• Title/Summary/Keyword: defect engineering

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A study on the maintenance for the brush gear of the generator (발전기 브러시기어(Brush Gear) 관리방법 고찰)

  • Lee, K.W.;Park, M.D.;Cha, J.M.
    • Proceedings of the KIEE Conference
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    • 2003.07b
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    • pp.795-797
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    • 2003
  • As defects may be found in the brush gear of the generator due to the quality of the collector ring and the operation environment. A research on the operation condition and defect factors of the collector ring and brush, in relation to the brush gears in generators operating within Korea has been carried out, as well as an analysis of factors that affect the collector rings.

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Diode Equivalent Parameters of Solar Cell

  • Iftiquar, Sk Md;Dao, Vinh Ai;Yi, Junsin
    • Current Photovoltaic Research
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    • v.3 no.4
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    • pp.107-111
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    • 2015
  • Current characteristic curve of an illuminated solar cell was used to determine its reverse saturation current density ($J_0$), ideality factor (n) and resistances, by using numerical diode simulation. High efficiency amorphous silicon, heterojunction crystalline Si (HIT), plastic and organic-inorganic halide perovskite solar cell shows n=3.27 for a-Si and n=2.14 for improved HIT cell as high and low n respectively, while the perovskite and plastic cells show n=2.56 and 2.57 respectively. The $J_0$ of these cells remain within $7.1{\times}10^{-7}$ and $1.79{\times}10^{-8}A/cm^2$ for poorer HIT and improved perovskite solar cell respectively.

Automatic Defect inspection of TFT-LCD Panels Using a Pre-Filter (프리필터를 이용한 TFT-LCD 패널의 자동 결함 검출)

  • Nam, Seung-Uk;Seo, Sung-Dea;Nam, Hyun-Do;Ahn, Dong-Jun
    • Proceedings of the KIEE Conference
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    • 2007.07a
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    • pp.1864-1865
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    • 2007
  • In this paper, we proposed pre-filter algorithms which using frequency domain analysis method, for the detections of defects in large-sized Thin Film Transistor-Liquid Crystal Display(TFT-LCD) panel surfaces. We performed frequency analysis with 1-D, 2-D FFT methods for extract periodic patterns of lattice structures in TFT-LCDs. To remove this patterns, band-stop filters were used for eliminating specific frequency components. In order to acquire only defected images, we used 2-D inverse FFT methods which can be reverts images that remains defects.

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A Semiconductor Defect Inspection Using Fuzzy Method (퍼지 기법을 이용한 반도체 불량 검사)

  • Lee, Dong-gyun;Kim, Kwang-baek
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2009.10a
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    • pp.280-282
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    • 2009
  • 본 논문에서는 굴곡에 의한 조도량의 차이와 명암도 차이를 퍼지 기법에 적용하여 개선된 반도체 불량 검출 방법을 제안한다. 제안된 방법은 먼저 회전각과 양선형 보관법을 이용하여 반도체 영상의 각도를 보정하는 전처리 과정 수행한다. 그리고 굴곡에 대한 조도량의 차이와 패턴 매칭를 이용하여 얻어진 오류 영역의 명암도 차이를 퍼지 소속 함수에 적용하여 결과 값을 추론한다. 최종적으로 비퍼지화된 결과 값을 적용하여 반도체의 초기 불량을 검출한다. 본 논문에서 제안한 방법을 실제 사용되는 반도체 정면 영상과 측면 영상 30쌍을 대상으로 실험한 결과, 기존의 방법에 비해서 반도체의 초기 불량 판단에 효과적인 것을 확인하였다.

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A Study for Accelerated Life Testing and Failure Analysis of Chip Varistor (Varistor 의 ALT(Accelerated Life Testing) 설계 및 주 고장모드 분석)

  • Chang Woo-Sung;Lee Jun-Hyuk;Lee Kwan-Hun;Oh Young-Hwan
    • Proceedings of the Korean Reliability Society Conference
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    • 2005.06a
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    • pp.51-67
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    • 2005
  • General chip SMD parts(chip resistance, chip capacitor, chip varistor etc.) are very wide sed electronics parts for IT units. But, failure modes are indistinct for these chip parts. In factory and field the failure modes are recognized to accidental failure mope caused by potential defect. In this paper used chip varistor ALT(Accelerate Life Test) test for verify general failure modes in chip SMD parts. Also the results are useful for general chip SMD ALT tests.

