• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1908-1912
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• 2008

Conductive polymers, prepared by mixing electrically conductive fillers with a suitable polymeric formulation, are widely used in applications such as interconnecting materials for high density electronic packaging. However, resins of conductive pastes used as binders and vehicles are generally nonconductive, so that they may prevent the electrical contact between conductive fillers and reduce electron transmission. In this study, we improved conductivity of silver paste by the incorporation of cabon nanotubes. It is important to achieve homogeneous dispersion of CNTs to act as reinforcements efficiently in matrix. We carried out acid treatment on nanotubes for their homogeneous dispersion in silver/conducting polymer matrix. The dispersion states of nanotubes were characterized by raman spectra and filed emission scanning electron microscope. The electrical resistivity of CNTs incorporated silver paste was also measured by 4-point probe method.

• 대한금속재료학회지
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• 제46권8호
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• pp.516-523
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• 2008

The effect of glass-frit size on microstructural evolution and electrical resistance of conductive silver paste was investigated. Silver paste was prepared by mixing 70 wt% commercial silver powder with $1.6{\mu}m$, 3 wt% Bi based glass-frit and 27 wt% organic vehicle. Two different sizes of glass-frit were obtained by ball-milling of commercial glass-frit ($3{\mu}m$) for 3 and 5 days, which had an average particle size of 1.0 and $0.5{\mu}m$. The smaller glass-frit was melt at low sintered temperature and rapidly spread between the silver particles, which is induced the dense networking among silver particles and strong adhesiveness to $Al_2O_3$ substrate. The silver film with smaller glass-frit sintered at $500^{\circ}C$ showed the small pore size and low porosity resulting in low electrical resistivity of $4{\mu}{\Omega}cm$.

• 공업화학
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• 제29권6호
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• pp.782-788
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• 2018

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 $Cu_2O/Cu$ 복합체의 $Cu_2O$는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70 wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 $180^{\circ}C$에서 소결한 후 각각 96.2와 $38.4{\mu}{\Omega}cm$의 낮은 비저항 값을 나타내었다.

• 한국인쇄학회지
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• 제29권2호
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• 열처리공학회지
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• 제19권4호
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• pp.219-224
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• 2006

Silver paste with low sintered temperature has been developed in order to apply electronic parts, such as bus electrode, address electrode in PDP (Plasma Display Panel) with large screen area. In this study, nano-sized silver particles with 10-30 nm were synthesized from silver nitrate ($AgNO_3$) solution by chemical reduction method and silver paste with low sintered temperature was prepared by mixing silver nanoparticles, conventional silver powder with the particle size 1.6 um and Pb-free frit. Conductive thick film from silver paste was fabricated by screen printing on alumina substrate. After firing at $540^{\circ}C$, the cross section and surface morphology of the thick films were analyzed by FE-SEM. Also, the sheet resistivity of the fired thick films was measured using the four-point technique.

• Composites Research
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• 제17권5호
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• pp.61-67
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• 2004

본 연구에서는 전자파 차폐용 도전성 개스킷 소재로 활용할 수 있는 은입자 충전 실리콘 복합 페이스트에 대한 전기전도성 및 응력-변형율 특성을 분석하였다. 불규칙한 구형의 은(Ag)입자와 상온습기경화형(RTV) 실리콘수지를 도입하여 복합 페이스트의 퍼콜레이션 농도(임계 농도)를 전기전도도 측정 결과로부터 결정하였다. 약 28%의 은입자 함량에서 퍼콜레이션 현상이 발생하였으며, 이 농도에서 급격한 감소를 보이는 은입자/실리콘 복합 페이스트의 체적 비저항, 인장강도 및 연신률의 특성 변화에 관하여 고찰하였다. 또한, 커플링제의 선택적 방법을 통해 퍼콜레이션 농도 이상으로 충전된 복합 페이스트의 응력-변형율 특성을 효과적으로 개선할 수 있음을 제시하여 주었다.

• 한국인쇄학회:학술대회논문집
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• 한국인쇄학회 2007년도 추계 학술논문 발표회
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• pp.59-64
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• 2007

We have manufactured low-curable silver pastes for gravure printing out of roll to roll printing process. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape, polyester resin, solvent and homogenized on a standard three-roller mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had good characteristics. With the manufactured paste in this study, RFID antenna circuit had flexible is manufactured and it had $10^{-4}{\sim}10^{-5}{\Omega}{\cdot}cm$.

• 한국재료학회지
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• 제29권1호
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• 동력기계공학회지
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• 제22권1호
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• pp.64-71
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• 2018

Currently, functional patterns are formed by screen printing on stretchable films, and they are applied to wearable and stretchable devices. In this study, three types of silver paste were prepared using three polyester binders with different Tg and molecular weights in order to impart elasticity to the conductive pattern itself. Rheological properties and DSC measurements were performed for each silver paste. Then, each silver paste was screen printing and cured by an IR dryer to evaluate adhesive strength, pencil hardness, resistance and surface shape change according to strain. As a result, it was found that the silver paste using a binder with a low Tg and a high molecular weight has the smallest resistance change depending on the strain. Namely, it was found that it is most preferable to use a binder with a low Tg and a high molecular weight as the stretchable electrode.

• 한국전기전자재료학회논문지
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• 제29권11호
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• pp.690-695
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• 2016

Induction cooktop has a great attention due to its safety, quick heating and cleanness compared to gas oven. However, the materials for induction cookware is limited to steel or stainless-steel which has the magnetic property. Recently, it has been tried to apply various porcelain to induction cookware after printing the silver layer on the bottom of cookware plates and co-firing at high temperature. Glass frits are added in the silver paste to improve an adhesion force between porcelain materials containers and transferred silver layer. The hybrid silver pastes for induction cookware requires the proper electrical resistance and the thermal conductivity with base plates. After sintering process at $800^{\circ}C$, a part of melted glass migrated to the porcelain and the rest of the glass frit was exposed to the surface. It was confirmed that most of the glass frit formed an adhesion layer between the porcelain and transferred silver layer that enhances the adhesion force.