• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.7
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• pp.56-62
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• 2018

The bus bar is an electrical connection widely used for the power supply of skyscrapers and power distribution and industrial equipment electrical panels in industrial plants. There are various materials to be considered in the design of the bus bar, such as material based on the use environment, the sectional area according to the power capacity, the length of the surface circumference, and the tightening method. Even with a bus bar manufactured to a size of sufficient power capacity in the design, if the actual tightening is incorrect, it may lead to fire due to deterioration. For these reasons, a variety of research on the temperature rise of the electrical contact point has continued. However, the temperature rise of the contacts is a consequence of the result, not a direct cause. In this paper, the influence of contact resistance on the fastening force and the overlapping section of the bus bar are investigated by measuring the change in resistance from building the specimen. A total of eight bus bar specimens were manufactured and measured. Resistance was measured by varying the clamping force and the interval between overlapping sections when the specimens were crossed. We propose a safe power connection model by analyzing the contribution of these factors to the actual contact resistance change.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.179-179
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• 1998

실리콘 집적회로 제조시 sub-micron 의 contact 형성 공정은 질연막 형성 후 이의 식각 및 세정, c contact 실리사이드, 획산방지막, 배선 금속층의 형성 과정올 거치게 된다. 본 연구팀에서는 C.F야f2 헬리 콘 플라즈마훌 이용한 고선택비 contact 산화막 식각공정시 형성된 잔류막충과 오염 손상올 관찰하고 산소 플라즈마 처리와 후속 열처리에 따른 이들의 제거 정도를 관찰하여 이에 대한 결과를 발표하였다. 본 연구메서는 식각 및 후처리에 따라 잔류하는 잔류막과 손상층이 후속 공정인 contact 실리사이드 형 섬에 미치는 영향올 관찰하였다. C C.F바f2 웰리콘 풀라즈마률 이용한 식각시 공정 변수로는 수소가스 첨가, bias voltage 와 과식각 시간 의 효과를 관찰하였으며 다른 조건은 일정하게 하였다 .. Contact 실리사이드로는 Ti, Co-싫리사이드를 선 택하였으며 Piranha cleaning, 산소 플라즈마 처리, 산소 풀라즈마+600 'C annealing으로 각각 후처리된 시 편을 후처리하지 않은 시펀돌과 함께 실리사이드 형성용‘시펀으로 이용하였다 각각 일정 조건에서 동 일 두께의 실리사이드훌 형성시킨 후 4-point probe룰 이용하여 면저황올 측정하였다 후처리하지 않은 시편의 경무 실리사이드 형성은 아주 시펀의 일부분에서만 형성되었으며 후속 세정 및 얼처리훌 황에 따라 실리사이드의 면저항은 감소하여 식각 과정을 거치지 않은 깨끗한 실리콘 웨이퍼위에 실리사이드 를 형성시킨 값(control 값)에 접근하였다. 실리사이드의 면저항값은 식각시 노훌된 실리콘 표면 위에 형 성된 손상충보다는 잔류막에 큰 영향을 받았으며 수소 가스가 첨가된 식각 가스로 식각한 시편으로 형 성한 실리사이드의 면저항값이 손상이 상대적으로 적은 것으로 관찰된 수소훌 첨가하지 않은 식각 가 스로 식각한 시펀 위에 형성된 실리사이드의 면저황에 비해 낮은 값을 나타내었다. 실리사이드의 전기적 륙성에 미치는 손상층의 영향올 좀더 면밀히 관찰하고자 bare 실리콘 wafer 에 잔류막이 거의 없이 손상층을 유발시키는 식각 조건들 (100% HBr, 100%H2, 100%Ar, Cl싸fz)에 대하여 실 리콘 식각을 수행한 후 Co-실리사이드률 형성하여 이의 면저황을 측정한 걸과 100% Ar 가스로 식각된 시편을 이용하여 형성한 실리사이드의 면저항은 control 에 기까운 면저항값올 지니고 따라서 손상층이 실리사이드 형섬메 미치는 영향은 크지 않음을 알 수 있었다. 이상의 연구 결과훌 통해 손상층이 실리사이드의 형성이나 전기적 톡섬에 미치는 영황은 잔류막층 에 의한 영향보다 적다는 것을 알 수 았으며 잔류막층의 두께보다는 성분이나 걸합상태, 특히 식각 및 후처리 후 잔류하는 탄소 싱분과 C-Si 결함에 큰 영향올 받는 것올 알 수 있었다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.11
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• pp.121-126
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• 2021

