• 방사성폐기물학회지
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• 제13권3호
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• pp.235-242
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• 2015

본 연구에서는 파이로프로세싱에서 발생하는 배기체 내 요오드 포집을 위한 매질로서 고가의 은 기반 흡착제를 대체하기 위한 상용 구리메쉬의 가능성에 대해 연구하였다. 열역학적 계산을 통해 구리 금속과 요오드 기체의 반응은 100 ~ 500℃ 온도 범위에서 자발적으로 일어나며 요오드화구리(CuI)를 형성할 것으로 예상되었다. 실험을 통해 반응 온도에 따른 요오드 포집 효율의 영향을 분석한 결과, 1개의 구리메쉬(질량 0.26 g)를 이용하여 반응 온도를 300, 400℃로 변화하였을 때 각각 5 및 6 wt%의 요오드(초기질량 2.0 g)가 포집됨을 확인하였다. 또한, 반복 실험 결과를 토대로 구리메쉬 표면에 형성된 반응 생성물(CuI)의 자발적인 탈리 현상으로 구리의 활용률이 증가할 수 있음을 확인하였다. 반응 생성물의 CuI 상 형성은 X-선 회절 실험을 통해 확인하였으며, 표면 분석은 주사전자현미경을 이용하여 수행하여 그 결과를 보고하였다.

• 한국재료학회지
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• 제33권11호
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• pp.491-496
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• 2023

As the demand for p-type semiconductors increases, much effort is being put into developing new p-type materials. This demand has led to the development of novel new p-type semiconductors that go beyond existing p-type semiconductors. Copper iodide (CuI) has recently received much attention due to its wide band gap, excellent optical and electrical properties, and low temperature synthesis. However, there are limits to its use as a semiconductor material for thin film transistor devices due to the uncontrolled generation of copper vacancies and excessive hole doping. In this work, p-type CuI semiconductors were fabricated using the chemical vapor deposition (CVD) process for thin-film transistor (TFT) applications. The vacuum process has advantages over conventional solution processes, including conformal coating, large area uniformity, easy thickness control and so on. CuI thin films were fabricated at various deposition temperatures from 150 to 250 ℃ The surface roughness root mean square (RMS) value, which is related to carrier transport, decreases with increasing deposition temperature. Hall effect measurements showed that all fabricated CuI films had p-type behavior and that the Hall mobility decreased with increasing deposition temperature. The CuI TFTs showed no clear on/off because of the high concentration of carriers. By adopting a Zn capping layer, carrier concentrations decreased, leading to clear on and off behavior. Finally, stability tests of the PBS and NBS showed a threshold voltage shift within ±1 V.

• 대한수의학회지
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• 제62권1호
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• pp.3.1-3.7
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• 2022

Disulfiram (DSF) is a marketed drug to treat patients with alcohol dependence by inhibiting aldehyde dehydrogenase. Over the last few decades, DSF has been shown to have anticancer effects through different mechanisms. Moreover, this effect can be elevated when used with copper (Cu). Subsequent studies have been conducted on various cancers, but few on lymphoma. This study investigated the anticancer effects of DSF on lymphoma and how this effect changed when treated with Cu. DSF synergistically decreased the metabolic activity of EL4 lymphoma cells when combined with Cu. At 1 µM of DSF alone, the metabolic activity of EL4 cells decreased by 49% compared to the control, whereas it decreased by 87% with a DSF + CuCl₂ treatment. Rhodamine 123 and 2',7'-dichlorofluorescein diacetate staining showed that DSF induced the reduction of the mitochondrial membrane potential and promoted the production of reactive oxygen species. In particular, the combined treatment of DSF + Cu induced cell death based on multiple assays, including annexin V-fluorescein isothiocyanate/propidium iodide staining. Overall, DSF has anticancer effects on lymphoma cells and exhibits synergistic effects when combined with Cu. This study provides some valuable information to broaden the use of DSF in clinics and basic research.

