• Korean Journal of Materials Research
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• v.20 no.9
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• pp.472-477
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• 2010

$Al_2O_3$ has received wide attention with established use as a catalyst and growing application in structural or functional ceramic materials. On the other hand, the boehmite (AlO(OH)) obtained by sol-gel process has exhibited a decrease in surface area during phase transformation due to a decline in surface active site at high temperature. In this work, $Al_2O_3$-CuO/ZnO (ACZ) and $Al_2O_3$-CuO/CeO (ACC) composite materials were synthesized with aluminum isopropoxide, copper (II) nitrate hemi (pentahydrate), and cerium (III) nitrate hexahydrate or zinc (II) nitrate hexahydrate. Moreover, the Span 80 as the template block copolymer was added to the ACZ/ACC composition to make nano size particles and to keep increasing the surface area. The ACZ/ACC synthesized powders were characterized by Thermogravimetry-Differential Thermal analysis (TG/DTA), X-ray Diffractometer (XRD), Field-Emmision Scanning Electron Microscope (FE-SEM), Bruner-Emmett-Teller (BET) surface analysis and thermal electrical conductivity (ZEM-2:M8/L). An enhancement of surface area with the addition to Span 80 surfactant was observed in the ACZ powders from 105 $m^2$/g to 142 $m^2$/g, and the ACC powders from 103 $m^2$/g to 140 $m^2$/g, respectively.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1203-1204
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• 2006

Cu-$TiB_2$ nanocomposite powders were synthesized by combining high-energy ball-milling of Cu-Ti-B mixtures and subsequent self-propagating high temperature synthesis (SHS). Cu-40wt.%$TiB_2$ powders were produced by SHS reaction and ball-milled. The milled SHS powder was mixed with Cu powders by ball milling to produce Cu-2.5wt.%$TiB_2$ composites. $TiB_2$ particles less than 250nm were formed in the copper matrix after SHS-reaction. The releative density, electrical conductivity and hardness of specimens sintered at $650-750^{\circ}C$ were nearly 98%, 83%IACS and 71HRB, respectively. After heat treatment at 850 to $950^{\circ}C$ for 2 hours under Ar atmosphere, hardness was descedned by 15%. Our Cu-$TiB_2$ composite showed good thermal stability at eleveated temperature.

• Korean Journal of Metals and Materials
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• v.48 no.12
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• pp.1097-1102
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• 2010

Silver coated copper powders were prepared by a chemical reduction method with controlling the deposition process variables such as the feeding rate of the silver ionic solution and concentration of the reductants at room temperature. The characteristics of the products were evaluated by scanning electron microscope (SEM), X-ray diffractometer (XRD), atomic absorption spectrophotometer (AA) and a 4 probe resistivity measurement system. The optimum condition of the preparation of Ag coated Cu powders was at 0.05 M of potassium sodium tartrate and 2 ml/min of the feeding rate of the silver ionic solution. Our method successfully produced dense, uniform, and well-dispersed Ag coated Cu powder of $2{\sim}2.5{\mu}m$ witha silver layer of 100~200 nm. Additionally, we found that thespecific resistivity of the 30 wt.% Ag coated Cu powder was similar to that of pure silver, so that the composite powder could be used as an alternative electromagnetic shielding material for silver.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.11
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• pp.6015-6022
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• 2013

It has been known that there are large amount of nitric acid and valuable metals, copper in the plating waste solution of automobile wheel. As nitric acid and valuable metals are high price and toxic, they should be recovered for economics and environment. Plating waste was extracted with TBP diluted with kerosene. The concentration of nitric acid in aqueous phase was analyzed by titration method by NaOH solution (0.1~1.0N) and the amount of metals by ICP-MS and ICP-AES. The concentration of copper in plating waste were 76,850 mg/L. The concentration of nitric acid in plating waste was 1.02 M. After three step extraction was performed with 50% TBP, each organic phase was stripped three times with distilled water to obtain 48.1% of nitric acid. Purity of final nitric acid was over 99.9% by ICP analysis. After recovery of nitric acid, copper was extracted with various solvent extractors like PC 88A, D2EPHA, LIX 84 and ISE 106. Among these extractors, 92% of copper was recovered by ISE 106 after 1st extraction and 30% $H_2SO_4$ stripping. Copper ion was reduced with $N_2H_4$ to make metal powders, respectively.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.51-54
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• 2015

