• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.163-164
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• 2006

ZnO deposition parameters are not independent and have a nonlinear and complex properties respectively. Therefore, finding optimal process conditions are very difficult and need to do many experiments. To predict ZnO deposition result, neural network was used. To gather training data, Si, GaAs, and Glass were used for substrates, and substrate temperature, work pressure, RF power were $50-500^{\circ}C$, 15 mTorr, and 180-210 W respectively, and the purity of target was ZnO 4N. For predicting the result of ZnO deposition process exactly, sensitivity analysis and drawing a response surface was added. The temperature of substrate was evaluated as a most important variable. As a result, neural network could verify the nonlinear and complex relations of variables and find the optimal process condition for good quality ZnO thin films.

• Journal of the Korean Vacuum Society
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• v.8 no.3A
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• pp.194-200
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• 1999

In this paper studied was the piezoelectric properties of the $\beta$-PVDF organic thin films prepared by physical vapour deposition method. The molecular orientation of organic thin films was controlled by the application of an electric field and variation of substrate temperature during the evaporation process. Optimum conditions of manufacturing $\beta$-PVDF organic thin film by physical vapor deposition method is to keep at the substrate temperature of $80^{\circ}C$, at the applied electric field of 142.8 kV/cm. The voltage output coefficient increased from 1.39 to 7.04V increasing the force moment.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.11
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• pp.186-194
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• 2004

In this research, microfabrication technique using localized electrochemical deposition (LECD) with ultra short pulses is presented. Electric field is localized near the tool tip end region by applying a few hundreds of nano second pulses. Pt-Ir tip is used as a counter electrode and copper is deposited on the copper substrate in 0.5 M CuSO$_4$ and 0.5 M H$_2$SO$_4$ electrolyte. The effectiveness of this technique is verified by comparison with LECD using DC voltage. The deposition characteristics such as size, shape, surface, and structural density according to applied voltage and pulse duration are investigated. The proper condition is selected from the results of the experiments. Micro columns less than 10 $\mu$m in diameter are fabricated using this technique. The real 3D micro structures such as micro pattern and micro spring can be fabricated by this method. It is suggested that presented method can be used as an easy and inexpensive method for fabrication of microstructure with complex shape.

• Journal of the Korean institute of surface engineering
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• v.33 no.5
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• pp.319-328
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• 2000

Silver is known to have such characteristics as low shear strength, good transfer-film forming tendency, and good corrosion resistance. Silver thin films have been prepared by ion plating of physical vapour deposition (PVD) using both argon gas pressure and bias voltage of processing condition. After the silver films were prepared, the properties in them were examined by gas pressure and bias voltage of substrate. Their morphology and crystal orientation were investigated by scanning electron microscopy (SEM) and X-ray diffractor. The properties of film were, also, studied to relate with morphology, X-ray diffraction pattern, and friction coefficient at vacuum ambient. The friction coefficient was stabilized remarkably on deposited films with increasing argon pressure for deposition. Also, the effect of increasing of the bias voltage for deposition resulted in lower friction coefficient and stability in $1.7$\times$10^{-4}$ torr. On the contrary, behavior of friction coefficient was stabilized on deposited films with decreasing the bias voltage in $1.7$\times$10^{-5}$ torr for deposition.

• Korean Journal of Materials Research
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• v.29 no.11
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• pp.715-719
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• 2019

Molybdenum is a low-resistivity transition metal that can be applied to silicon devices using Si-metal electrode structures and thin film solar cell electrodes. We investigate the deposition of metal Mo thin film by plasma-enhanced atomic layer deposition (PE-ALD). $Mo(CO)_6$ and $H_2$ plasma are used as precursor. $H_2$ plasma is induced between ALD cycles for reduction of $Mo(CO)_6$ and Mo film is deposited on Si substrate at $300^{\circ}C$. Through variation of PE-ALD conditions such as precursor pulse time, plasma pulse time and plasma power, we find that these conditions result in low resistivity. The resistivity is affected by Mo pulse time. We can find the reason through analyzing XPS data according to Mo pulse time. The thickness uniformity is affected by plasma power. The lowest resistivity is $176{\mu}{\Omega}{\cdot}cm$ at $Mo(CO)_6$ pulse time 3s. The thickness uniformity of metal Mo thin film deposited by PE-ALD shows a value of less than 3% below the plasma power of 200 W.