• Bulletin of the Korean Chemical Society
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• 제29권2호
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• pp.499-502
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• 2008

• 자동차안전학회지
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• 제13권2호
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• pp.30-34
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• 2021

Electrical failures and reliability problems of electronic components by ionic migration between adjacent device terminals have become an issue in automotive electronics. Especially unlike galvanic corrosion, ionic migration is occurred at high temperature and high humidity under applied electric field condition. Until now, although extensive studies of the ionic migrations dealing with PCBs, electrodes, and solders were reported, there is no study on the effect of insulation polymers and metallic fillers for ionic migration. In this research, therefore, ionic migration induced by the types and contents of polymers and metallic fillers, and variety conditions of temperature, humidity, and applied voltage was studied in detail. Ester and amide types of liquid crystal polymer (LCP) and poly (phthalamide) (PPA) were used as base polymers, respectively and compounded with the metallic fillers of Copper iodide (CuI), Zinc stearate (Zn-st), or Calcium stearate (Ca-st) in various compositions. The compounding polymers were fabricated in IPC-B-24 of SIR test coupon according to ISO 9455-17 with Cu electrodes for ionic migration test. While there is no change in LCP-based samples, ionic migration in PPA compounding sample with a high water absorption property was accelerated in the presence of 0.25 wt% or above of CuI at the environmental conditions of 85℃, 85% RH and 48V. The dendritic short-circuit growth of Cu caused by ionic migration between the electrodes on the surface of compounded polymers was systematically observed and analyzed by using optical microscopy and SEM (EDX).

• Corrosion Science and Technology
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• 제6권6호
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• pp.304-307
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• 2007

As to the reflection electrode of LCD (liquid crystal displays), silver-copper-gold alloy (hereafter, it is called as ACA (Ag98%, Cu1%, Au1%)) is an effective material of which weathering resistance can be improved more compared with pure silver. However, there is a problem that gold remains on the substrate as residues when ACA is etched in cerium ammonium nitrate solution or phosphoric acid. Gold can not be etched in these etchants as readily as the other two alloying elements. Gold residue has actually been removed physically by brushing etc. This procedure causes damage to the display elements. Another etchant of iodine/potassium iodide generally known as one of the gold etchants can not give precise etch pattern because of remarkable difference in etching rates among silver, copper and gold. The purpose of this research is to obtain a practical etchant for ACA alloy. The results are as follows. The cyanogen complex salt of gold generates when cyanide is used as the etchant, in which gold dissolves considerably. Oxygen reduction is important as the cathodic reaction in the dissolution of gold. A new etchant of sodium cyanide / potassium ferricyanide whose cathodic reduction is stronger than oxygen, can give precise etch patterns in ACA alloy swiftly at room temperature.

• 대한화학회지
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• 제28권2호
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• pp.86-94
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• 1984

${\beta}-Ag_3SI$의 단결정을 만들어 막전극으로의 응용을 살펴보았다. 그 결과 할로겐 이온들에 대해 감응함을 알았고, 분리용액법과 혼합용액법으로 할로겐 이온들에 대한 선택계수를 얻어 이론값과 비교검토 하였으며, 전위시간 곡선으로 부터 이 전극이 유리 전극기구에 의해 전도함을 알았고, 넓은 pH 범위에서 전위가 일정한 값을 가짐을 알았다. 한편 분석화학에의 응용을 살펴 본 결과 할로겐이온의 혼합용액에서 좋은 지시전극으로 사용할 수 있음을 알았다

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.859-862
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• 2001

This study describes a selective Ag etching solution for use with pattern on the surface of copper. This etching solution uses potassium iodide and potassium sulfate as the ligand that coordinates to the metal ions and ferricyanide as the oxidant. The etching rate was depended on the concentration of co-ligands and time. But the etching rate wasn't depended on the pH(2∼6), and oxidant(K$_3$Fe(CN)$\_$6/). Complete etching of silver can be achieved rapidly within 90sec for 4.46${\mu}$m thick metal films when aqueous solutions containing K$_3$Fe(CN)$\_$6/, K$_2$S$_2$O$\_$8/ and KI was used. This etching solution was characteristic of anisotropic etching.

