• 제목/요약/키워드: dispersion of nano-sized Cu

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나노크기 Cu 분산입자를 갖는 Al2O3 다공체의 제조 및 미세조직 특성 (Synthesis and Microstructure of Porous Al2O3 with Nano-Sized Cu Dispersions)

  • 유호석;김안기;현창용
    • 한국재료학회지
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    • 제23권1호
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    • pp.67-71
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    • 2013
  • Porous $Al_2O_3$ dispersed with nano-sized Cu was fabricated by freeze-drying process and solution chemistry method using Cu-nitrate. To prepare porous $Al_2O_3$, camphene was used as the sublimable vehicle. Camphene slurries with $Al_2O_3$ content of 10 vol% were prepared by milling at $50^{\circ}C$ with a small amount of oligomeric polyester dispersant. Freezing of the slurry was done in a Teflon cylinder attached to a copper bottom plate cooled to $-25^{\circ}C$ while unidirectionally controlling the growth direction of the camphene. Pores were subsequently generated by sublimation of the camphene during drying in air for 48 h. The green body was sintered in a furnace at $1400^{\circ}C$ for 1 h. Cu particles were dispersed in porous $Al_2O_3$ by calcination and hydrogen reduction of Cu-nitrate. The sintered samples showed large pores with sizes of about $150{\mu}m$; these pores were aligned parallel to the camphene growth direction. Also, the internal walls of the large pores had relatively small pores due to the traces of camphene left between the concentrated $Al_2O_3$ particles on the internal wall. EDS analysis revealed that the Cu particles were mainly dispersed on the surfaces of the large pores. These results strongly suggest that porous $Al_2O_3$ with Cu dispersion can be successfully fabricated by freeze-drying and solution chemistry routes.

Effects of Nano-sized Diamond on Wettability and Interfacial Reaction for Immersion Sn Plating

  • Yu, A-Mi;Kang, Nam-Hyun;Lee, Kang;Lee, Jong-Hyun
    • 마이크로전자및패키징학회지
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    • 제17권3호
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    • pp.59-63
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    • 2010
  • Immersion Sn plating was produced on Cu foil by distributing nano-sized diamonds (ND). The ND distributed on the coating surface broke the continuity of Sn-oxide layer, therefore leading to penetrate the molten solder through the oxide and retarding the wettability degradation during a reflow process. Furthermore, the ND in the Sn coating played a role of diffusion barrier for Sn atoms and decreased the growth rate of intermetallic compound ($Cu_6Sn_5$) layer during the solid-state aging. The study confirmed the importance of ND to improve the wettability and reliability of the Sn plating. Complete dispersion of the ND within the immersion Sn plating needs to be further developed for the electronic packaging applications.

Cu 입자가 분산된 Al2O3 다공체의 제조 및 항균특성 (Synthesis and Antifungal Property of Porous Al2O3 with Dispersions of Cu Nanoparticles)

  • 유호석;김민성;오승탁;현창용
    • 한국분말재료학회지
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    • 제21권1호
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    • pp.16-20
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    • 2014
  • In order to fabricate the porous $Al_2O_3$ with dispersion of nano-sized Cu particles, freeze-drying of camphene/$Al_2O_3$ slurry and solution chemistry process using Cu-nitrate are introduced. Camphene slurries with 10 vol% $Al_2O_3$ was frozen at $-25^{\circ}C$. Pores were generated by sublimation of the camphene during drying in air. The sintered samples at 1400 and $1500^{\circ}C$ showed the same size of large pores which were aligned parallel to the sublimable vehicles growth direction. However, the size of fine pores in the internal walls of large pores decreased with increase in sintering temperature. It was shown that Cu particles with the size of 100 nm were homogeneously dispersed on the surfaces of the large pores. Antibacterial test using fungus revealed that the porous $Al_2O_3$/1 vol% Cu composite showed antifungal property due to the dispersion of Cu particles. The results are suggested that the porous composites with required pore characteristics and functional property can be fabricated by freeze-drying process and addition of functional nano particles by chemical method.

