• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2015.10a
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• pp.927-929
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• 2015

With rapid progress in digital technology, demand for multi-media imaging devices is increasing. But noise occurs due to various reasons during the process of acquiring, transmitting or processing the image data. Filters used to remove salt and pepper noise include CWMF and AWMF. In areas where the noise density is high, the removal of noise is undermined. This paper suggests an algorithm that preserves the edge while removing noise using spatial weighted.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.2
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• pp.1-9
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• 2017

Recently, there has been a continuous researches on solders having sophisticated and improved performance due to demand for high-density and miniaturization of electronics, and development of solder for automotive electronics which can be used in harsh environment. When developing a new solder alloy, there is a wettability of solder on substrate for things to consider, and the wetting balance test is one of the methods for measuring that one. In this paper, the wetting balance test is introduced, and the calculus of the surface tension of solder and the contact angle between solder and substrate using wetting curve obtained is introduced too. In detail, the principle and test method of the wetting balance test, the introduction of the parameters with important meaning in the wetting curve, the method of calculating the contact angle as well as the surface tension of the solder using the shape of the solder meniscus.

• Journal of Ecology and Environment
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• v.29 no.4
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• pp.343-352
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• 2006

This study investigated the relationship between land cover and the water quality variables in the rivers, which are located in the Yamaguchi prefecture of West Japan. The study area included 12 catchments covering $5,809\;Km^2$. pH, dissolved oxygen, suspended solid, E. coli, total nitrogen and total phosphorus were considered as river water quality variables. Satellite data was applied to generate land cover map. For linking alterations in land cover (at whole catchment and buffer zone levels) and the river water quality variables, multiple regression modeling was applied. The results indicated that non-spatial attribute (%) of land cover types (at whole catchment level) consistently explained high amounts of variation in biological oxygen demand (72%), suspended solid (72%) and total nitrogen (87%). At buffer zone-scale, multiple regression models that were developed to represent the linkage between the alterations of land cover and the river water quality variables could also explain high level of total variations in suspended solid (86%) and total nitrogen (91%).

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.29-33
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• 2012

The demand for 3D wafer level integration has been increasing significantly. Although many technical challenges of wafer stacking are still remaining, wafer stacking is a key technology for 3D integration due to a high volume manufacturing, smaller package size, low cost, and no need for known good die. Among several new process techniques Cu-to-Cu wafer bonding is the key process to be optimized for the high density and high performance IC manufacturing. In this study two main challenges for Cu-to-Cu wafer bonding were evaluated: misalignment and bond quality of bonded wafers. It is demonstrated that the misalignment in a bonded wafer was mainly due to a physical movement of spacer removal step and the bond quality was significantly dependent on Cu bump dishing and oxide erosion by Cu CMP.

• Transactions of the Korean Society of Automotive Engineers
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• v.13 no.4
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• pp.129-134
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• 2005

There is a strong industrial demand for the development of light-weight vehicle to improve fuel efficiency and dynamic performance. The effective method of achieving the weight reduction is to use low-density materials such as aluminum and magnesium. In applying these materials to the vehicle, it is often required to join dissimilar materials such as aluminum and steel. However, conventional joining method, namely resistance spot welding cannot be used in joining dissimilar materials. Self·piercing rivet(SPR) and adhesive bonding is a good alternative to resistance spot welding. In this study, the impact test of double hat-shaped member made by resistance spot welding, SPR and adhesive bonding was performed. As a result, various parameters of crashworthiness were analyzed and evaluated. Also, the applicability of SPR and adhesive bonding as an alternative to resistance spot welding was suggested.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.103-108
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• 2002

The metal-oxide-semiconductor field-effect transistor(MOSFET) has undergone many changes in the last decade In response to the constant demand for increased speed, decreased power, and increased packing density. The state -of-the-art simulation programs are developed by engineers and scientists. This paper has compared commercial programs of Micro-tec and ISE-TCAD in device simulation. This paper investigates LDD MOSFET using two simulators. Bias condition is applied to the devices with gate lengths(Lg) 180㎚. We have presented MOSFET's characteristics such as I-V characteristic and electric field, and compared Micro-tec with ISE TCAD.

• Journal of information and communication convergence engineering
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• v.4 no.3
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• pp.123-129
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• 2006

The limited number of roads and the increasing number of vehicles demand the automatic regulation of overspeed vehicles, illegal vehicles, and overloaded vehicles and the automatic charge calculation depending on the type of the vehicle. To meet such requirements, it is important to remove the shadow of the vehicle as processing and recognizing an image captured by a camera. The shadow of the vehicle is likely to cause misclassification of the vehicle type due to diverse errors and mistakes occurring when detecting geometrical properties of the vehicle. In case that shadows of two different vehicles are overlapped, not only the type of the vehicles may be misclassified but also it is difficult to accurately identify the type of the vehicles. In this paper, we propose a robust algorithm to remove the shadow of a vehicle by calculating the luminance, the chrominance, the gradient density of the cast shadow from information acquired using the image subtraction of the background, and to recognize the substantial vehicle figure. Even when it is hard to detect and split a target vehicle from its shadow as shadows of vehicles are attached to each other, our robust algorithm can detect the vehicle figure only. We implemented our system with a general camera and conducted experiments on various vehicles on general roads to find out our vehicle shade removal algorithm is efficient when detecting and recognizing vehicles.

• KIPS Transactions on Computer and Communication Systems
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• v.4 no.2
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• pp.41-46
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• 2015

The demand on low power and high performance system is soaring due to the extending of mobile and small electronic device market. The 3D die-stacking technology is widely studying for next generation integration technology due to its high density and low access time. We proposed the 3D die-stacked DRAM including a reconfigurable accelerator in a logic layer of DRAM. Also we discuss and suggest a cache-based local memory for a reconfigurable accelerator in a logic layer. The reconfigurable accelerator in logic layer of 3D die-stacked DRAM reduces the overhead of data management and transfer due to the characteristics of its location, so that can increase the performance highly. The proposed system archives 24.8 speedup in maximum.

• Ceramist
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• v.21 no.4
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• pp.312-330
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• 2018

Energy storage/conversion has become crucial not only to meet the present energy demand but also more importantly to sustain the modern society. Particularly, electrical energy storage is critical not only to support electronic, vehicular and load-levelling applications but also to efficiently commercialize renewable energy resources such as solar and wind. While Li-ion batteries are being intensely researched for electric vehicle applications, there is a pressing need to seek for new battery chemistries aimed at stationary storage systems. In this aspect, Zn-ion batteries offer a viable option to be utilized for high energy and power density applications since every intercalated Zn-ion yields a concurrent charge transfer of two electrons and thereby high theoretical capacities can be realized. Furthermore, the simplicity of fabrication under open-air conditions combined with the abundant and less toxic zinc element makes aqueous Zn-ion batteries one of the most economical, safe and green energy storage technologies with prospective use for stationary grid storage applications. Also, Zn-ion batteries are very safe for next-generation technologies based on flexible, roll-up, wearable implantable devices the portable electronics market. Following this advantages, a wide range of approaches and materials, namely, cathodes, anodes and electrolytes have been investigated for Zn-ion batteries applications to date. Herein, we review the progresses and major advancements related to aqueous. Zn-ion batteries, facilitating energy storage/conversion via $Zn^{2+}$ (de)intercalation mechanism.