• Journal of the Korean Society for Precision Engineering
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• v.15 no.2
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• pp.170-177
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• 1998

The purpose of superconducting magnetic bearing flywheel energy storage system(SMB-FESS) is to store unused nighttime electricity as kinetic energy and convert it to electricity during daytime. The SMB-FESS is proposed as an efficient energy storage system because there is no mechanical problems, such as friction and wear The flywheel over SMB is rotated at a high speed, 50,000rpm. The major source of energy loss in the SMB-FESS is vibration of flywheel. Therefore, the vibration characteristics of SMB-FESS should be identified. In this study, the axial/radial stiffness and damping coefficient of SMB are measured by a vibration test. Natural frequencies and natural modes of flywheel and magnet are analyzed by a finite element method. The modal analysis of system is performed using the modal parameters of each component and the measured stiffness/damping coefficient. So, natural at frequencies and mode shapes of the joined system can be obtained. According to critical speed analysis, the system has two rigid conical modes in the low speed range. Nevertheless, the system has not been affected by the critical speed in the main operating range.

• Earthquakes and Structures
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• v.18 no.5
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• pp.543-553
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• 2020

Past earthquakes experience shows that serious damage or collapse of buildings have dramatically accrued when sufficient separation distance has not been provided between two adjacent structures. The majority of past studies related to the pounding topic indicate that obtaining the gap size between two buildings is able to prevent collision and impact hazards during seismic excitations. Considering minimization of building collisions, some relationships have been suggested to determine the separation distance between adjacent buildings. Commonly, peak lateral displacement, fundamental period and natural damping as well as structural height of two adjacent buildings are numerically considered to determine the critical distance. Hence, the aim of present study is to focus on all mentioned parameters and also utilizing the main characteristic of earthquake record i.e. PGA to examine the lateral displacement of irregular structures close to each other and also estimate the sufficient separation distance between them. Increasing and decreasing the separation distance is inherently caused economical problems due to the land ownership from a legal perspective and pounding hazard as well. Therefore, a new equation is proposed to determine the optimum critical distance. The accuracy of the proposed formula is validated by different models and various earthquake records.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• Progress in Superconductivity and Cryogenics
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• v.15 no.4
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• pp.1-5
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• 2013

This paper reviews recent progress in research and development (R&D) of reactive co-evaporation for high performance REBCO coated conductors in Korea. Two types of reactive co-evaporation methods were developed for the deposition of SmBCO and GdBCO superconducting layers respectively on the IBAD (Ion Beam Assisted Deposition)-MgO template in the Korean coated conductor project. Batch type reactive co-evaporation equipment and its processing were developed for SmBCO coated conductors at Korea Electrotechnology Research Institute (KERI) in conjunction with the Korea Advanced Institute of Science and Technology (KAIST), and a very high critical current exceeding 1,000 A/cm at 77 K in the self field was achieved through the optimization of deposition parameters. Reel-to-reel type reactive co-evaporation processing with a high conversion rate was also developed, while long length GdBCO coated conductors have been routinely produced by SuNAM Co. The minimum critical current of 422 A/cm-w at 77 K in self field was confirmed for 1 km-long GdBCO tape.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.597-600
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• 2003

Bi-2223/Ag HTS wires have been fabricated by the PIT(powder in tube)process. Intermediate annealing was carried out to increase the homogenization and uniformity of the superconducting filaments embedded in the silver matrix during the deformation process that is important to sustain the engineering critical current density in long superconducting wire. Intermediate annealing act to release the deformation hardening of the superconducting wires during drawing process. Rolling parameters were investigated to roll the superconducting tapes with uniform thickness, width and winding tensions. Critical current of 60 m long superconducting tapes was measured 54.3 A continuously after final sintering heat treatment. The phase analysis of Bi-2223/Ag superconducting tapes are examined by the XRD.

