• Title/Summary/Keyword: conduction model

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The Electrical Property of Polymer Matrix Composites Added Carbon Powder

  • Shin, Soon-Gi
    • Korean Journal of Materials Research
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    • v.25 no.12
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    • pp.678-682
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    • 2015
  • The electrical property of polymer matrix composites with added carbon powder is studied based on the temperature dependency of the conduction mechanism. The temperature coefficient of the resistance of the polymer matrix composites below the percolation threshold (x) changed from negative to positive at 0.20 < x < 0.21; this trend decreased with increasing of the percolation threshold. The temperature dependence of the electrical property(resistivity) of the polymer matrix composites below the percolation threshold can be explained by using a tunneling conduction model that incorporates the effect of the thermal expansion of the polymer matrix composites into the tunneling gap. The temperature coefficient of the resistance of the polymer matrix composites above the percolation threshold has a positive value; its absolute value increased with increasing volume fraction of carbon powder. By assuming that the electrical conduction through the percolating paths is a thermally activated process and by incorporating the effect of thermal expansion into the volume fraction of the carbon power, the temperature dependency of the resistivity above the percolation threshold can be well explained without violating the universal law of conductivity.

Forced Convection Heat Transfer in a Plate Fin With Transient Heat Conduction (과도열전도를 갖는 평판핀에서의 강제대류 열전달)

  • 조진호;이상균
    • Journal of the korean Society of Automotive Engineers
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    • v.9 no.4
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    • pp.69-76
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    • 1987
  • A conjugate conduction-convection analysis has been made for a plate fin which exchanges heat with its fluid environment by forced convection. The analysis is based on a one- dimensional model for the plate fin whereby the transient heat conduction equation for the fin is solved simultaneously with the conservation equations for mass, momentum, and energy in the fluid boundary layer adjacent to the fin. The forced convection heat transfer coefficient is not specified in advance but is one the results of the numerical solutions. Numerical results of the overall heat transfer rate, the local heat transfer coefficient, the local heat flux, the fin efficiency and the fin surface temperature distribution for Pr=0.7 are presented for a wide range of operating conditions.

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An Application of Time Discontinuous Finite Element Method for Heat Conduction Problems (열전도 방정식의 시간 불연속 유한요소법 적용)

  • Kim, Chi-Kyung
    • Journal of the Korean Society of Safety
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    • v.23 no.3
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    • pp.87-92
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    • 2008
  • A finite element method which is discontinuous in time is developed for the solution of the classical parabolic model of heat conduction problems. The approximations are continuous with respect to the space variables for each fixed time, but they admit discontinuities with respect to the time variable at each time step. The method is superior to other well-known approaches to these problems in that it allows a wider range of moving boundary value problems to be dealt with, such as are encountered in complex engineering operations like ground freezing. The method is applied to one-dimensional and two-dimensional heat conduction problems in this paper, although it could be extended to more higher dimensional problems. Several example problems are discussed and illustrated, and comparisons are made with analytical approaches where these can also be used.

Electrical Conduction Mechanism and Equivalent Circuit Analysis in $Alq_3$ based Organic Light Emitting Diode ($Alq_3$에 기초한 유기 발광 소자에서 전기전도특성과 등가회로분석)

  • Chung, Dong-Hoe;Shin, Cheol-Gi;Lee, Dong-Gyu;Lee, Joon-Ung;Lee, Suk-Jae;Lee, Won-Jae;Jang, Kyung-Wook;Kim, Tae-Wan
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.103-106
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    • 2004
  • We have studied a conduction mechanism and equivalent circuit analysis in $Alq_3$ based Organic Light Emitting Diode. The conduction mechanism in organic light emitting diode can be classified into three regions; ohmic region, space-charge-limited current (SCLC) region and trap-charge-limited current (TCLC) region depending on the region of applied voltage. Equivalent circuit model of organic light emitting diode can be established using a parallel combination of resistance $R_p$ and capacitance $C_p$ with a small series resistance $R_s$.

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Effect of the Temperature on Resistivity of Carbon Black-Polyethylene Composites Below and Above Percolation Threshold (Carbon Black-Polyethylene복합재료의 Percolation Threshold 전후 저항율에 미치는 온도의 영향)

  • Shin, Soon-Gi
    • Korean Journal of Materials Research
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    • v.19 no.12
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    • pp.644-648
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    • 2009
  • Temperature dependency of resistivity of the carbon black-polyethylene composites below and above percolation threshold is studied based on the electrical conduction mechanism. Temperature coefficient of resistance of the composites below percolation threshold changed from minus to plus, increasing volume fraction of carbon black; this trend decreased with increasing volume fraction of carbon black. The temperature dependence of resistivity of the composites below percolation threshold can be explained with a tunneling conduction model by incorporating the effect of thermal expansion of the composites into a tunneling gap. Temperature coefficient of resistance of the composites above percolation threshold was positive and its absolute value increased with increasing volume fraction of carbon black. By assuming that the electrical conduction through percolating paths is a thermally activated process and by incorporating the effect of thermal expansion into the volume fraction of carbon black, the temperature dependency of the resistivity above percolation threshold has been well explained without violating the universal law of conductivity. The apparent activation energy is estimated to be 0.14 eV.

