• Journal of the Korean Society for Precision Engineering
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• v.17 no.6
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• pp.96-102
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• 2000

The finishing process for dies and molds is an important process because it has influence on final quality of products. And it is difficult to automatize finishing process so that the process has depended on expert's skill until now. However, recently a study on development of die automatic finishing machine has been progressed, and actually this machine is applied to fabrication of die. But the research about tooling system is not enough and finishing tool must have high machining efficiency and adaptability of curved surface. So, this study investigated the application of conductive elastic tool which is composed of metal-resin bonded pellet and elastic backing material. The metal-resin bonded pellet is used to finish the surface by conventional mechanical grinding or electro-chemial grinding method. And elastic backing material is used to follow the curved surface. So conductive elastic tool has long lifetime, uniform removal rate and adaptability of curved surface.

• Journal of the Korean Society of Safety
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• v.19 no.4 s.68
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• pp.80-85
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• 2004

Electromagnetic interference(EMI) shielding characteristics of composite filled with Cu flake and carbon brush powder as hybrid conductive filler and EAF slag have been studied. The coaxial transmission line method of ASTM D4935-99 was used to measure the EMI Shielding effectiveness of composites as formulation in frequency rage $100\~1,000MHz$ The SE also increases with the increase in flier loading. The hybrid filler filled composites show higher SE compared to that of only Cu flake. The correlation between SE and conductivity of the various composites is also discussed. The results indicate that the composites having higher filler loading$({\geq}40wt.\%)$ can be used for the purpose of safety materials to protect hazardous electromagnetic interference.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2011.05a
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• pp.39-40
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• 2011

The purpose of this study is to select a conductive resistor as high energy efficiency through analysis of the heating properties by induction heating. The result of this study, the heating properties is capable of weaken cementitious joint in 10~30 seconds when using the conductive resistor with wire mesh or punching metal. Although the steel is higher temperature than SUS304, SUS304's heating properties are more uniform.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.11
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• pp.993-998
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• 2014

Silver (Ag) grid patterned PET substrates were manufactured by thermal roll-imprinting methods. We coated highly conductive layer (HCL) as a supply electrode on the Ag grid patterned PET in the three kinds of conditions. One was no-HCL without conductive PEDOT:PSS on the Ag grid patterned PET substrate, another was thin-HCL coated with ~50 nm thickness of conductive PEDOT:PSS on the Ag grid PET, and the other was thick-HCL coated with ~95 nm thickness of conductive PEDOT:PSS. These three HCLs in order showed 73.8%, 71.9%, and 64.7% each in transmittance, while indicating $3.84{\Omega}/{\Box}$, $3.29{\Omega}/{\Box}$, and $2.65{\Omega}/{\Box}$ each in sheet resistance. Fabrication of organic solar cells (OSCs) with HCL Ag grid patterned PET substrates showed high power conversion efficiency (PCE) on the thin-HCL device. The thick-HCL device decreased efficiency due to low open circuit voltage ($V_{OC}$). And the Ag grid pattern device without HCL had the lowest energy efficiency caused by quite low short current density ($J_{SC}$).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.2
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• pp.137-141
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• 2015

The purpose of this study is examining thermal dissipation materials for the lighting and radiate efficiency improvement of 8W LED and confirming the properness of the thermal dissipation materials for LED heat sink. Solid Works flow simulation on 8W class COB was done based on the material characteristics of thermal conductive polymer materials. According to the result of simulation, Al had better thermal dissipation performance than PET. Highest temperature was $7.6^{\circ}C$ higher while lowest temperature was $7.8^{\circ}C$ lower. The test on the heat sinks made by the materials, highest temperature was $4.1^{\circ}C$ higher and lowest temperature was $3.9^{\circ}C$ lower. It is possible to confirm that Al heat sink has better thermal dissipation efficiency because it has better dispersion of heat generated at junction temperature and less heat cohesion. The weight of PET heat sink was reduced than Al heat sink by 46.9% by the density difference between Al and PET. In conclusion, thermal dissipation performance of thermal conductive polymer is lower than Al material however, it is possible to lighting heat sink because thermal conductive polymer has better formability, has lower specific weight and enables various design options.