An electro-plating technology on a cured isotropic conductive pattern with a hybrid Cu paste composed of resin matrix, copper, and solder powders has been developed. In a conventional technology, Ag paste was used to perform a conductive pattern on a PCB or silicon substrate. From previous research, the electrical conductive mechanism and principle of the hybrid Cu paste were concisely investigated. The isotropic conductive pattern on the PCB substrate was performed using screen-printing technology. The optimum electro-plating condition was experimentally determined by processing parameters such as the metal content of the hybrid Cu paste, applied current density, and time for the electroplating in the plating bath. The surfaces and cross-sections were observed using optical and SEM photographs. In conclusion, the optimized processing conditions for Cu electro-plating technology on the conductive pattern were a current density of $40mA/cm^2$ and a plating time of 20min on the hybrid Cu paste with a metal content of 44 vol.%. More details of the mechanical properties and processing conditions will be investigated in further research.

• Resources Recycling
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• v.3 no.2
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• pp.28-34
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• 1994

A part of used cables, such as electric and communication cables has already been recycled by using simple processing methods. However, it has been found that the main problems in recycling of the used cables are insufficient treatment of fine stranded wires and low recovery of copper by air separation process. It has been shown that copper can be effectively separated from the PE using a solvent treatment method. In the present study, the used communication wires having diameter of 0.4 mm are treated in the mixing solution of toluene and water at $86^{\circ}C$ for about 10 minutes. In the solvent treatment, the copper wires recovered have 10~15mm length, which are much longer than that of 1~2mm length copper wires recovered by air table concentration method used in current recycling plants. The process consisting of cutting, air separation and electrostatic separation would be recommendable for the treatment of mixed cables. In this investigation, fine copper powders can also efficiently be recovered from insulation materials using electrostatic separator at the conditions of 20~50RPM roller speed and 15~30KV high DC power.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1076-1077
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• 2006

Conductive pastes consist of conductive fillers( Au, Ag, Ni, Cu etc.), organic binders, solvents and additives. Meanwhile, there are some metal powders such as copper, nickel etc that are used for pastes which have serious surface corrosion problems. This problem leads to change of the color and decrease in conductivity and affect storage stability of conductive pastes. By using silane coupling agent and dispersion agent, we can ensure both the corrosion stability and long term storage stability, and enhance the high performance electrical and mechanical properties of EMI shielding silicone sealant.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09a
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• pp.306-307
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• 2006

The sinter-bonding behavior of iron based powder mixtures was investigated. To produce the green compacts to be joined the following powders based on $H{\ddot{o}}gan{\ddot{a}}s$ AB grade NC 100.24 plain iron powder were used: NC 100.24 as delivered, PNC 30, PNC 60 and NC 100.24 + 4%Cu powder mixtures. Dimensional behaviour of all those materials during the sintering cycle was monitored by dilatometry. Simple ring shaped specimens as the outer parts and cylindrical as the inner parts were pressed. The influence of parts' composition on joining strength was established. Diffusion of alloying elements: copper and phosphorous, across the bonding surface was controlled by metallography, SEM and microanalysis.

• Korean Journal of Metals and Materials
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• v.47 no.9
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• pp.567-572
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• 2009

The densification behaviors of mixtures of copper and steel powders during cold die compaction were investigated. We proposed the pressure-dependent yield function based on the rule of the mixtures of each yield function of a critical relative density type. The constitutive equations were implemented into a finite element program (DEFORM2D) to analyze the densification and deformation behavior of powder mixtures, and the simulated results are in good agreement with the experimental results in reference studies.