• Transactions on Electrical and Electronic Materials
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• v.6 no.5
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• pp.225-228
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• 2005

In this work, we studied the optimized copper thickness in Cu ECP (Electrochemical Plating). In order to select an optimized Cu ECP thickness, we examined Cu ECP bulge (bump, hump or over-plating amount), Cu CMP dishing and electrical properties of via hole and line trench over dual damascene patterned wafers split into different ECP Cu thickness. In the aspect of bump and dishing, the bulge increased according as target plating thickness decreased. Dishing of edge was larger than center of wafer. Also in case of electrical property, metal line resistance distribution became broad gradually according as Cu ECP thickness decreased. In conclusion, at least $20\%$ reduced Cu ECP thickness from current baseline; $0.8\;{\mu}m$ and $1.0\;{\mu}m$ are suitable to be adopted as newly optimized Cu ECP thickness for local and intermediate layer.

• Journal of the Korean Ceramic Society
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• v.11 no.1
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• pp.3-9
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• 1974

The role of added metal oxide in the adherence mechanism of low melting glass to several metal plates such as oxygen free high conducting copper, low carbon steel, chrominum galvanized on copper, and stainless steel was investigated. The metal oxide which added to glass were cupric oxide, ferric oxide, chromic oxide, and stainless steel oxide. The glass to that various metla oxide were added, sealed with several metal plates in the electric furnace at $650^{\circ}C$ for 5 minutes. The results as follows; 1) The interfacial reaction was promoted and strong chemical bonding with glass and metals by which the surface energy was decreased showed excellent sealing by addition of metal oxide. 2) When the interfacial reaction of glass and metals was promoted by addition of metal oxide found out that various adhernece mechanism were related to the sealing. 3) When the amount of metal oxide addition was 3-5% the excellent sealing was achieved.

• Journal of Hydrogen and New Energy
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• v.4 no.2
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• pp.23-28
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• 1993

The $(LM)Ni_{4.5}Co_{0.1}Mn_{0.2}Al_{0.2}$ hydrogen storage alloy powders were conducted 25wt% electroless copper plating in an acidic bath. For the preparation of a hydride electrodes, the copper coated alloy powder was mixed with Si-sealant(organosilicon) and compacted with $6t/cm^2$ at room temperature. The electrode characteristics were examined through electrochemical measurements in a half cell. As a sealant contents increased, the initial discharge capacity of si-sealant bounded electrode was lower and the activation rate in high current density was slower. For extended cycles, however, the electrodes with the Si-sealant were superior in a high rate discharge and useful range of temperature over the sealant-free electrode. In addition, the cycle life increased with increasing the amount of Si-sealant added. It can be suggested from the results that the Si-sealant as a binder could be applied to the preparation of the metal hydride electrode.

• Journal of the Korean Solar Energy Society
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• v.28 no.3
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• pp.21-26
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• 2008

Solar cells are renewable energy source which is not only environmentally friendly but also economically viable. For that matter, thin film materials are in observed with great in terest by a number of sources throughout the nations. Among these, CdTe (Cadium telluride) and CIS (copper indium diselenide) are the latest commercial products that are gathering attention in the solar cells markets. However there are some downsides to this newly invention. Since the materials are embedded, in the occasion of damage, certain amount of module residue can be released to water or soil. This paper outlines the results of our outdoor leaching experiments on photovoltaic (PV) samples broken into small fragments and been observed for 1 year.

• Bulletin of the Korean Chemical Society
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• v.31 no.1
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• pp.100-103
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• 2010

In this study, NO reduction behaviors of copper-loaded mesoporous molecular sieves (Cu/MCM-41) have been investigated. The Cu loading on MCM-41 surfaces was accomplished by a chemical reduction method with different Cu contents (5, 10, 20, and 40%). $N_2/77$ K adsorption isotherm characteristics, including the specific surface area and pore volume, were studied by BET's equation. NO reduction behaviors were confirmed by a gas chromatography. From the experimental results, the Cu loading amount on MCM-41 led to the increase of NO reduction efficiency in spite of decreasing the specific surface area of catalysts. This result indicates that highly ordered porous structure in the MCM-41 and the presence of active metal particles lead the synergistical NO reduction reactions due to the increase in adsorption energy of MCM-41 surfaces by the Cu particles.