• Polymer(Korea)
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• v.25 no.2
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• pp.293-301
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• 2001

Electrically conductive carbon fiber/high density polyethylene (CF/HDPE) composite films were fabricated by new method, so called electron-ion technology (EIT) and the effects of CF epoxy sizing on the volumetric resistivity. tensile strength and interphase properties of the films were investigated. While epoxy sizing increased conductivity of composite films resulting from enhanced tunneling effect it reduced interphase adhesion between CF and HDPE because polar epoxy sizing and nonpolar HDPE are incompatible. Consequently epoxy sized CF(CF(S)) caused significant reduction in the volumetric resisitivity and tensile strength of composite films when compared with unsized CF(CF(U)). Epoxy sizing reduced nucleating efficiency of CF(S), therefore CF(S)/HDPE composite films showed nonuniform transcrystalline layer when compared with CF(U)/HDPE composite films.

• Journal of Power Electronics
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• v.3 no.4
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• pp.239-248
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• 2003

This paper presents a novel prototype of three-phase voltage source type zero voltage soft-switching inverter with the auxiliary resonant snubbers suitable for high-power applications with IGBT power module packages in order to reduce their switching power losses as well as electromagnetic conductive and radiative noises. A proposed single inductor-assisted resonant AC link snubber circuit topology as one of some auxiliary resonant commutation snubbers developed previously to achieve the zero voltage soft-switching (ZVS) for the three-phase voltage source type sinewave PWM inverter operating under the instantaneous space voltage vector modulation is originally demonstrated as compared with the other types of resonant AC link snubber circuit topologies. In addition to this, its operation principle and unique features are described in this paper. Furthermore, the practical basic operating performances of the new conceptual instantaneous space voltage vector modulation resonant AC link snubber-assisted three-phase voltage source type soft-switching PWM inverter using IGBT power module packages are evaluated and discussed on the basis of switching voltage and current waveforms, output line to line voltage quality, power loss analysis, actual power conversion efficiency and electromagnetic conductive and radiative noises from an experimental point of view, comparing with those of conventional three-phase voltage source hard-switching PWM inverter using IGBT power modules.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.58 no.11
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• pp.2214-2218
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• 2009

Dye-sensitized solar cell (DSC) has been considered as a possible alternative to current silicon based p-n junction photovoltaic devices due to its advantages of high efficiency, simple fabrication process and low production cost. Numerous researches for high efficient DSC in the various fields are under way even now. Among them, the compact layer, which prevents the back electron transfer between transparent conductive oxides and the redox electrolyte, is fabricated by various methods such as a ZnO dip-coating, $TiCl_4$ dip-coating, and Ti sputtering. In this study, we tried to fabricate the $TiO_2$ compact layer by the spin-coating method using aqueous $TiCl_4$ solution. The effect of the spin-coating method was checked as compared with conventional dip-coating method. As a result, DSC with a spin-coated compact layer had 33.4% and 6% better efficiency than standard DSC and DSC with a dip-coated compact layer.

• Journal of Magnetics
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• v.18 no.1
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• pp.9-13
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• 2013

Shielding effects in conductive and magnetic materials were investigated as a function of properties, thickness and diameter. In this work, evaluations on passive conductive and magnetic shield specimens were achieved through experimentation set-up using 50 Hz single and three phase induction field sources. Analysis on material microstructure properties and characteristics of shielding specimens were performed with the use of vibrating sample magnetometer (VSM) and field emission scanning electron microscopy (FESEM). An induction field at $136{\mu}T$ of single phase system and $50{\mu}T$ of three phase systems were observed to the shield specimens with the thickness ranged of 0.2 mm to 0.4 mm. It is observed that shield specimen efficiency becomes inversely proportionate to the increment of induction fields. The decrease was attributed to the surface structure texture which relates to the crystallization and non-crystallization geometrical effects.

• Korean Journal of Materials Research
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• v.28 no.9
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• pp.528-533
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• 2018

In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.