• Proceedings of the Materials Research Society of Korea Conference
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• 2007.11a
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• pp.8.2-8.2
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• 2007

• Journal of Welding and Joining
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• v.23 no.6
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• pp.72-76
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• 2005

Friction surfacing of STS304 consumable rod on S45C substrate was investigated by microstructural observation and mechanical tests. STS304 layer formed a strongly-bonded thick layer under a wide range of surfacing conditions. The highest coating eefficiency was obtained in the condition of 1000rpm-2.5mm/sec-2.5mm/sec. The hardness distribution showed the peak value in the boundary layer and as the consumable rotation speed increased, the boundary layer also hardness increasing. As the consumable rotation speed and the traveling speed increased, the coating efficiency tended to decrease. On the other hand, as the feeding speed increased, the coating efficiency appeared to be increased. The new Fe-Cr-Ni alloy layer is showed in the interface layer on $5\~15{\mu}m$ width. After friction surfacing, corrosion resistance of STS 304 surfacing layers were equaled to that of STS304 consumable rod.

• Proceedings of the KWS Conference
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• 2005.06a
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• pp.229-231
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• 2005

Friction surfacing of STS304 consumable rod on S45C substrate was investigated by microstructural observation and mechanical tests. STS304 layer formed a strongly-bonded thick layer under a wide range of surfacing conditions. The hardness distribution showed the peak value in the boundry layer, while the highest coating efficiency obtained in the condition of 1000rpm-2.5mm/sec-2.5mm/sec. As the consumable rotation rate and the traveling rate increased, the coating efficiency tended to decrease. On the other hand, as the feeding rate increased, the coating efficiency appeared to be increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.185-188
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• 2001

Chemical mechanical polishing(CMP) process is widely used for global planarization of inter-metal dielectric (IMD) layer and inter-layer dielectric (ILD) for deep sub-micron technology. However, as the IMD and ILD layer gets thinner, defects such as micro-scratch lead to severe circuit failure, which affect yield. In this paper, for the improvement of CMP Process, deionized water (DIW) pressure, purified $N_2$ (P$N_2$) gas, slurry filter and high spray bar were installed. Our experimental results show that DIW pressure and P$N_2$ gas factors were not related with removal rate, but edge hot-spot of patterned wafer had a serious relation. Also, the filter installation in CMP polisher could reduce defects after CMP process, it is shown that slurry filter plays an important role in determining consumable pad lifetime. The filter lifetime is dominated by the defects. However, the slurry filter is impossible to prevent defect-causing particles perfectly. Thus, we suggest that it is necessary to install the high spray bar of de-ionized water (DIW) with high pressure, to overcome the weak-point of slurry filter. Finally, we could expect the improvements of throughput, yield and stability in the ULSI fabrication process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.568-574
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• 2000

We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.

• The Journal of Economics, Marketing and Management
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• v.10 no.2
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• pp.1-13
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• 2022

Purpose: The findings are expected to be used as basic data for policy establishment for systematic support and upbringing of small and medium-sized suppliers through the current status and characteristics of the industrial structure of the MRO consumable materials industry as a whole and the market trend. Research design, data, and methodology: This survey is conducted in 2019 mainly for companies that operate consumable materials delivery business, and the survey size is about 25,000 in advance (selected) and about 2,000 in the main survey. Using cluster analysis and multidimensional scaling, we derive the visualization of the homogeneous grouping of cases and the relationship structure between them. Results: Based on the attributes of reason for not having an online trading system, it is classified into three and four clusters for industry and company size, respectively, and the feature and pattern of each individual can be are relatively evaluated and visualized. Conclusions: Small and medium-sized consumable material suppliers specialize in products rather than fierce pricing strategies or external expansion strategies and it is more effective to establish a plan to promote the growth of both large and small enterprises through cooperation with large corporations.

• Journal of Welding and Joining
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• v.20 no.3
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• pp.3-8
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• 2002

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.235-239
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• 2001

In recent years, as Chemical Mechanical Planarization(CMP) has been routinely utilized in integrated circuit(IC) fabrication, the consumption of slurry, main consumable in a CMP process, is greatly increased. Thus the reprocess of CMP slurries has been actively considered in the industry to reduce cost-of-consumable (COC). The main purpose of this study was to recycle the used oxide slurry using filters as a new method. As a result, Ultra Fine(UF) Filter could distinguish silica from the used oxide slurry and Reverse Osmosis(RO) Filter could distinguish Deionized(DI) Water and chemistry from chemistry solution. The tetraethylorthosilicate removal rate was almost the same as the number of recycle polishing was increased, when it was modified by slightly adding new SS-12 slurry. The microscratch didnt found as the number of recycle polishing was increased.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.21 no.48
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• pp.113-122
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• 1998

In this paper we consider the CSP requirements determination problem of new equipment(machine) system. For the newly procured equipment systems, mathematical analyses are made for the system which is constructed with the consumable parts to derive the associated CSP requirement determination model in mathematical expression. Based on these analyses, a mathematical model is derived for making an optimal CSP requirement determination subject to tile constraint of satisfying any given operational availability limitation. We assume that the failure of a part follows a Poisson process. Firstly, the operational availability concept in CSP is defined and the relation between the general system availability and the operational availability is established. Secondly, the problem is formulated as the cost minimization problem that should satisfy the operational availability limitation, and then, using the generalized Lagrange multipliers method, the optimal solution procedure is derived.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.23 no.59
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• pp.53-67
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• 2000

In this paper we consider the CSP requirements determination problem of new equipment(machine) system. For the newly procured equipment systems, mathematical analyses are made for the system which is constructed with the consumable parts and the repairable parts to derive the associated CSP requirement determination model in mathematical expression. Based on these analyses, a mathematical model Is derived for making an optimal CSP requirement determination subject to the constraint of satisfying any given operational availability limitation. We assume that the failure of a part follows a Poisson process and the repair time has an exponential distribution. Firstly, the operational availability concept in CSP is defined and the relation between the general system availability and the operational availability is established. Secondly, the problem is formulated as the cost minimization problem that should satisfy the operational availability limitation, and then, using the generalized Lagrange multipliers method, the optimal solution procedure Is derived.