Frost Behavior on a One-Dimensional Fin Considering Heat Conduction of Heat Exchanger Fins (열교환기 휜의 열전도를 고려한 1차원 휜에서의 착상 거동)

  • Kim, Jung-Soo;Kang, Soo-Jin;Lee, Kwan-Soo
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • v.20 no.11
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    • pp.727-732
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    • 2008
  • This paper presents a mathematical model to predict the behavior of frost formed on an one-dimensional fin of heat exchanger, considering fin heat conduction under frosting conditions. The computational domain consists of air-side, the frost layer, and fin region, and they are coupled to the frost layer. The frost behavior is more accurately predicted with fin heat conduction considered (Case A) than with constant fin surface temperature assumed (Case B). The results indicate that for Case B, the frost thickness and heat transfer are overpredicted in most regions of the fin, as compared with those for Case A. In addition, for Case A, the maximum frost thickness varies little with the fin length variations, and the extension of the fin length after 30mm contributes insignificantly to heat transfer.

Steady- and Transient-State Analyses of Fully Ceramic Microencapsulated Fuel with Randomly Dispersed Tristructural Isotropic Particles via Two-Temperature Homogenized Model-I: Theory and Method

  • Lee, Yoonhee;Cho, Bumhee;Cho, Nam Zin
    • Nuclear Engineering and Technology
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    • v.48 no.3
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    • pp.650-659
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    • 2016
  • As a type of accident-tolerant fuel, fully ceramic microencapsulated (FCM) fuel was proposed after the Fukushima accident in Japan. The FCM fuel consists of tristructural isotropic particles randomly dispersed in a silicon carbide (SiC) matrix. For a fuel element with such high heterogeneity, we have proposed a two-temperature homogenized model using the particle transport Monte Carlo method for the heat conduction problem. This model distinguishes between fuel-kernel and SiC matrix temperatures. Moreover, the obtained temperature profiles are more realistic than those of other models. In Part I of the paper, homogenized parameters for the FCM fuel in which tristructural isotropic particles are randomly dispersed in the fine lattice stochastic structure are obtained by (1) matching steady-state analytic solutions of the model with the results of particle transport Monte Carlo method for heat conduction problems, and (2) preserving total enthalpies in fuel kernels and SiC matrix. The homogenized parameters have two desirable properties: (1) they are insensitive to boundary conditions such as coolant bulk temperatures and thickness of cladding, and (2) they are independent of operating power density. By performing the Monte Carlo calculations with the temperature-dependent thermal properties of the constituent materials of the FCM fuel, temperature-dependent homogenized parameters are obtained.

Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer (대류와 전도 열전달을 이용한 전자부품의 냉각특성 수치해석)

  • Son, Young-Seok;Shin, Jee-Young
    • Proceedings of the KSME Conference
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    • 2001.06d
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    • pp.390-395
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    • 2001
  • Cooling characteristics using convection and conduction heat transfer in a parallel channel with extruding heat sources are studied numerically. A two-dimensional model has been developed for numerical prediction of transient, compressible, viscous, laminar flow, and conjugate heat transfer between parallel plates with uniform block heat sources. The finite volume method is used to solve this problem. The considered assembly consists of two channels formed by two covers and one PCB which has three uniform heat source blocks. Five different cooling methods are considered to find efficient cooling method in a given geometry and heat source. The velocity and temperature fields, local temperature distribution along surface of blocks, and the maximum temperature in each block are obtained.

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Transient heat transfer in thin films (초박막에서의 비정상 열전달)

  • Bai, C.H.;Chung, M.
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.1
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    • pp.1-11
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    • 1998
  • For the analysis of phonon heat transfer within short time and spatial scales, conventional macroscopic heat conduction equations with jump boundary conditions are tried and the results are compared to those of equation of phonon radiative transport(EPRT), which is one of microscopic transport equation. In transient state the macroscopic temperatures show far different behavior from EPRT. In steady state the hyperbolic temperatures with temperature jump at the wall from time relaxation model agrees well with EPRT temperatures. Since EPRT is also an approximate form of microscopic transport equation and there are no experimental results to verify the proposed model in this study, we can not conclude whether the approaching method from this study is valid or not. To the authors' knowledge, there are no experimental results available which can be used to test the validity of these models. Such an experiment, while difficult to conduct, would be invaluable.

The Analysis of Heat Transfer through the Multi-layered Wall of the Insulating Package

  • Choi, Seung-Jin
    • KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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    • v.12 no.1
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    • pp.45-53
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    • 2006
  • Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

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