• Journal of the Korea Concrete Institute
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• v.13 no.5
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• pp.457-465
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• 2001

Shrinkage strains of concrete slab in multi-story building are restrained by structural members such as columns or walls, then can induce cracks due to excessive shrinkage stress over tensile strength of member. In this study, a shrinkage stress analysis method of concrete slab in multi-story building considering not only material properties such as shrinkage, creep and reinforcement effect but also construction sequence is proposed. Tensile stresses of slab due to shrinkage are calculated by converting shrinkage strains into equivalent temperature gradients, creep that can release shrinkage stress can be considered by replacing the modulus of elasticity of concrete, Ec , to the effective secant modulus of elasticity of concrete, E$\_$eff/ Reinforcements are also considered by modeling them as equivalent beam elements in FEM program. Results of step by step analysis reflecting construction sequence summed up to calculate stresses of the whole building considering that shrinkage stresses of the building come from the difference of shrinkage between i-th floor and (i-1)-th floor, named as effecitive shrinkage, and it can be varied by construction sequence. The results of 10-story example building show that shrinkage stresses of lower floors are greater than those of upper floors, that is, stresses of lower floors(1∼2FI.) exceed modulus of rupture of concrete, but stress ratios of higher floors are in the range of 27.9∼92.8%.

• Journal of the Korea Concrete Institute
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• v.15 no.2
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• pp.280-287
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• 2003

To evaluate the practical application of oyster shells(OS) as construction materials, an experimental study was performed. More specifically, the long-term mechanical properties and durability of concrete blended with oyster shells were investigated. Test results indicate that long-term strength of concrete blended with 10% oyster shells is almost identical to that of normal concrete. However, the long-term strength of concrete blended with 20% oyster shells is appreciably lower than that of normal concrete. Thereby, concrete with higher oyster shell blend has the possibility of negatively influencing the concrete long-term strength. Elastic modulus of concrete blended with crushed oyster shells decreases as the blending mixture rate increases. Namely, the modulus is reduced to approximately 10∼15% when oyster shells are blended up to 20% as the fine aggregate. The drying shrinkage strain increases with an increasing crushed oyster shells substitution rate. In addition, the existing model code of drying shrinkage and creep do not coincide with the test results of this study. An adequate prediction equation needs to be developed. The utilization of oyster shells as the fine aggregate in concrete has an insignificant effect on fleering and thawing resistance, carbonation and chemical attack of concrete. However, water permeability is considerably improved.

• Journal of the Korean Recycled Construction Resources Institute
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• v.8 no.4
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• pp.498-505
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• 2020

Aggregate occupies about 70-85% of the concrete volume and is an important factor in reducing the drying shrinkage of concrete. However, when constructing high-rise buildings, it acts as a problem due to the high load of natural aggregates. If the load becomes large during the construction of a high-rise building, creep may occur and the ground may be eroded. Material costs increase and there are financial problems. In order to reduce the load on concrete, we are working to reduce the weight of aggregates. However, artificial lightweight aggregates affect the interface between the aggregate and the paste due to its higher absorption rate and lower adhesion strength than natural aggregates, affecting the overall strength of concrete. Therefore, in this study, in order to grasp the interface between natural aggregate and lightweight aggregate by type, we adopted a method of measuring electrical resistance using an EIS measuring device, which is a non-destructive test, and lightweight bone. The change in the state of the interface was tested on the outside of the material through a blast furnace slag coating. As a result of the experiment, it was confirmed that the electric resistance was about 90% lower than that in the air-dried state through the electrolyte immersion, and the electric resistance differs depending on the type of aggregate and the presence or absence of coating. As a result of the experiment, the difference in compressive strength depending on the type of aggregate and the presence or absence of coating was shown, and the difference in impedance value and phase angle for each type of lightweight aggregate was shown.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Transactions of Materials Processing
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• v.14 no.4 s.76
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• pp.384-391
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• 2005

The nickel-based alloy Nimonic 80A possesses the excellent strength, and the resistance against corrosion, creep and oxidation at high temperature. Its products are used in aerospace engineering, marine engineering and power generation, etc. Control of forging parameters such as strain, strain rate, temperature and holding time is important because change of the microstructure in hot working affects the mechanical properties. Change of the microstructure evolves by recovery, recrystallization and grain growth phenomena. The dynamic recrystallization evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range of $0.05\~5s^{-1}$ using hot compression tests. The metadynamic recrystallization and grain growth evolution has been studied in the temperature range of $950\~1250^{\circ}C$ and strain rate range $0.05,\;5s^{-1}$, holding time range of 5, 10, 100, 600 sec using hot compression tests. Modeling equations are proposed to represent the flow curve, recrystallized grain size, recrystallized fraction and grain growth phenomena by various tests. Parameters in modeling equations are expressed as a function of the Zener-Hollomon parameter. The modeling equation for grain growth is expressed as a function of the initial grain size and holding time. The modeling equations developed were combined with thermo-viscoplastic finite element modeling to predict the microstructure change evolution during hot forging process. The grain size predicted from FE simulation results is compared with results obtained in field product.