• Bulletin of the Korean Chemical Society
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• v.11 no.3
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• pp.200-205
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• 1990

Chemically modified electrodes(CMEs), based on 2-imino-1-cyclopentane-dithiocarboxylic acid (icdc) containing carbon paste, have been characterized using cyclic voltammetric techniques. Ag(I) was chemically deposited on the CMEs, and voltammograms were obtained with the electrode in a separate buffer solution. The CME surface can be regenerated with exposure to acid and reused for deposition. In 10 deposition/measurement/regenerate cycles, the linear response have been reproduced up to $1{\times}10^{-6}$ M in linear sweep voltammetry and 1${\times}$10-8 M in differential pulse voltammetry with relative standard deviation of 5.2% and 12.4%, respectiveiy. The sensitivity increased with deposition time and scanning rate, and detection limit was $1{\times}10^{-7}M\;and\;1{\times}10^{-9}M$ at 20 minutes deposition in the linear sweep voltammetry and differential pulse voltammetry, respectively. The presence of some metal ions does not influence the silver ion response. Satisfactory results were obtained for the analysis of the silver ion for a variety of reference materials without interference of Hg ion at the condition of pH = 5-6.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.38-44
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• 2022

Plasma density in semiconductor fabrication equipment becomes higher to achieve the improved the throughput of the process, but the increase of surface corrosion of the ceramic coated chamber wall has been observed by the increased plasma density. Plasma chamber wall coating with aerosol deposition prefer to be firm and uniform to prevent the potential creation of particle inside the chamber from the deformation of the coating materials, and the aerosol discharge nozzle is a good control factor for the deposited coating condition. In this paper, we investigated the design of the nozzle of the aerosol deposition to form a high-quality coating film. Computational fluid dynamics (CFD) study was employed to minimize boundary layer effect and shock wave. The degree of expansion, and design of simulation approach was applied to found out the relationship between the divergence angle and nozzle length as the key parameter for the nozzle design. We found that the trade-off tendency between divergence angle and nozzle length through simulation and quantitative analysis, and present the direction of nozzle design that can improve the uniformity of chamber wall coating.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.74-84
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• 2022

As the semiconductor industry develops, the difficulty of newly required process technology becomes difficult, and the importance of production yield and product reliability increases. As an effort to minimize yield loss in the manufacturing process, interests in the process defect process for facility diagnosis and defect identification are continuously increasing. This research observed the plasma condition changes in the multi oxide/nitride layer deposition (MOLD) process, which is one of the 3D-NAND manufacturing processes through optical emission spectroscopy (OES) and monitored the result of whether the change in plasma characteristics generated in repeated deposition of oxide film and nitride film could directly affect the film. Based on these results, it was confirmed that if a change over a certain period occurs, a change in the plasma characteristics was detected. The change may affect the quality of oxide film, such as the film thickness as well as the interfacial surface roughness when the oxide and nitride thin film deposited by plasma enhenced chemical vapor deposition (PECVD) method.

• Journal of Korea Water Resources Association
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• v.41 no.9
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• pp.863-872
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• 2008

In this study, a series of deposition tests have been conducted on saltwater condition(salinity 32 %o) using an annular flume, in order to estimate depositional properties of kaolinite sediments and to analyze the effect of the initial concentration on them. Total 37 deposition tests have been carried out in three different initial concentrations (1000, 5000, 15000 ppm) with varying the bed shear stress. From these test results, minimum shear stress (or critical shear stress for deposition; ${\tau}_{bmin}$) and the deposition rate parameters (${\sigma}_1,\;({\tau}^*_b-1)_{50},\;{\sigma}_2,\;t_{50}$) for kaolinite sediments have been quantified, and the effects of the initial concentration and salinity on depositional properties of cohesive sediments have been analyzed qualitatively. As the results, ${\tau}_{bmin},\;{\sigma}_1\;and\;({\tau}^*_b-1)_{50}$ are found to be 0.147, 0.74 and $0.65N/m^2$ respectively. Through comparing with results from previous studies, the performance of this study and tests results are shown to be good enough to verify.

• Journal of the Korean Vacuum Society
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• v.10 no.1
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• pp.119-126
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• 2001

Hydrogenated amorphous carbon (a-C:H) films were deposited by ECR-PECVD (electron cyclotron resonance-plasma enhanced chemical vapor deposition) method with deposition conditions such as ECR plasma source power, gas composition of methane and hydrogen, deposition time and substrate bias voltage. The hydrogen content in the films has been measured by ERDA (elastic recoil detection analysis) using 2.5 MeV $He^{++}$ ion beam. From the results of AES (Auger electron spectroscopy), RBS (Rutherford backscattering spectrometry) and ERDA, the composition elements of deposited film were confirmed the carbon atom and the hydrogen atom. It was observed by FTIR (Fourier transform infrared) that the hydrogen contents in the film varied according to the deposition conditions. In deposition condition of substrate bias voltage, the hydrogen contents were decreased remarkably because the amount of dehydrogenation in films was increased as the substrate bias voltage increased. In the rest deposition conditions, the hydrogen contents in the film were measured in the range 45~55%.