상압소결법으로 제조한 Cu 입자 분산 Al2O3 나노복합재료의 미세조직 및 특성 (Microstructure and Properties of Cu Dispersed Al2O3 Nanocomposites Prepared by Pressureless Sintering)

  • 이경환;오승탁
    • 한국분말재료학회지
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    • 제16권4호
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    • pp.280-284
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    • 2009
  • The pressureless sintering behavior of $Al_2O_3$/Cu powder mixtures, prepared from $Al_2O_3$/CuO and $Al_2O_3$/Cu-nitrate, has been investigated. Microstructural observation revealed that $Al_2O_3$ powders with nano-sized Cu particles could be synthesized by hydrogen reduction method. The specimens, pressureless-sintered at $1400^{\circ}C$ for 4 min using infrared heating furnace with the heating rate of $200^{\circ}C$/min, showed the relative density of above 90%. Maximum hardness of 16.1 GPa was obtained in $Al_2O_3$/MgO/Cu nanocomposites. The nanocomposites exhibited the enhanced fracture toughness of 4.3-5.7 $MPa{\cdot}m^{1/2}$, compared with monolithic $Al_2O_3$. The mechanical properties were discussed in terms of microstructural characteristics.

MoO3-CuO 혼합분말의 볼 밀링 및 수소분위기 열처리에 의한 Mo-Cu 복합분말 제조 (Fabrication of Mo-Cu Powders by Ball Milling and Hydrogen Reduction of MoO3-CuO Powder Mixtures)

  • 강현지;오승탁
    • 한국분말재료학회지
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    • 제25권4호
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    • pp.322-326
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    • 2018
  • The hydrogen reduction behavior of $MoO_3-CuO$ powder mixture for the synthesis of homogeneous Mo-20 wt% Cu composite powder is investigated. The reduction behavior of ball-milled powder mixture is analyzed by XRD and temperature programmed reduction method at various heating rates in Ar-10% $H_2$ atmosphere. The XRD analysis of the heat-treated powder at $300^{\circ}C$ shows Cu, $MoO_3$, and $Cu_2MoO_5$ phases. In contrast, the powder mixture heated at $400^{\circ}C$ is composed of Cu and $MoO_2$ phases. The hydrogen reduction kinetic is evaluated by the amount of peak shift with heating rates. The activation energies for the reduction, estimated by the slope of the Kissinger plot, are measured as 112.2 kJ/mol and 65.2 kJ/mol, depending on the reduction steps from CuO to Cu and from $MoO_3$ to $MoO_2$, respectively. The measured activation energy for the reduction of $MoO_3$ is explained by the effect of pre-reduced Cu particles. The powder mixture, hydrogen-reduced at $700^{\circ}C$, shows the dispersion of nano-sized Cu agglomerates on the surface of Mo powders.

TFA-MOD공정에서 $BaCeO_3$ 첨가에 의한 $YBa_2Cu_3O_{7-\delta}$ 박막의 임계전류밀도 증가 (Enhancement of critical current density in $BaCeO_3$ doped $YBa_2Cu_3O_{7-\delta}$ thin Films deposited by TFA-MOD process)

  • 이종범;김병주;이희균;홍계원
    • 한국초전도ㆍ저온공학회논문지
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    • 제10권1호
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    • pp.1-5
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    • 2008
  • The effect of $BaCeO_3$ doping on the critical current density of YBCO film by TFA-MOD method was studied. $BaCeO_3$ doping was made by two method; one is direct addition of $BaCeO_3$ nano-sized powder prepared by citrate process followed by grinding with planetary ball mill for 10 hours. Another is addition of Ba-Ce precursor solution prepared with Ba-acetate and Ce acetate dissolved in TFA to the YBCO-TFA precursor solution. The film was made by standard dip coating and heat treatment process with conversion temperature of $790^{\circ}C$ in 1000 ppm oxygen containing moisturized Ar gas atmosphere. The direct addition of $BaCeO_3$ powder resulted in YBCO film with good epitaxial growth and no evidence of second phase formation. The addition through precursor solution resulted in the increase of critical current density upto 30 at% doping and uniform dispersion of $BaCeO_3$ fine inclusion was confirmed by SEM-EDX.