• 제목/요약/키워드: cupric

검색결과 139건 처리시간 0.03초

동 및 철이온이 MMA/TBBO레진의 상아질 접착에 미치는 영향 (EFFECT OF CUPRIC AND FERRIC IONS ON BONDING OF MMA/TBBO RESIN TO DENTIN)

  • 박진훈
    • Restorative Dentistry and Endodontics
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    • 제18권2호
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    • pp.423-430
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    • 1993
  • The purpose of this study was to investigate the effect of ferric and ferric ions contained in phosphoric acid solution as a pretreatment solution on bonding of MMA/TBBO resin to dentin. Each of 1 % and 3 % ferric chloride. cupric chloride. cupric sulfate. and cupric nitrate was mixed into 10% phosphoric acid solution and pretreated dentin surface of bovine anterior teeth for 30 seconds followed- by water rinse and dry. Tensile bond strength was determined after bonding of pretreated dentin with MMA/TBBO resin by use of brush-on ;technique and storing for 24 hours in 3it distilled water. The amount of cupric ions adsorbed on pretreated dentin surface was detected by Wave-Dispersion X-ray microanalyzer for different groups of each pretreatment solution containing cupric salts. The pretreatment with cupric ions contained in 10% phosphoric acid solution was effective to increase bonding strength of MMA/TBBO resin to dentin but not in case of ferric ions. The pretreatment with 3 % cupric chloride and cupric nitrate both enhanced significant increase in bonding strength compared to the control group of 10% phosphoric acid solution(p<0.05). Cupric ions measured in pretreated dentin surface was higher in 3 % cupric chloride group than in 1% cupric chloride group, but couldn't find distinct relationship from the results of this experiment between the amount of adsorbed cupric ions according to the kind of cupric salts and the bonding strength value.

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황산구리를 이용한 면/폴리에스터 교직물의 탄화가공 (Burn-out Finishing of Cotton/Polyester Fiber Mixed Fabrics using Cupric Sulfate)

  • 김수미;송화순
    • 대한가정학회지
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    • 제42권8호
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    • pp.113-121
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    • 2004
  • This study used cupric sulfate as a bum-out agent. The concentration of cupric sulfate, temperature and time were varied with glycerin included or excluded on the properties of polyester ground fabrics. The results are as follows. The effect of carbonization with glycerin included was decreased, but removal of carbide with glycerin included was easier than that with glycerin excluded. The white index and tensile strength of polyester ground fabrics were decreased as the processing concentration, temperature and time increased. The shrinkage was increased as the processing concentration, temperature and time increased. The optimum conditions with cupric sulfate as the bum-out agent was 5% concentration, 140$^{\circ}C$, 3min., and 3kgf/cm$^2$ and with cupric sulfate added to glycerin was 5% concentration, 150$^{\circ}C$, 5min., and 3kgf/cm$^2$.

물-아세틸아세톤 용매계에서 나트륨이온과 구리이온의 표준이동 자유에너지 (Standard Transfer Free Energy of Sodium and Cupric Ions in Water-Acetylacetone Solvent System)

  • 이흥락;박종택
    • 대한화학회지
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    • 제36권5호
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    • pp.632-637
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    • 1992
  • 물-아세틸아세톤 용매계에서 과염소산나트륨과 과염소산구리의 표준이동 자유에너지는 갈바니전지의 기전력을 측정하여 구하였으며, 이 용매계에서 나트륨이온과 구리이온의 표준이동 자유에너지는 extrathermodynamic procedure로서 테트라페닐붕산 테트라부틸암모늄 가정을 써서 계산하였다. 물로부터 아세틸아세톤 용매로 나트륨이온과 구리이온이 이동할 때의 표준자유에너지값은 25${\circ}C$에서 각각 5.09 및 4.16 kcal/mol이었다. 이 값은 아세틸아세톤이 물보다 나트륨이온과 구리이온에 대하여 약한 donor solvent임을 뜻한다. 물로부터 소량의 아세틸아세톤을 포함하는 혼합용매로 구리이온이 이동할 때의 표준자유에너지값은 이상하게 (-)값을 나타내는데, 이것은 아세틸아세톤이 구리이온과 반응하여 킬레이트를 생성하는 효과 때문이다.

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산화구리에 의한 이산화황의 제거와 수소에 의한 황산구리의 환원 (Removal of Sulfur Dioxide by Cupric Oxide and Reduction of Cupric Sulfate by Hydrogen)

  • 노용우;이명철;이재훈;이태희
    • 한국대기환경학회지
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    • 제10권2호
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    • pp.83-89
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    • 1994
  • The reaction of sulfur dioxide with cupric oxide was investigated over a temperature range of 300-50$0^{\circ}C$, and the regenaration reaction was studied using cupric sulfate and hydrogen over a temperature range of 240-35$0^{\circ}C$ in a fixed bed reactor. The experimental results showed that the efficiencies for elimination and regenaration reactions were maximum at 45$0^{\circ}C$ and at 30$0^{\circ}C$ respectively. In both cases the experimental data could be interpreted properly by shrinking unreacted core model while the chemical reaction is rate controlling step. The reaction rate constants were determined to be 24.88 exp(-6724/RT) (cm/min) for elimination reaction, and 0.0165 exp(-2047/RT)(cm/min ) for regeneration reaction.

