• The Journal of Korean Institute of Communications and Information Sciences
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• v.35 no.12B
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• pp.1749-1757
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• 2010

This paper considers the cost minimization problem to satisfy QoS (Quality of Service) requirements for a given network, in particular when communication resources to each link can be additionally assigned. For the purpose of quantifying QoS requirements such as data transfer delay and packet loss, we introduce the cost function considering both the link utilization factor and the additionally assigned resource. To minimize this cost function, we firstly formulate a Basic Capacity Planning (BCP) problem, a special case of Network Utility Maximization (NUM). We show that the solution of this BCP problem cannot be optimal via a counter example. In this paper, we suggest the cross-layer design of both additionally assigned resource and routing path, whose initial values are set to the result of BCP problem. This cross-layer design is based on a heuristic approach which presents an effective way to plan how much communication resources should be added to support the QoS requirements in future. By simulation study, we investigate the convergence of the cost function in a more general network topology as well as in a given simple topology.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.24 no.9A
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• pp.1372-1382
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• 1999

The major source of errors in high-speed networks such as Broadband ISDN(B-lSDN) is buffer overflow during congested conditions. These congestion errors are the dominant sources of errors in 1high-speed networks and result in cell losses. Conventional communication protocols use error detection and retransmission to deal with lost packets and transmission errors. However, these conventional ARQ(Automatic Repeat Request) methods are not suitable for the high-speed networks since the transmission delay due to retransmissions becomes significantly large. As an alternative, we have presented a method to recover consecutive cell losses using forward error correction(FEC) in ATM(Asynchronous Transfer Mode)networks to reduce the problem. The performance estimation based on the cell discard process model has showed our method can reduce the cell loss rate substantially. Also, the performance estimations in ATM networks by interleaving and IP multicast service are discussed.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.11
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• pp.141-149
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• 2013

IETF 6LoWPAN standard technique has been studied in IoT environment to support the IPv6 packet communication. 6LoWPAN protocol for transmission of packets mainly in the AODV routing protocol and a variety of extended techniques have been investigated. In particular, consisting of nodes with limited resources in a network error occurs when the 6LoWPAN reliable data transfer and fast routing method is needed. To this end, in this paper, we propose resilient routing protocol and extension of IETF LOAD algorithm, for optimal recovery path, More specifically, the optimal recovery path setup algorithm, signal flow, and detailed protocols for the verification of the reliability of packet transmission mathematical model is presented. The proposed protocol techniques to analyze the performance of the NS-3 performance through the simulation results that is end-to-end delay, throughput, packet delivery fraction and control packet overhead demonstrated excellence in comparison with existing LOAD.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.39C no.11
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• pp.1159-1166
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• 2014

In this paper, a resource management scheme for enhancing the network connectivity and reliability in wireless USB system is proposed. Wireless USB protocol is suitable for the application that supports the real-time multimedia service in Ship Area Network since it supports high speed data transfer. However, the device's mobility is caused the dramatic change of link state and network topology, and is occurred the degradation of network performance. Therefore, a resource management scheme for wireless USB system is proposed in this paper. The proposed technique can intelligently treat the change of link state, and solve the degradation of network performance. The simulation results show that proposed protocol can enhance the throughput and delay performance by selecting relay device with better link state.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.14 no.2
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• pp.305-311
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• 2010

iATA (Internet Advanced Technology Attachment) is a block-level protocol developed to transfer ATA commands over TCP/IP network, as an alternative network storage solution to address insufficient storage problem in mobile devices. This paper employs RAID5 distributed storage servers concept into iATA, in which the idea behind is to combine several machines with relatively inexpensive disk drives into a server array that works as a single virtual storage device, thus increasing the reliability and speed of operations. In the case of one machine failed, the server array will not destroy immediately but able to function in a degradation mode. Meanwhile, information can be easily recovered by using boolean exclusive OR (XOR) logical function with the bit information on the remaining machines. We perform I/O measurement and benchmark tool result indicates that additional fault tolerance feature does not delay read/write operations with reasonable file size ranged in 4KB-2MB, yet higher data integrity objective is achieved.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.6 no.1
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• pp.55-61
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• 2002