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Dislocation Analysis of CVD Single Crystal Diamond Using Synchrotron White Beam X-Ray Topography (가속기 백색광 X-Ray Topography를 이용한 CVD 단결정 다이아몬드 내부 전위 분석)

  • Yu, Yeong-Jae;Jeong, Seong-Min;Bae, Si-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.3
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    • pp.192-195
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    • 2019
  • Single-crystal diamond obtained by chemical vapor deposition (CVD) exhibits great potential for use in next-generation power devices. Low defect density is required for the use of such power devices in high-power operations; however, plastic deformation and lattice strain increase the dislocation density during diamond growth by CVD. Therefore, characterization of the dislocations in CVD diamond is essential to ensure the growth of high-quality diamond. In this work, we analyze the characteristics of the dislocations in CVD diamond through synchrotron white beam X-ray topography. In estimate, many threading edge dislocations and five mixed dislocations were identified over the whole surface.

Identification of Partial Discharge Defects based on Back- Propagation Algorithm in Eco-friendly Insulation Gas

  • Sung-Wook Kim
    • Journal of information and communication convergence engineering
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    • v.21 no.3
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    • pp.233-238
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    • 2023
  • This study presents a method for identifying partial discharge defects in an eco-friendly gas insulated system using a backpropagation algorithm. Four partial discharge (PD) electrode systems, namely, a free-moving particle, protrusion on the conductor, protrusion on the enclosure, and voids, were designed to simulate PD defects that can occur during the operation of eco-friendly gas-insulated switchgear. The PD signals were measured using an ultrahigh-frequency sensor as a nonconventional method based on IEC 62478. To identify the types of PD defects, the PD parameters of single PD pulses in the time and frequency domains and the phase-resolved partial discharge patterns were extracted, and a back-propagation algorithm in the artificial neural network was designed using a virtual instrument based on LabVIEW. The backpropagation algorithm proposed in this paper has an accuracy rate of over 90% for identifying the types of PD defects, and the result is expected to be used as a reference database for asset management and maintenance work for eco-friendly gas-insulated power equipment.

Wafer Edge Defect Inspection Device R&D (웨이퍼 엣지 결함(Chip & Crack) 인식 장비 R&D)

  • Kim, Seong-Jin;Kwon, Hyeok-Min;O, Min-Seo
    • Annual Conference of KIPS
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    • 2022.11a
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    • pp.881-883
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    • 2022
  • 고객사에 납품하는 웨이퍼의 안정적인 공급을 위한 웨이퍼 엣지의 결함 검출 장비다. 본 연구에서는 OpenCV와 임베디드 시스템, 머신러닝, 전자 회로 그리고 센서/카메라 기술을 핵심 기술로 R&D 한다. 고객사에서 불량 웨이퍼 발생에 대응하기 위한 장비의 데이터를 생산하여 고객과의 신뢰도 향상 및 유지를 할 수 있다. 그리고 결함이 특정 공정 지점에서 발생하는지 탐색할 수 있다.

A Study on Software Development Effort Allocation using Defect Prediction Performance Model based on CMMI (CMMI 기반 결함 예측 성과 모델을 이용한 소프트웨어 개발 노력 분배 연구)

  • Kwak, Mi-Kyung;Ahn, Young-Jung;Choi, Jin-Young
    • Annual Conference of KIPS
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    • 2008.05a
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    • pp.351-354
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    • 2008
  • 소프트웨어 프로젝트를 진행할 때, 소프트웨어 개발에 투입할 노력의 정확한 추정과 더불어 소프트웨어 생명주기 단계별 적정한 개발노력을 투입하는 것은 프로젝트 성공을 위해 필요한 요소 중 하나이다. 조직의 과거 데이터를 활용한 기존의 개발노력 분배 방식은 단계별로 발생되는 결함의 양에 따라 개발노력의 투입량 변동이 발생될 수 있다. 본 연구에서는 CMMI 조직 프로세스성과(Organization Process Performance) 프로세스 기반의 결함 예측을 이용한 개발노력 분배 성과모델을 제시하고, 제시한 성과모델의 예측값과 프로젝트 수행 결과 값의 비교를 통해서 제시한 성과모델의 유효성 및 결함과 개발노력 분배의 연관성에 대해서 검증 하고자 한다.

Study of the fracture behavior of different structures by the extended finite element method (X-FEM)

  • Zagane Mohammed El Sallah;Moulgada Abdelmadjid;Sahli Abderahmane;Baltach Abdelghani;Benouis Ali
    • Advances in materials Research
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    • v.12 no.4
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    • pp.273-286
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    • 2023
  • The fracture mechanics make it possible to characterize the behavior with cracking of structures using parameters quantifiable in the sense of the engineer, in particular the stress field, the size of the crack, and the resistance to cracking of the material. Any structure contains defects, whether they were introduced during the production of the part (machining or molding defects for example). The aim of this work is to determine numerically by the finite element method the stress concentration factor Kt of a plate subjected to a tensile loading containing a lateral form defect with different sizes: a semicircle of different radii, a notch with different opening angles and a crack of different lengths. The crack propagation is then determined using the extended finite element technique (X-FEM). The modeling was carried out using the ABAQUS calculation code.