• Title/Summary/Keyword: contact failure

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Finite Element Analysis for the Prediction of Durability of Idler Wheel of Tracked Vehicle (궤도차량용 휠의 내구성 예측을 위한 유한요소 해석 기법 연구)

  • Lee, Kyoung-Ho;Roh, Keun-Lae;Lee, Young-Shin
    • Journal of the Korea Institute of Military Science and Technology
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    • v.12 no.5
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    • pp.676-682
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    • 2009
  • The idler wheel installed at the front side of the newly developed tracked vehicle didn't meet the durability requirement by showing the crack failure near the jointed region at the wheel during the field test. To find the crack developing mechanism we constructed finite element model for the idler wheel representing the behavior of interface between each suspension units, material properties from the material test data and actual loading conditions. This paper shows a result that maximum von Mises stress near the bolt hole on the outer rim is higher than inner idler coressponding to the actual test result and that result was reversed by adopting the reinforcement outside of the outer rim.

A Study on the Shape Design and Stress Analysis of Wheel Plate for Rolling Stock (2) (철도차량용 휠 플레이트의 응력해석 및 형상설계에 관한 연구 (2))

  • Sung, Ki-Deug;Yang, Won-Ho;Cho, Myoung-Rae;Chung, Ki-Hyun;Kim, Cheol
    • Proceedings of the KSME Conference
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    • 2000.11a
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    • pp.351-356
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    • 2000
  • The mechanical stress due to the wheel-rail contact and thermal stress due to the drag braking increase the incidence of wheel failure. So, firstly, stress analyses(mechanical, thermal and combined stress) of wheel plate are performed using 3-dimensional finite element method(FEM). Secondly, the optimum design of wheel plate is investigated in order to reduce weight of the wheel based on results of stress analysis. The optimum design is peformed using 2-dimensional axisymmetric F.E. model and its results are verified by 3-dimensional F. E. model.

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A Study on the Springback of Side Rear Member (Side Rear Member의 스프링백 연구)

  • Chung W. J.;Hong S. H.;Park C. D.;Choi D. K.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2002.02a
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    • pp.144-147
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    • 2002
  • In this study, springback analysis of side rear member is carried out. Side rear member is one of the parts which shows severe springback problems. Forming, trimming, flanging and springback stages can be analyzed successively. From forming analysis, we identified the possible spots in which tearing may occur and can prevent failure. In springback analysis we used the boundary conditions same as applied to the blank on the checker so that the computational result can be compared with experimental one. Form .the comparison, springback analysis can yield relatively good results in a qualitative sense. However, in order to get good deformation result quantitatively, there still remains unsettled tasks in the forming analysis with very small die radius. It is found that we have to develop the element with better bending characteristics and precise contact treatment.

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Dynamic Charateristics of Composite Plates Based On a Higher Order Theory Under Low-Velocity Impact (저속 충격시 고차이론을 이용한 복합재료 판의 동적 특성)

  • 심동진;김지환
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 1997.04a
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    • pp.42-48
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    • 1997
  • The dynamic response of symmetric cross-ply and angle-ply composite laminated plates under impact loads is investigated using a higher order shear deformation theory. A modified Hertz law is used to predict the impact loads and a four node finite element is used to model the plate. By using a higher order shear deformation theory, the out-of-plane shear stresses, which can be a crucial factor in the failure of composite plates, are determined with significant accuracy. The results compared with previous investigations showed good agreement. The effect of ply sequence and ply angle on the contact force is also studied.

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Development of a Chip Bonding Technology for Plastic Film LCDs

  • Park, S.K.;Han, J.I.;Kim, W.K.;Kwak, M.K.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2000.01a
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    • pp.89-90
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    • 2000
  • A new technology realizing interconnection between Plastic Film LCDs panel and a driving circuit was developed under the processing condition of low temperature and pressure with ACFs developed for Plastic Film LCDs. The conduction failure of interconnection of the two resulted from elasticity, low thermal resistance and high thermal expansion of plastic substrates. Conductive particles with elasticity similar to the plastic substrate did not damaged a ITO electrode on plastic substrates, and low temperature and pressure process also did not deform the surface of plastic substrates. As a result highly reliable interconnection with minimum contact resistance was accomplished.