• 보존과학회지
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• 제25권3호
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• pp.283-291
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• 2009

현재까지 문화재 훈증제로서 사용되어왔던 브롬화메틸(Methyl Bromide, 이하 M.B)은 온실 가스로 지구 오존층 파괴의 원인물질로 판명되어, 1987년 몬트리올 의정서에 의해 선진국에서는 2005년부터 사용이 금지되었다. 또한, 2007년 발리 협약에 의해 우리나라도 점진적으로 사용 규제가 예상되므로, 본 실험에서는 Methyl Bromide를 대체할 Ethylene Oxide + HFC 134a, Methyl Iodide, Cyanogen, Argon 훈증법이 금속(은, 구리, 철), 목재(미송), 안료(황, 장단, 양청, 백분, 먹), 섬유(삼베, 모시, 황마, 도침 비단, 비도침 비단 / 쪽, 황벽, 홍화 염색), 지류(닥지 4종, 중성지 1종) 시편 재질에 미치는 안정성 평가를 실시하였다. 훈증 실험 결과, Ethylene Oxide + HFC 134a가 훈증 전, 후 실험 시편의 중량, 색도 변화 등에 가장 영향이 없었다. 표면변화는 지류와 금속시편에서 부분적으로 변색이 발생하였다. 색도변화는 대부분의 시편에서 0.5에서 1.5내외의 근소한 색차를 나타내었다. Methyl Iodide는 훈증 전, 후 중량변화가 거의 없는 것으로 나타났다. 색도변화는 대부분의 실험시편에서 1.0 이상의 색차를 나타내었다. 특히, 염색된 대부분의 섬유시편에서 비교적 큰 색도변화가 나타났다. 표면변화는 양청안료시편에서 육안으로 관찰 가능한 변색이 관찰되었다. Cyanogen은 훈증 전, 후 실험 시편의 중량변화에 큰 영향이 없는 것으로 나타났다. 색도변화는 전반적으로 실험시편에서 1.5이상 정도의 색차를 보였다. 특히, 섬유시편의 변색에 큰 영향을 주는 것으로 나타났다. Argon으로 훈증한 실험시편은 중량변화가 3~6% 내외로 감소한 것으로 나타났다. 표면변화는 지류시편에서 부분적으로 변색이 발생한 것을 관찰할 수 있었다. 색도변화는 2주 훈증 조건에서 홍화와 황벽으로 염색한 황마시편이 6.3, 6.0의 현저한 색차를 나타냈다.

• 대한수의학회지
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• 제59권4호
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• pp.195-199
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• 2019

Disulfiram (DSF) is a member of the dithiocarbamate family that can bind copper. Recent studies have shown that DSF has anti-cancer activities, but the mechanism has not been clarified. Therefore, it is important to study the action mechanism of DSF to maximize its anticancer effects. A human leukemia cell line, HL-60, was used in this study. HL-60 cells were treated with DSF and the cellular metabolic activity was measured. DSF increased the cell death of HL-60 cells in annexin V-fluorescein isothiocyanate/propidium iodide staining analysis. In addition, DSF decreased the mitochondrial membrane potential (MMP) of the HL-60 cells. The cytotoxicity of DSF on HL-60 cells was observed at 0.4 μM. Interestingly, the reduction of MMP by DSF was recovered by N-acetyl-L-cysteine, an inhibitor of reactive oxygen species (ROS) production. This suggests that the decrease in MMP by DSF is closely related to the production of ROS in HL-60 cells, which indicates the relationship between the apoptosis of HL-60 cells by DSF and the role of the mitochondria. This study provides clinicians and researchers with valuable information regarding the anti-cancer activity of DSF in terms of the action mechanism.