• Progress in Superconductivity
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• v.4 no.1
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• pp.90-93
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• 2002

The sintering process of BSCCO 2223 tapes is a complex process that is very sensitive to parameters, such as temperature, oxygen partial pressure, heating and cooling rate and holding time. During the first heat treatment, 2212 phase of precursor powder is partially transformed into 2223 phase and some residual secondary phases, such as $(Bi,Pb)_2$$Sr_2$CuO／sub y／(2201), $(Ca,Sr)_2$CuO／sub y／(2/1AEC), (Ca,Sr)／sub 14／Cu／sub 24／O／sub 41／(14／24 AEC) etc. The secondary phases are difficult to be removed from the BSCCO 2223 matrix on the heat treatment. These secondary phases degrade the critical current density. In order to minimize the amount and size of alkaline earth cuprate(AEC) particles step heat treatment is applied during the first heat treatment under the varying atmosphere. Experimental results showed that by adapting the step heat treatment process, the amount and particle size of the secondary phases in the final tapes are decreased. Consequently, the BSCCO 2223grain texture and Jc properties are improved.

• Proceedings of the KIEE Conference
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• 1994.07a
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• pp.183-185
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• 1994

A new method for determination of electric parameter of cell membranes is proposed. Two circular electrodes is designed to have repulsive force. From the potential energy analysis, stable points where a cell is levitated between electrodes exist and move as frequency or voltage change. The levitated cell in the stable point fall freely when DEP force is zero. The DEP force is dependent on the frequency and the force is zero at the critical frequency. The critical frequency is determined by measuring the difference between the time taken at zero-applied voltage and the time taken at the frequency and the voltage. For example, the critical frequency and stable points of N.crassa slime cell is numerically evaluated. In the exeriment, polystyrene in water is levitated at the stable point. We show that the stable point move as the applied voltage is changed.

• Nuclear Engineering and Technology
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• v.52 no.10
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• pp.2353-2360
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• 2020

An anodic electrophoretic deposition (EPD) technique is used to create a uniform TiO₂ thin film coating on boiling thin steel plates (1.1 mm by 90 mm). All of the effective parameters except time of the EPD method are kept constant. To investigate the effect of gamma irradiation on the critical heat flux (CHF), the test specimens were irradiated in a gamma cell to different doses ranging from 100 to 300 kGy, and then SEM and BET analysis were performed. For each coated specimen, the contact angle and capillary length were measured. The specimens were then tested in a boiling pool for CHF and boiling heat transfer coefficient. It was observed that irradiation significantly decreases the maximum pore diameter while it increases the porosity, pore surface area and pore volume. These surface modifications due to gamma irradiation increased the CHF of the nano-coated surfaces compared to that of the unirradiated surfaces. The heat transfer coefficient (HTC) of the nano-coated surfaces irradiated at 300 kGy increased from 83 to 160 kW/(㎡ K) at 885 kW/㎡ wall heat flux by 100%. The CHF of the irradiated (300 kGy) and unirradiated surfaces are 2035 kW/㎡ and 1583 kW/㎡, respectively, an increase of nearly 31%.

• Journal of the Society of Naval Architects of Korea
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• v.45 no.2
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• pp.157-167
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• 2008

Six smooth flat tensile specimens and eighteen punch specimens with three different thicknesses were machined from steel of JIS G3131 SPHC. In addition to punch tests, incremental tensile tests were conducted to obtain average true flow stress - logarithmic true strain curves. Through parametric FE simulations for the tensile specimens, material parameters related to GTN model were identified. Using indenters with three kinds of radius, punch tests were carried out to obtain fracture characteristics of punch specimens. Numerical analyses using both fracture models, GTN and $J_2$ plasticity model, gave that the former estimated well the fracture of punch specimen but the latter did not. A new concept for critical size of plate elements was introduced based on minimum relative sharpness between contact structures. Consequently, a new criterion for critical element size was proposed to be less than 20% of minimum relative radius of interacting structures.