In this study, the effect of thermal contact resistance between pin-channel tubes on the heat transfer characteristics was analytically examined around the channel tubes with the pins attached to two consecutive arranged channel pipes. The numerical results showed that the heat transfer coefficient decreased geometrically as the thermal contact resistance increased, and the corresponding temperature change on the contact surface increased as the thermal contact resistance increased. The thinner the pin, the more pronounced the geometric drop in the heat transfer coefficient. It was confirmed that the higher the height of the pin, the higher was the heat transfer coefficient, however, the greater the size of the thermal contact resistance, the smaller was the heat transfer coefficient. It was found that the temperature change in the inner wall of the channel tube did not significantly affect the heat transfer characteristics owing to the thermal contact resistance. Furthermore, the velocity of air at the entrance of the channel tube was proportional to the heat transfer coefficient due to a decrease in the convective heat resistance corresponding to an increase in the flow rate.

• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.80-83
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• 2000

In this work we deposited Pentacene thin film by OMBD at the various substrate temperatures, deposition rate and the various annealing temperatures for the fabrication of organic TFT and investigated the electrical and film surface characteristics such as sheet resistance, contact resistance and conductance Film thickness were measured by $\alpha$-step and the sheet resistance, contact resistance and conductance were extracted from the relation between the distance of the contacts and the resistance. During the film deposition the substrate temperature was held at 3$0^{\circ}C$, 4$0^{\circ}C$, 5$0^{\circ}C$, 6$0^{\circ}C$, 8$0^{\circ}C$ and 10$0^{\circ}C$, respectively. After the film deposition, Au contact was deposited by thermal evaporation. For the effect of annealing, the thin film was annealed in the nitrogen environment at 10$0^{\circ}C$ and 14$0^{\circ}C$ for 10 seconds, respectively. Film surface characteristics at the vatious substrate temperatures were measured by AFM. The crystallization of thin film was improved as the substrate temperatures were increased and the maximum gram size was 4${\mu}{\textrm}{m}$. The conductivity of thin film was found to be 7.40 $\times$10$^{-7}$ ~ 7.78$\times$10$^{-6}$ S/cm and the minimum contact resistance was 2.5324 ㏁.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.9
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• pp.831-838
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• 2014

Chip on glass (COG) bonding using anisotropic conductive film (ACF) is a key technology to assemble a driver IC onto a LCD glass panel. In this paper, an experimental investigation was conducted to investigate the correlation between contact resistance and characteristics of image taken by machine vision based inspection system. The results show that the contact resistance was strongly influenced by the contrast ratio of conductive particle rather than the number of conductive particles. Also, number of conductive particles whose contrast ratio is below 0.75 is crucial for determining the quality of the assembled samples. On the other hand, in the result of high temperature high humidity storage test, the contrast ratio of samples was increased. However, in the case of open-circuit samples after temperature humidity storage test, the number of conductive particles whose contrast ratio is above 0.75 was more than that of the closed-circuit samples.