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Hydrogen sensing of Nano thin film and Nanowire structured cupric oxide deposited on SWNTs substrate: A comparison

  • ;;오동훈;;정혁;김도진
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2009년도 춘계학술발표대회
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    • pp.52.1-52.1
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    • 2009
  • Cupric oxide (CuO) is a p-type semiconductor with band gap of ~1.7 eV and reported to be suitable for catalysis, lithium-copper oxide electrochemical cells, and gas sensors applications. The nanoparticles, plates and nanowires of CuO were found sensing to NO2, H2S and CO. In this work, we report about the comparison about hydrogen sensing of nano thin film and nanowires structured CuO deposited on single-walled carbon nanotubes (SWNTs). The thin film and nanowires are synthesized by deposition of Cu on different substrate followed by oxidation process. Nano thin films of CuO are deposited on thermally oxidized silicon substrate, whereas nanowires are synthesized by using a porous thin film of SWNTs as substrate. The hydrogen sensing properties of synthesized materials are investigated. The results showed that nanowires cupric oxide deposited on SWNTs showed higher sensitivity to hydrogen than those of nano thin film CuO did.

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산화동에 있어 온도변화에 의한 전기전도도에 관한 연구 (The Dependence of Electrical Conductivity of Cupric Oxide on Temperature)

  • 안영필;이희동
    • 한국세라믹학회지
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    • 제20권2호
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    • pp.161-165
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    • 1983
  • We studied the dependence of electrical conduction mechanism of Cupric Oxide on temperature and measured the specific resistivity of sintered specimen from $600^{\circ}C$ to 90$0^{\circ}C$ . We considered the relations between electrical conducti-vityand temperature with reheating the sintered specimen. X-Ray diffraction patterns showed that lattice parameters of cupric oxide increased above 20$0^{\circ}C$. Cupric oxide had nostoichiometric compositions$(CuO_{1+x})$ owing to the excess oxygen and showed hole conduction with energy gap of 0.15eV below $650^{\circ}C$$\pm$1$0^{\circ}C$ Above $650^{\circ}C$$\pm$1$0^{\circ}C$ cupic oxide had the stoichiometric composition and showed electron-hole conduction owing to the intrinsic ionization with energy gap of 1.04V.

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Cupric Complexes Produced from the Reaction of Cupric Nitrate Trihydrate with S-2-Pyridyl Thioates

  • Choi, Young-Nam;So, Hyun-Soo;Lee, Jae-In;Kim, Sung-Gak
    • Bulletin of the Korean Chemical Society
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    • 제7권5호
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    • pp.385-388
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    • 1986
  • The reaction of cupric nitrate trihydrate with S-2-pyridyl thioates in acetonitrile was studied. The major products were the corresponding carboxylic acids and $[Cu(NO_3)(C_5H_4NS)(C_5H_5NS$)] (Complex A). Sometimes $[Cu(NO_3)(C_5H_4NS)(H_2O$)] was also obtained in addition to Complex A. When Complex A was recrystallized in dimethylsulfoxide, $[Cu(NO_3)(C_5H_4NS)(C_5H_5NS)$ {$(CH_3)_2SO$}$_2]{\cdot}2H_2O$ was crystallized. The structures of these copper complexes and the role of cupric nitrate in the hydrolysis of S-2-pyridyl thioates are discussed.

CuO/Zeolite에 의한 $SO_2$의 제거 및 재생 (Removal and Regeneration of $SO_2$ by Cupric Oxide Supported on Zeolite)

  • 이승재;신창섭;이태희
    • 한국대기환경학회지
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    • 제6권2호
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    • pp.161-167
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    • 1990
  • The reaction of sulfur dioxide with cupric oxide supported on zeolite was investigated over a temperature range of $250{\sim}450^{{\circ}C$. After the completion of the $SO_2$ removal reaction, the cupric sulfate produced was regenerated to copper by hydrogen or LPG. The experimental results showed that the removal efficiency of $SO_2$ was improved with temperature increase and with $SO_2$ inlet concentration decrease. The reaction of $SO_2$ with CuO/Zeolite was well explained by the shrinking unreacted core model using first order chemical reaction control and diffusion control. THe reaction rate constant and the effective diffusivity were respectively as follows: 1k (cm/s) = 2.519 exp[-10991 (cal/mol)/RT] $De(cm^2/s) = 2.06 \times 10^{-5} exp[-8380 (cal/mol)/RT]$

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이중확산대류계에서의 부력효과에 관한 연구(Ⅰ)- 실험적 연구 - (A Study on Buoyancy Effects in Double-Diffusive Convecting System)

  • 김양훈;현명택;김민찬
    • 한국해양공학회지
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    • 제13권1호통권31호
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    • pp.121-129
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    • 1999
  • Double-diffusive convection with verical temperature and concentration gradients in thermally stratified fluids has been investigated experimentally using an electrochemical technique. Cupric sulfuric-sulffuric acid solution confined between two horizontal copper electrodes was used. The change of thermal and solutal buoyance has no influence on the range of voltage for the limiting current. Due to Soret effect, the onset time of natural convection is delayed as the stabilizing thermal buoyancy decreases. Also it is found that the shrinkage of the unstabilizing solutal buoyancy makes the onset of natural convection retard. Multi-layered convective phenomena do not appear because cupric sulfate-sulfuric acid solution is thermally stratified, and heat diffuses faster than cupric sulfate solfate solution.

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저온소성 기판과 Cu와의 동시소성에 미치는 CuO의 첨가효과 (The Influence of CuO on Bonding Behaviors of Low-Firing-Substrate and Cu Conductor)

  • 박정현;이상진
    • 한국세라믹학회지
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    • 제31권4호
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    • pp.381-388
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    • 1994
  • A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

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