• Journal of the Korean Crystal Growth and Crystal Technology
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• v.31 no.3
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• pp.116-126
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• 2021

Diesel particulate filter (DPF) is a typical application field of cordierite (Mg₂Al₄Si₅O₁₈) honeycomb. Green body for DPF honeycomb was extruded using slurry paste and sintered at the temperature range of 980~1450℃. Quantitative crystal phase analysis was carried out by using Rietveld refinement method for powder XRD data. In conjunction with the quantitative Rietveld analysis, SEM-EDS analysis was carried for the crystal phases (indialite, cordierite, cristobalite, alumina, spinel, mullite, pro-enstatite). After removing amorphous phase on the sintered surfaces by chemical etching method, the shape and composition of the crystal phases can be clearly identified by SEM-EDS method. By combining the Rietveld refinement method and SEM-EDS analysis, crystal phase evolution process in DPF cordierite ceramics could be clarified. In addition, the coefficient of thermal expansion (CTE) of the DPF honeycombs were measured and compared with the calculated CTEs based on the quantitative crystal phase analysis results.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.922-923
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• 2006

Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1245-1247
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• 2005

Glass frit was selected to be a $Bi_2O_3-RO-R_2O_3$ system as a sealing material to replace the current PbO system in PDP. Fillers such as a zircon, cordierite and ${\beta}-eucryptite$ were added for the control of thermal expansion coefficient (CTE), flowability and strength for sealing. At $450-500^{\circ}C$, reaction of frit and filler and interface were evaluated by a flow button test and SEM observation. The composite (frit and filler) showed CTE in the range of 70-83 x $10^{-7}/K$ and flowability of 14-20mm. It can be a candidate for the replacement of PbO system.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.2
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• pp.13-21
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• 1999

Flip chip assembly directly on organic boards offers miniaturization of package size as well as reduction in interconnection distances resulting in a high performance and cost-competitive Packaging method. This paper describes the investigation of alternative low cost flip-chip mounting processes using electroless Ni/Au bump and anisotropic conductive adhesives/films as an interconnection material on organic boards such as FR-4. As bumps for flip chip, electroless Ni/Au plating was performed and characterized in mechanical and metallurgical point of view. Effect of annealing on Ni bump characteristics informed that the formation of crystalline nickel with $Ni_3$P precipitation above $300^{\circ}C$ causes an increase of hardness and an increase of the intrinsic stress resulting in a reliability limitation. As an interconnection material, modified ACFs composed of nickel conductive fillers for electrical conductor and non-conductive inorganic fillers for modification of film properties such as coefficient of thermal expansion(CTE) and tensile strength were formulated for improved electrical and mechanical properties of ACF interconnection. The thermal fatigue life of ACA/F flip chip on organic board limited by the thermal expansion mismatch between the chip and the board could be increased by a modified ACA/F. Three ACF materials with different CTE values were prepared and bonded between Si chip and FR-4 board for the thermal strain measurement using moire interferometry. The thermal strain of ACF interconnection layer induced by temperature excursion of $80^{\circ}C$ was decreased with decreasing CTEs of ACF materials.

• Transactions of Materials Processing
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• v.33 no.3
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• pp.200-207
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• 2024

In this study, we developed a semi-analytical approach for the numerical analysis of residual stress in oxide scales formed on hot-rolled steels. The oxide scale, formed during the hot rolling process, experiences complex interactions due to thermal and mechanical influences, significantly affecting the material's integrity and performance. Our research focuses on integrating various stress components such as thermal stress, growth stress, and creep behavior to predict the residual stress within the oxide layer. The semi-analytical method combines analytical expressions for each stress component with numerical integration to account for their cumulative effects. Validation through instrumented indentation tests confirms the reliability of our model, which considers thermal expansion coefficient (CTE) differences, scale growth, and creep-induced stress relaxation. Our findings indicate that thermal stress resulting from CTE differences significantly impacts the overall residual stress, with growth stress contributing a compressive component during cooling, and creep behavior playing a minor role in stress relaxation. This comprehensive approach enhances the accuracy of residual stress prediction, facilitating the optimization of material design and processing conditions for hot-rolled steel products.

• Applied Chemistry for Engineering
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• v.22 no.6
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• pp.623-626
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• 2011

Various poly(amic acid)s were synthesized from PMDA/BPDA/p-PDA/ODA with different mole ratios and effectively converted into 4-component polyimide films by thermal imidization. The chemical structures and thermo-mechanical properties of polyimide films were examined using Fourier transform infrared spectroscopy (FT-IR), thermo-gravimetric analyzer (TGA), thermo-mechanical analyzer (TMA), dynamic mechanical analyzer (DMA) and universal tensile machine (UTM). The tensile strength, modulus, and thermal properties of polyimides films increased with the amount of rigid PMDA and p-PDA, while the elongation and moisture absorption of polyimide films increased with the amount of flexible BPDA and ODA. One of 4-component polyimide films exhibited a similar coefficient of thermal expansion (CTE) value to that of copper when it was composed of PMDA : BPDA : p-PDA : ODA with the ratio of 5 : 5 : 4 : 6. Thus, this polyimide film could be useful for a base film for flexible copper clad laminates (FCCL) of flexible printed circuit boards.

• Polymer(Korea)
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• v.36 no.6
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• pp.733-738
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• 2012

The effect of glass bead and glass fiber on the enhancement of dimensional stability in poly(ethylene naphthalate) (PEN) flexible substrate for photovoltaic devices has been studied. It was found that the coefficient of thermal expansion (CTE) and the optical transmittance decreased with increasing inorganic filler content. In addition to filler contents, the size and size distribution of fillers are the other important factors to improve CTE and optical transmittance of PEN film. Our results showed that the optimum filler content was found to be about 5 wt% to enhance the dimensional stability of PEN by more than 50% with maintaining the optical transmittance over 85% for the flexible substrate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.9
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• pp.571-576
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• 2015

In this study, we developed a lead-free $P_2O_5-V_2O_5-ZnO$ glass frit for sealing OLED using laser irradiation. The frit satisfied the characteristics required for laser sealing such as low glass transition temperature, low coefficient of thermal expansion (CTE), high water-resistance, and high absorption at the wavelength of the laser beam. Ceramic fillers were added to the glass frit in order to further reduce and match its CTE with that of the commercial glass substrate. The addition of Zirconium Tungsten Phosphate (ZWP) to the frit yielded the most desirable results, reducing the CTE to $45.4{\times}10^{-7}/^{\circ}C$, which is very close to that of the glass substrate ($44.0{\times}10^{-7}/^{\circ}C$). Successful formation of a solid sealing layer was observed by optical and scanning electron microscopy.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.4
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• pp.380-387
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• 2009

The reliability concerns of solder interconnections in flip chip PBGA packages are produced mainly by the mismatch of coefficient of thermal expansion(CTE) between the module and PCB. Finite element analysis has been employed extensively to simulate thermal loading for solder joint reliability and deformation of packages in electronic packages. The objective of this paper is to study the thermo-mechanical behavior of FC-PBGA package assemblies subjected to temperature change, with an emphasis on the effect of the finite element model, material models and temperature conditions. Numerical results are compared with the experimental results by using $moir{\acute{e}}$ interferometry. Result shows that the bending displacements of the chip calculated by the finite element analysis with viscoplastic material model is in good agreement with those by $moir{\acute{e}}$ inteferometry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.443-447
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• 2004

In this study, we investigated the necessity of encapsulation layer to maximize flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer han a significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that han a significant effect on internal thermal stress. To compare the magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.