• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1908-1912
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• 2008

Conductive polymers, prepared by mixing electrically conductive fillers with a suitable polymeric formulation, are widely used in applications such as interconnecting materials for high density electronic packaging. However, resins of conductive pastes used as binders and vehicles are generally nonconductive, so that they may prevent the electrical contact between conductive fillers and reduce electron transmission. In this study, we improved conductivity of silver paste by the incorporation of cabon nanotubes. It is important to achieve homogeneous dispersion of CNTs to act as reinforcements efficiently in matrix. We carried out acid treatment on nanotubes for their homogeneous dispersion in silver/conducting polymer matrix. The dispersion states of nanotubes were characterized by raman spectra and filed emission scanning electron microscope. The electrical resistivity of CNTs incorporated silver paste was also measured by 4-point probe method.

• Korean Journal of Metals and Materials
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• v.46 no.8
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• pp.516-523
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• 2008

The effect of glass-frit size on microstructural evolution and electrical resistance of conductive silver paste was investigated. Silver paste was prepared by mixing 70 wt% commercial silver powder with $1.6{\mu}m$, 3 wt% Bi based glass-frit and 27 wt% organic vehicle. Two different sizes of glass-frit were obtained by ball-milling of commercial glass-frit ($3{\mu}m$) for 3 and 5 days, which had an average particle size of 1.0 and $0.5{\mu}m$. The smaller glass-frit was melt at low sintered temperature and rapidly spread between the silver particles, which is induced the dense networking among silver particles and strong adhesiveness to $Al_2O_3$ substrate. The silver film with smaller glass-frit sintered at $500^{\circ}C$ showed the small pore size and low porosity resulting in low electrical resistivity of $4{\mu}{\Omega}cm$.

• Applied Chemistry for Engineering
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• v.29 no.6
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• pp.782-788
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• 2018

Submicron copper-silver core-shell (Cu@Ag) particles were synthesized using the sonochemical combined transmetallation reaction and the application to printed electronics as a low cost conductive paste was evaluated. $Cu_2O$ of the $Cu_2O/Cu$ composite used as a core in the reaction for the synthesis of core-shell was sonochemically reduced to Cu, and Cu atoms functioned as a reducer for silver ions in transmetallation to achieve the copper-silver core-shell structure. The characterization of submicron particles by TEM-EDS and TG-DSC confirmed the core-shell structure. Conductive pastes in which 70 wt% Cu@Ag was dispersed in solvents were prepared using a binder and wetting agents, and coated on the polyamide film using a screen-printing method. Printed paste films containing synthesized Cu@Ag particles with 8 at% and 16 at% Ag exhibited low resistivity of 96.2 and $38.4{\mu}{\Omega}cm$ after sintering at $180^{\circ}C$ in air, respectively.

• Journal of the Korean Graphic Arts Communication Society
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• v.29 no.2
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• Journal of the Korean Society for Heat Treatment
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• v.19 no.4
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• pp.219-224
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• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• Composites Research
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• v.17 no.5
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• pp.61-67
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• 2004

This paper reports the electrical conductivity and the stress-strain behavior of silver particle-filled silicone composite pastes for electromagnetic interference (EMI) shielding gasket materials. The percolation threshold (critical concentration) of the composite paste obtained by incorporating irregular sphere-shaped silver particles and room temperature vulcanizing (RTV) silicone resin was determined from the electrical conductivity result. At about 28 vol% Beading of untreated silver particles, the percolation phenomenon occurred and at this critical concentration, the volumetric resistivity, the tensile strength, and the elongation of the pastes were investigated. This work also suggests that the stress-strain characteristics of a composite paste filled with metal particles above the percolation threshold may be effectively improved by properly selecting a coupling agent.

• Proceedings of the Korean Printing Society Conference
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• 2007.11a
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• Korean Journal of Materials Research
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• v.29 no.1
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• Journal of Power System Engineering
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• v.22 no.1
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• pp.64-71
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• 2018

Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.11
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• pp.690-695
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• 2016

Induction cooktop has a great attention due to its safety, quick heating and cleanness compared to gas oven. However, the materials for induction cookware is limited to steel or stainless-steel which has the magnetic property. Recently, it has been tried to apply various porcelain to induction cookware after printing the silver layer on the bottom of cookware plates and co-firing at high temperature. Glass frits are added in the silver paste to improve an adhesion force between porcelain materials containers and transferred silver layer. The hybrid silver pastes for induction cookware requires the proper electrical resistance and the thermal conductivity with base plates. After sintering process at $800^{\circ}C$, a part of melted glass migrated to the porcelain and the rest of the glass frit was exposed to the surface. It was confirmed that most of the glass frit formed an adhesion layer between the porcelain and transferred silver layer that enhances the adhesion force.