References
- Motioncontrol, Motion Control Co., "Global Market Trends for Automation and Industrial Power Modules", Jun. (2015), from http://www.motioncontrol.co.kr/default/news/?nwsid=n3&uid=9370
- Wikipedia, Wikipedia Foundation. Lnc., from http://en.wikipedia.org/wiki/Powermodule
- M. H. Roh, H. Nishikawa, and J. P. Jung, "A Review of Ag Paste Bonding for Automotive Power Device Packaging", J. Microelectron. Packag. Soc., 22(4), 15 (2015). https://doi.org/10.6117/kmeps.2015.22.4.015
- S. H. Rajendran, D. H. Jung, W. S. Cheon, and J. P. Jung, "Transient Liquid Phase Bonding of Copper using Sn Coated Cu MWCNT Composite Powders for Power Electronics", Appl. Sci., 9(3), 529 (2019). https://doi.org/10.3390/app9030529
- M. H. Roh, H. Nishikawa, J. P. Jung, and W. J. Kim, "Transient Liquid Phase Bonding for Power Module Packaging", J. Microelectron. Packag. Soc., 24(1), 27 (2017). https://doi.org/10.6117/kmeps.2017.24.1.027
- G. S. Hoppin III and T. F. Berry, "Activated Diffusion Bonding", Weld. J., 49(11), 505 (1970).
- D. S. Duvall, W. A. Owczarski, and D. F. Paulonis, "Transient Liquid Phase Bonding: A New Method for Joining Heat Resistant Alloys", Weld. J., 53(4), 203 (1974).
- J. P. Jung and C. S. Kang, "Transient Liquid Phase Process in Ni-B Joining", Mater. Trans., JIM, 38(10), 886 (1997). https://doi.org/10.2320/matertrans1989.38.886
- J. P. Jung and C. S. Kang, "Liquid Phase Diffusion Bonding of Rene80 Using Pure Boron", Mater. Trans., JIM, 37(5), 1008 (1996). https://doi.org/10.2320/matertrans1989.37.1008
- J. P. Jung, C. D. Lee, and C. S. Kang, "A study on the melting induced bonding of 304 stainless steel", J. of Kor. Inst. of Met. & Mater., 31(3), 323 (1993).
- J. P. Jung and C. S. Kang, "Liquid metal formation of Ni/B/Ni diffusion bonded joint", J. of Kor. Inst. of Met. & Mater., 33(10), 1302 (1995).
- J. P. Jung and C. S. Kang, "A study on the width of liquid layer of Ni/B/Ni diffusion bonding system", J. of Kor. Weld. Soc., 13(4), 402 (1995).
- J. P. Jung, and C. S. Kang, "Mechanical Property of Liquid Phase Diffusion Bonded Joint of Rene80 / B / Rene80", J. of Kor. Weld. Soc., 13(3), 125 (1995).
- J. P. Jung and C. S. Kang, "Liquid phase diffusion bonding procedure of Rene80/B/Rnene80 system", J. of Kor. Weld. Soc., 13(2), 172 (1995).
- S. H. Rajendran, D. H. Jung, W. S. Jeon, and J. P. Jung, "Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders of Power Electronics", Appl. Sci., 9(3), 529 (2019). https://doi.org/10.3390/app9030529
- H. J. Kang, J. H. Lee, J. H. Lee, D. K. Chang, and J. P. Jung, "Fabrication of SiC Power Module Using Electroplated Sn-X- TLP Solders", Proc. Annual meeting of KWJS, Daegu, Korea, 125 (2019).
- Y. Tamai, A. Morozumi, T. Saito, F. Momose, Y. Nishimura, E. Mochizuki, and Y. Takahashi, "High thermal cycling reliability of automotive IGBT module with high strength solder alloy", Proc. MES 2015, Osaka, Japan, 123, JIEP (2015).
- C. S. Kang and J. P. Jung, "Micro-Joining (in Kor.)", Samsung Books, Seoul, Korea, 307 (2002).
- I. Lum, J. P. Jung, and Y. Zhou, "Bonding Mechanism in Ultrasonic Gold Ball Bonds on Copper Substrate", Metall. Mater. Trans. A., 36(5), 1279 (2005). https://doi.org/10.1007/s11661-005-0220-2
- R. D. Mindlin, "Compliance of Elastic Bodies in Contact", Trans. ASME, J. Appl. Mech., 16, 259 (1949). https://doi.org/10.1115/1.4009973
- I. Lum, M. Mayer, and Y. Zhou, "Footprint Study of Ultrasonic Wedge Bonding with Aluminum Wire on Copper Substrate", J. Electron. Mater., 35(3), 433 (2006). https://doi.org/10.1007/BF02690530
- K. Kotani, J. P. Jung, K. Ikeuchi, and F. Matsuda, "Effects of Oxide Morphology on Bond Strength of Diffusion Bonded Interfaces of Al-Alloys", Trans. JWRL, 28(2), 27 (2000).
- K. Ozaki, T. Kurosu, and J. Onuki, "Development of Damage Free Thick Al-Cu Wire Bonding Process and Reliability of the Wire Bonds", Electrochem., 82(2), 100 (2014). https://doi.org/10.5796/electrochemistry.82.100
- T. Kurosu, K. Khoo, Y. Nakamura, K. Ozaki, N. Ishikawa, and J. Onuki, "Reliability Enhancement of Thick Al Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates", Mater. Trans., 52(3), 453 (2012).
- J. H. Lee, D. H. Jung, and J. P. Jung, "Transient Liquid Phase Diffusion Bonding Technology for Power Semiconductor Packaging", J. Microelectron. Packag. Soc., 25(4), 9 (2018). https://doi.org/10.6117/KMEPS.2018.25.4.009
- J. W. Yoon, J. H. Bang, Y. H. Ko, S. H. Yoo, J. K. Kim, and C. W. Lee, "Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications", J. Microelectron. Packag. Soc., 21(4), 1 (2014). https://doi.org/10.6117/kmeps.2014.21.4.001