• Journal of the Korean Geotechnical Society
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• v.21 no.3
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• pp.133-140
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• 2005

In order to accelerate the rate of consolidation settlement and gain a required shear strength for a given soft clay deposit, vertical drain method combined with a preloading technique has been widely applied. In this paper, a theory of axisymmetric nonlinear consolidation fer drainage-installed deposit, which considers secondary compression (or creep) during primary consolidation, as well as the variations of compressibility and permeability during the consolidation process, has been developed. A computer program named AXICON based on Hypothesis B fur the analysis of axisymmetric nonlinear consolidation was developed by adopting finite difference method. The results of AS(ICON were compared with Hansbo's solution based on Hypothesis A, as well as in-situ settlements and pore pressures measured in test embankment of Ska-Edeby. The results indicated that Hypothesis A usually underestimated the in-situ settlement and Hypothesis B was considered to be logically correct. It was also shown that one may able to appropriately predict the real in-situ behaviors using the proposed program.

• Applied Chemistry for Engineering
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• v.20 no.4
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• pp.459-463
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• 2009

In this study, physical properties of poly(vinyl acetate-co-ethylene) (VAE) emulsion were investigated by adding different amounts of di-butyl phthalate (DBP) which is a common plasticizer of VAE. The glass transition temperature $(T_g)$ of the dried plasticized VAE emulsion film, which measured by Differential Scanning Calorimeter, was decreased with increasing the DBP contents while the viscosity of the plasticized VAE emulsion was increased with the DBP contents. These results suggest that the plasticizer in the dried VAE film can prevent the strong interaction between chains, resulted by the decrease of $T_g$. In the emulsion, however, the particle sizes were swelled by the penetration of plasticizers and then its viscosity increased with the DBP content. When the DBP was added, the mechanical properties of the plasticized VAE films, such as tensile strength, elongation and creep resistance, were decreased while the water resistance was increased.

• Journal of Welding and Joining
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• v.33 no.4
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• pp.30-36
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• 2015

Austenite stainless steel(SA213-TP347H) has widely been used for the superheater & reheater tube in USC(ultra-supercritica) coal boiler because of its high creep rupture strength and anti-oxidation. But recently, the short-term failures have happened frequently in heat affected zone for only 4,000~15,000hours of service. Many investigations have been conducted to understand the failure mechanism. The root cause of failure was comfirmed to "strain induce participation hardening crack" or "reheat cracking". This mechanism often occurred due to weld residual stress and precipitation of the Cr, Nb carbides in the stabilized stainless steel such as TP347H. This paper presents an analysis of failure tube and effect of the sample tubes that conducting stabilizing heat treatment in site after 11,380hours & 16,961hours of service. Visual inspection was performed. In addition, microscopic characteristics was identified by O.M, SEM, and hardness test was carried out to find out the heat treatment effects. Failures seem to happen because of being not conducted stabilizing heat treatment in site. And another cause is inadequate weld parameter such as pass, ampere, voltage, inter-pass temperature. Thus, this paper has the purpose to describe that how to prevent similar failures in those weld-joints.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.09a
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• pp.519-526
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• 2010

The construction site for $\bigcirc\bigcirc$ transformer substation was located at a mountain valley. In order to prepare the site, the valley was first filled with crushed rock debris up to 63m. Since the main concern of this project is to minimize differential settlement of the foundation of transformer facilities, dynamic compaction was performed every 7m followed by reinforcement with EMP(Ez-Mud Piling). The EMP is one of bored piling methods, in which a hole is bored by means of air percussion and maintain by injecting Ez-Mud. Then a PHC pile (Pretensioned spun High strength Concrete pile) is embedded and finalized with a hammer. In this study, bearing capacities and long term behavior of a pile installed by EMP were investigated. To achieve these objectives, a series of tests such as static and dynamic load tests were conducted. In addition, a construction quality control standard was proposed based on the test results.