• Macromolecular Research
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• v.9 no.3
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• pp.179-183
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• 2001

Cathode materials for the polymer electrolyte membrane fuel cell was prepared by electropoly-merization of aniline at carbon paper in the presence of copper tetrasulfonato-phthalocyanine (CuTsPc) and their electrocatalytic behavior was studied. The amount of polyaniline and CuTsPc in the carbon paper was determined by UV spectroscopy of residual solution in electrochemical cell. The redox process of the prepared electrodes was investigated with cyclic voltammetry. The highest reversible current density was observed at the electrode that contains 27.6 wt% of polyaniline and 19.7 wt% of CuTsPc. The morphology of composite electrode from SEM showed the presence of large cluster of polyaniline with CuTsPc, which should be more finely interpenetrated into macropores of carbon for the better electrocatalytic activity.

• IE interfaces
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• v.9 no.3
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• pp.92-100
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• 1996

The current copper-based communication network is going to be replaced with an optic fiber network. The new technology allows a larger amount of information to be transmitted than before. Due to its bandwidth and relatively high installation cost, however, the optic fiber network does not exhibit the inherent structural redundancy provided by the conventional copper-based network. We propose to supply it by adding multiple paths between important nodes. This so-called network survivability problem is computationally expensive to solve exactly. We report the application of a heuristic algorithm to this problem. Also discussed is the issue of how to make use of existing conduits.

• Bulletin of the Korean Chemical Society
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• v.25 no.12
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• pp.1757-1763
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• 2004

A new series of nickel(II), cobalt(II)/(III) and copper(II) complexes of 14, 15 and 16-membered of macrocyclic ligands have been prepared and characterized by elemental analyses, IR, UV-VIS and $^1H-NMR$ spectra, magnetic susceptibilities, conductivities, DTA and ESR measurements. Molar conductances in DMF solution indicate that, the complexes are nonelectrolytes except (9-12) complexes. The electronic spectra show that, all complexes are square planar or distorted octahedral geometry. The ESR spectra of solid complexes (4), (8) and (11) show square planar of axial type symmetry $(d_{x2-y2})$ with considerable covalent bond character. However, complex (12) shows a spectrum of octahedral geometry with $d_{z2}$ ground state. Complex (12) shows exploitation in reducing the amount of electron adducts formed in DNA during irradiation with low radiation products.

• Journal of Surface Science and Engineering
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• v.27 no.1
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• pp.29-35
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• 1994

The effects of coating of 3$\mu\textrm{m}$ thickness on the mechanical property of alumina after heat treatment at 100$0^{\circ}C$ for 30minutes under $10^{-6}$torr vacuum was quantified in terms of modulus of rupture(MOR) using Weibull plot. While the copper coating did not change MOR of alumina due to the nonwetting behavior of Cu on $Al_2O_3$, the reactive titanium metal coating caused a noticeable 29% reduction in averaged MOr strength. This was related with the combined effects of microcracks in coating formed during heat treatment and good bonding character between Ti and $Al_2O_3$. The effect of cosputtering of Ti and Cu, bilayer coatings of Cu/Ti and Ti/Cu were also investigated. It was found that Ti, cosputtered, Cu/ti and Ti/Cu coatings reduced MOR strength of alumina in the order listed. This was correlated with the amount of Ti at coating/alumina inter-face associated with a coated layer or segregation of Ti during heat treatment.

• Journal of Surface Science and Engineering
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• v.29 no.2
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• pp.109-119
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• 1996

In order to improve adhesion of electroless copper deposits on alumina substrates, some stabilizers such as 2-Mercapto Benzothiazole, thiourea and NaCN were added over a wide range of concentrations. The adhesion tests of the deposits were performed by using the cellophane tape and the push-pull scale. With the minor addition of the stabilizers, 2-MBT having a large molecular size gives poor adhesion, together with a finer grain structure, whereas Thiourea and NaCN show a high mechanical strength of the deposits. The high mechanical strength is supposed to be due to the easy desorption of hydrogen gas generated from the electroless reactions. A large amount of the three stabilizers decreases the adhesion for all the cases, resulting from strong adsorption of the stabilizers to the substrates.