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A Study on Fatigue Crack Propagation of Rail Steel under Constant and Mixed Mode Variable Amplitude Loadings

  • Kim, Chul-Su;Chung, Kwang-Woo
    • International Journal of Railway
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    • v.5 no.2
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    • pp.71-76
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    • 2012
  • Recently, axle load, operating speed and traffic density on railroads have had a tendency to increase and thereby cause additional pressure applied on used track. These operating conditions frequently result in service failure due to wear caused by wheel-rail contact and fatigue damage under cyclic loading. Among rail defects, the transverse crack, which has been the most dangerous type of fatigue damages, is developed from the subsurface crack near the rail running face and grows perpendicular to the rail surface. Therefore, it is necessary to investigate systematically the growth behavior of transverse crack for rail steel under mixed mode. In this study, the fatigue crack growth behavior of the transverse crack in rail steel was experimentally investigated under mixed-mode variable amplitude loadings.

Hot Spot Analysis on Brake Disc Using Infrared Camera (적외선카메라를 이용한 제동 디스크 열크랙 분석)

  • Kim, Jeong-Guk;Goo, Byeong-Choon;Kwon, Sung-Tae
    • Proceedings of the KSR Conference
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    • 2008.06a
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    • pp.964-968
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    • 2008
  • Infrared thermography using high-speed infrared camera has been recognized as a powerful method for various potential applications, such as nondestructive inspection, failure analysis, stress analysis, and medical fields, due to non-contact, high-speed, and high spatial resolution at various temperature ranges. In this investigation, damage evolution due to generation of hot spots on railway brake disc was investigated using the infrared thermography method. A high-speed infrared camera was used to measure the surface temperature of brake disc as well as for in-situ monitoring of hot spot evolution. From the thermographic images, the observed hot spots and thermal damage of railway brake disc during braking operation were qualitatively analyzed. Moreover, in this investigation, the previous experimental and theoretical studies on hot spots phenomenon were reviewed, and the current experimental results were introduced and compared with theoretical prediction.

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The Finite Element Analysis of Foundation Layer by Introducing Interface Element (접합요소를 도입한 기초지반의 유한요소해석(지반공학))

  • 정진섭;이대재;봉기영
    • Proceedings of the Korean Society of Agricultural Engineers Conference
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    • 2000.10a
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    • pp.425-430
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    • 2000
  • In the analysis of deformation in which the stiffness is greatly different between the adjacent materials, the desired results have been obtained by using the interface element method compared with those secured by the conventional method of the concept of continua. This study deals with the deformation analysis of soft foundation by the introduction of interface element. The physical conditions of interface element are divided into three categories by Mohr-Coulomb failure criterion ie. sliding, separation, and contact. Finally the accuracy of the program proposed in this paper is proved highly accurate by performing the comparison of the theoretical values numerical results of a model element with simplified boundary conditions.

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New GGNMOS I/O Cell Array for Improved Electrical Overstress Robustness

  • Pang, Yon-Sup;Kim, Youngju
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.13 no.1
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    • pp.65-70
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    • 2013
  • A 0.18-${\mu}m$ 3.3 V grounded-gate NMOS (GGNMOS) I/O cell array for timing controller (TCON) application is proposed for improving electrical overstress (EOS) robustness. The improved cell array consists of 20 GGNMOS, 4 inserted well taps, 2 end-well taps and shallow trench isolation (STI). Technology computer-aided design (TCAD) simulation results show that the inserted well taps and extended drain contact gate spacing (DCGS) is effective in preventing EOS failure, e.g. local burnout. Thermodynamic models for device simulation enable us to obtain lattice temperature distributions inside the cells. The peak value of the maximum lattice temperature in the improved GGNMOS cell array is lower than that in a conventional GGNMOS cell array. The inserted well taps also improve the uniformity of turn-on of GGNMOS cells. EOS test results show the validity of the simulation results on improvement of EOS robustness of the new GGNMOS I/O cell array.

The Development of Magnetic Field Measurement System of 3 Axis (3축 자계 측정 시스템의 개발)

  • Kim, Ki-Joon
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.30 no.4
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    • pp.253-257
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    • 2017
  • Nowadays, it is increasingly important to detect whether cables are live for the operator's safety if there is a sudden power failure. It is especially hard to detect the electrical field of an underground line because of shielding. This paper on detection of live-line states in cables studied the detection characteristics of the change in the magnetic field and axis as the frequency, voltage, and distance at the same load are changed using 3 axes. A search coil type was used as a magnetic field sensor with non-contact. We found that magnetic fields decrease proportionally to the square of the distance and the decrease of rated voltage with load effected to magnetic field. The magnetic field was detected by 3-axis sensors given correct proximity, but appeared as noise components beyond a distance of 2 cm.