• Journal of the Korean Society of Industry Convergence
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• v.25 no.6_2
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• pp.1047-1053
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• 2022

The leaf spring for a truck absorbs shocks or vibrations from the road surface while driving with the elastic force of the material and prevents the shock from being transmitted to the vehicle body. It is subjected to cyclic stress, and fatigue fracture occurs frequently. This study analyzes fractured leaf spring from a 25 ton truck that has been operating for about a year. In the fractured portion, which is the origin of crack, inclusions were observed, and fatigue failure was caused by cyclic stress. In the stress calculation and FE analysis, the stress at the center of the leaf spring was obtained to be 54~65% of the yield strength of the base material and damaged material. It is most important to prevent the mixing of impurities in the steel manufacturing for leaf springs. The large stress portion of the leaf spring needs to introduce compressive residual stress by peening etc.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.543-547
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• 2011

Primary water stress corrosion cracking has occurred in dissimilar weld areas in nuclear power plants. Residual stress is a driving force in the crack. Residual stress may be generated by weld or surface machining. Residual stress due to surface machining depends on the machining method, e.g., milling, grinding, or EDM. The stress is usually distributed on or near the surface of the material. We present the measured residual stress for machining on SA 508 and austenitic stainless steels such as TP304 and F316. The residual stress can be tensile or compressive depending on the machining method. The depth and the magnitude of the residual stress depend on the material and the machining method.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.1-7
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• 2006

A major failure mode for wafer level chip size package (WLCSP) is thermo-mechanical fatigue of solder joints. The mechanical strains and stresses generated by the coefficient of thermal expansion (CTE) mismatch between the die and printed circuit board (PCB) are usually the driving force for fatigue crack initiation and propagation to failure. In a WLCSP process peripheral or central bond pads from the die are redistributed into an area away using an insulating polymer layer and a redistribution metal layer, and the insulating polymer layer affects solder joints reliability by absorption of stresses generated by CTE mismatch. In this study, several insulating polymer materials were applied to WLCSP to investigate the effect of insulating material. It was found that the effect of property of insulating material on WLCSP reliability was altered with a solder ball layout of package.

• Composites Research
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• v.29 no.2
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• pp.73-78
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• 2016

In this paper, The concept of a wheel with carbon fiber composite is to replace the conventional material used for a wheel hub, such as plastic, with a disk-type hub made of carbon fabric and epoxy resin. The impact load from the ground under real conditions was considered; a low-velocity impact test was conducted to evaluate the impact performance of the carbon wheel and compare it with that of a conventional plastic wheel. This study applied a 70 J impact load as a test condition. The impact energy was controlled in the test by adjustment of height and weight of impactor. The use of a carbon disk wheel hub was confirmed to reduce weight and generate an excellent repulsive force at low energy under conditions similar to real driving conditions. The results showed that the maximum load increased proportionally depending on the impact load, but the growth of the maximum load was reduced at a 20 J impact load and tended to decrease at a 45 J impact load. The carbon wheel showed excellent properties ; the level of rebounding was 35.3% and 19.1% of the total impact energy at impact loads of 5 J and 10 J, respectively. On the other hand, the carbon disk wheel rebounded less than 5% of the total energy due to crack generation of the thin carbon hub for impact loads of more than 20 J.