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• 제11권2호
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• pp.37-41
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• 2004

LCD TV의 백라이트로서는 cold cathode flourescent lamp (CCFL)를 병렬로 구성한 직하방식의 백라이트 많이 사용되고 있다. 현재 각 각의 CCFL에 transformer 한개 씩을 사용하여 일정한 전류를 공급함으로서 백라이트의 균일도를 얻고 있으나 본 논문에서는 differential driving inverter를 이용하여 transfomer에 8개의 램프를 연결하여 구동함으로써 transformer의 개수를 현저히 줄일 수 있었다. Differential driving 방법을 이용하여 transformer 2개를 사용한 인버터를 제작하였으며 이를 이용하여 길이 450mm, 관경 4mm의 CCFL 16개를 사용한 26"용 LCD TV 백라이트를 구동할 수 있었다. 개발된 differential driving 인버터를 이용하여 백라이트를 구동한 결과 $88\%$ 이상의 휘도 균일도를 갖는 백라이트를 구현할 수 있었다.