• Proceeding of EDISON Challenge
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• 2016.03a
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• pp.299-304
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• 2016

2차원 반도체 소재의 경우 물질종류마다 내포하고 있는 고유결함에 의해서 Fermi-Level Pinning 이 발생하여 이로 인한 Schottky Barrier transistor로 동작을 하게 되며, 이는 접합부에 Carrier Injection 정도와 Schottky Barrier을 통과하는 Tunneling 정도에 의해서 소자의 특성이 결정 된다. 본 연구에서는 시뮬레이션을 통하여 2차원 반도체인 $MoS_2$소자를 설계하고, S/D Doping에 따라 접촉 저항 개선 효과와 소자의 동작특성이 어떠한 영향을 미치는지 연구하여 최대 $250cm^2/V{\cdot}sec$의 field effect mobility 의 결과를 얻었다. 또한 S/D doping 에 따라 각 저항 성분의 영향을 분석하였으며 면저항 및 접촉 저항 둘 다 doping 농도가 증가함에 따라 감소하는 결과를 나타내며, S/D doping의 영향은 접촉저항에서 더 크게 나타났다. 더불어 2차원 반도체의 Resistance network model 을 제안하여 subthreshold 영역에서는 $R_{ic}$, saturation 영역에서는 $R_{ish}$ 가 전체저항에서 주요한 변수로 전체저항식에 포함되어야 한다는 것을 시뮬레이션을 통해서 검증하였다.

• Korean Journal of Materials Research
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• v.10 no.1
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• pp.21-28
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• 2000

Refractory metals, W and Ti, and their nitrides, $W_2N$ and TiN, were investigated for using as an ohmic contact material with SiC single crystalline thin films. The possibility of nitride materials for using as a stable ohmic contact material of SiC at high temperatures was examined by considering the thermal stability depending on the heat treatment temperature, their electrical properties and protective behavior from the interdiffusion. W contact with SiC thin films, deposited by using new organosilicon precursor, bis-trimethylsilylmethane, showed the lowest resistivity, $2.17{\times}10^{-5}$Ω$\textrm{cm}^2$. On the other hand, Ti-based contact materials showed higher contact resistivity than W-based ones. The oxidation of contact materials was restricted by applying Pt thin films on those electrodes. Nitride electrodes had rather stable electrical properties and better protective behavior from interdiffusion than metal electrodes.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.21 no.1
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• pp.57-67
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• 1997

The solidification process of Al 4.5%Cu alloy is numerically studied in the presence of contact resistance between mold and cast. Natural convection is considered in the liquid and mushy regions. The porosity approach is applied to the mushy zone modeling and linear variation of the solid fraction on the temperature is assumed. Results show that the mushy region is wider in the case with a contact resistance compared to the perfect contact condition. The temperature of the cast with a temporal variation in the contact heat transfer coefficient changes very rapidly in the early stage of the casting process compared to that with constant contact heat transfer coefficient.

• Transactions of the Korean Society of Mechanical Engineers
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• v.10 no.5
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• pp.661-669
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• 1986

In this study, the resistance spot welding process of an aluminum alloy was analyzed through the numerical simulation including the electric contact resistance and the heat generation in the electrode. The finite element model was used to solve the electro-thermal responses in weld cycles. The resistance of the contact area was represented as the contact element modeling, but the thermal resistance between the contact surfaces was neglected. Welding tests of Alclad 2024-T3 aluminum alloy were made not only to get the input data for the numerical simulation, but also to compare the numerical results. The contact resistance was determined initially by the contact resistance tests and assumed to decay exponentially up to the solidus temperature. The temperature distributions and dynamic resistance obtained numerically were in good agreement with the experimental results. Numerical results revealed that nugget growth depends mainly on the heat generated in the workpiece and its contact area. The heat generated in the electrode has, however, only a little effect on the nugget growth, and the heat generation in the electrode-workpiece interface is initially high but decrease repidly.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.05a
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• pp.279-282
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• 2002

In this paper, we discuss influence of process condition on contact resistance in WSix deposition process. In the WSix deposition process, we confirmed that word line to bit line contact resistance(WBCR) due to temperature of word line WSix deposition among various process condition split experiment. RTP treatment, d-poly ion implantation dose and thickness was estimated a little bit influence on contact resistance. Also, life time of shower head in the process chamber for WSix deposition related to contact resistance. The results obtained in this study are applicable to process control and electrical characteristics for high reliability and high density DRAM's.