Real-time Internet multi-media services requires fast data transmission, QoS and IP multicast. MARS is proposed to support IP multicast in the ATM Networks based on Internet, and RSVP is proposed to guarantee QoS in the Internet which is originally based on only best-effort service. In this paper, we propose two mechanisms to support IP multicast service involving QoS support over the ATM networks with MARS architecture based on multiple MCSs. In the first mechanism, when an ATM host requests joining into a specific multicast group, the MARS selects a proper MCS among the multiple MCSs to minimize the average time of transfer delay between the sender and the group members. In the second mechanism, when the RSVP reservation message from group member arrive at the MARS, the MARS which can process the RSVP reservation message select again the MCS with using the MCS management table. Finally, we recommend the mechanism to keep the QoS of Internet service and to reduce the processing-overhead between MARS and MCS.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.9
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• pp.3472-3480
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• 2010

The Clustering technology of Energy efficiency wireless sensor network gets the energy efficiency by reducing the number of communication between sensor nodes and sink node. In this paper, First analyzed on the clustering technique of the distributed clustering protocol routing scheme LEACH (Low Energy Adaptive Clustering Hierarchy) and HEED (Hybrid, Energy-Efficient Distributed Clustering Approach), and based on this, new energy-efficient clustering technique is proposed for the cause the maximum delay of dead nodes and to increase the lifetime of the network. In the proposed method, the cluster head is elect the optimal efficiency node based on the residual energy information of each member node and located information between sink node and cluster node, and elected a node in the cluster head since the data transfer process from the data been sent to the sink node to form a network by sending the energy consumption of individual nodes evenly to increase the network's entire life is the purpose of this study. To verify the performance of the proposed method through simulation and compared with existing clustering techniques. As a result, compared to the existing method of the network life cycle is approximately 5-10% improvement could be confirmed.

• THE INTERNATIONAL COMMERCE & LAW REVIEW
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• v.69
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• pp.107-126
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• 2016

The parties in International Sale of Goods including Korean Firms Should note ; The buyer must pay the price for the goods and take delivery of them as required by the contract and CISG. The obligations mentioned in Article 53 are primary obligations which are to be fulfilled in the normal performance of the contract. The buyer has to take delivery at the respective place within a reasonable period after this communication since he cannot be required to take delivery immediately. Refusing to take delivery in case of delay not constituting a ground for avoiding the contract makes no sense, since this would lead to even later delivery. The buyer's obligation to pay the price includes taking such steps and complying with such formalities as may be required under the contract or any laws and regulations to enable payment to be made. International sales contracts frequently prescribe that the buyer has to act in advance, that is before the seller starts the process of delivery. Such acts may be either advance payments or the procurement of securities for payment as letters of credit guarantees. On the other hand, The seller deliver the goods hand over any documents relating to them and transfer the property in the goods, as required by the contract and CISG. The seller must deliver goods which are of the quantity, quality and description required by the contract and which are contained or packaged in the manner required by the contract. Except where the parties have agreed otherwise, the goods do not conform with the contract unless they are fit for the purposes for which goods of the same description would ordinarily be used are fit for any particular purpose expressly or impliedly made known to the seller at the time of the conclusion of the contract, except where the circumstances show that the buyer did not rely, or that it was unreasonable for him to rely, on the seller's skill and judgement. The buyer may declare the contract avoided if the failure by the seller to perform any of his obligations under the contract or CISG amounts to a fundamental breach of contract. The seller may declare the contract avoided if the failure by the buyer to perform any of his obligations under the contract or CISG amounts to a fundamental breach of contract.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.18 no.1
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• pp.618-624
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• 2017

In Seoul and most metropolitan cities, urban trains are delayed due to high congestion during commute times. The delay effect of passengers boarding and disembarking is also significant. In this study, a wide passenger door system was developed as a way to improve the scheduled speed of urban trains by decreasing the passengers' flow time. The door size was defined experimentally to shorten the entrance time. The optimum door size was also determined to improve the stop precision performance of the train while considering the interference effect with peripheral devices. Because the change in door size changes the structural characteristics of the vehicle, the structural stability of a train was analyzed numerically. A prototype of the wide door system was made, and the proposed design was verified using functional and endurance tests. The systematic development process can be used as design data for door size definition and system production when applying a wide door to improve the scheduled speed.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.